• 설비공학논문집
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• 제18권8호
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• pp.649-655
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• 2006

The recent indoor air quality problem in a newly-built apartment house is resulted from the improvement of airtightness performance and the use of the building material contained harmful chemical substances. As a result, these cause indoor air quality gradually to become worse and the harmful effect on occupant health called Sick House Syndrome. The most effective solution to improve the indoor air quality is to encourage the use of green building material. However, if the house is built with general building material, ventilation with outdoor air is alternative to dilute the pollutant concentration. The purpose of this re-search is to find optimum ventilation time in a newly-built apartment house at which the ventilatoris installed. It is found that the HCHO and toluene concentrations are remarkably decreased with the elapse of ventilation time and the concentration reduction rate is increased with increment of air change rate after one hour after operating the ventilator.

• Design & Manufacturing
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• 제17권2호
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• pp.15-21
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• 2023

In this study, a diamond turning machine and a laser-assisted machining module were utilized for the complex combined cutting of aspheric shapes and fine patterns on the surface of high-hardness brittle material, silicon. The analysis of material's form accuracy and corrective machining was conducted based on key factors such as laser output, rotational speed, feed rate, and cutting depth to achieve form accuracy below 1 ㎛ and surface roughness below 0.1 ㎛. The cutting condition and corrective machining methods were investigated to achieve the desired form accuracy and surface roughness. The rotational speed of the spindle and the linear feed rate of the diamond turning machine were varied in five stages for the cutting condition test. Surface roughness and form accuracy were measured using both a contact surface profilometer and a non-contact surface profilometer. The experimental results revealed a tendency of improved surface roughness with increased rotational speed of the workpiece, and the best surface roughness and form accuracy were observed at a feed rate of 5 mm/min. Furthermore, based on the cutting condition experiments, corrective machining was performed. The experimental results demonstrated an improvement in form accuracy from 0.94 ㎛ to 0.31 ㎛ and a significant reduction in the average value of the surface roughness curve from 0.234 ㎛ to 0.061 ㎛. This research serves as a foundation for future studies focusing on the machinability in relation to laser output parameters.

• 한국정밀공학회지
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• 제21권12호
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• pp.21-28
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• 2004

In modem manufacturing industries such as the airplane and automobile, aluminum alloys which are remarkable in durability have been utilized effectively. High-speed machining technology for surface roughness quality of workpiece has been applied in these fields. Higher cutting speed and feedrates lead to a reduction of machining time and increase of surface quality. Furthermore, the reduction of time required for polishing or lapping of machined surfaces improves the production rate. Traditional milling process for high speed cutting can be machined with end mill tool. However, such processes are generally cost-expensive and have low material removal rate. Thus, in this paper, face milling cutter which gives high MRR has developed face milling cutter body for the high speed machining of light alloy to overcome the problems. Also vibration experiment to detect natural frequency in free state and frequency characteristics during machining are performed to escape resonance.

• 한국결정학회지
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• 제9권1호
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• pp.44-47
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• 1998

가정용 2.45GHz 마이크로파 오븐을 사용하여 A1 금속분말과 SiO2 분말간에 SHS방법에 의하여 산화/환원 반응을 통한 Al2O3 분말과 Si분말간의 복합체를 얻을 수 있었다. 분말간의 반응을 일으키기 위한 온도까지 승온시키기 위하여는 SiC 분말을 susceptor로 이용한 마이크로파 복합가열(Microwave Hybrid Heating)방법을 사용하여 분당 100℃의 승온 속도로 가열하였으며 반응은 850℃ 근처에서 일어났으며 가열 속도는 반응이 시작되면서 분당 200℃ 이상의 온도상승이 일어나면서 원하는 반응을 얻을 수 있었다.

• 한국의류산업학회지
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• 제10권2호
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• pp.242-248
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• 2008

This study was aimed to find whether the Chelidonium majus which grows naturally in Korean soil and has a various medical ingredient is valuable as a natural dyeing material and to examine the functionality of Chelidonium majus extract. As the test result of dyeing colorfastness, colorfastness to sunlight was 1st grade for all the dyed fabrics. The colorfastness to laundry for discoloration showed from 1st to 4th grade and that for discoloration showed from 4th to 5th grade through all the dyed fabrics. Colorfastness to perspiration, rubbing, and drycleaning showed from 4th to 5th grade through all the dyed fabrics. In the result of antibiosis test, the dyed cotton fabric showed the bacteria reduction rate of 99.0% for Staphylococcus aureus and Escherichia coli evenly when washed one, three, and five times, The dyed silk fabric, when washed one, three, and five times, showed the bacteria reduction rate of 99.0% for Staphylococcus aureus, but didn't showed the significant bacteria reduction. As the test result of sun protection test, in the case of the cotton fabric which was dyed but don't use mordant, after one-time washing, S.P.F.(Sun Protection Factor) showed 20.4, the interception rate of UV-A showed 94.3%, and that of UV-B showed 95.2%. After five-time washing, S.P.F. showed 14.3, the interception rate of UV-A showed 90.0%, and that of UV-B showed 93.2%. In the case of the silk fabric which was dyed but don't use mordant, after one time washing, S.P.F. showed 30.5, the interception rate of UV-A showed 95.9%, and that of UV-B showed 96.9%, after five-time washing, S.P.F. showed 31.0, the interception rate of UV-A showed 95.6%, and that of UV-B showed 96.7%.

• 한국환경농학회지
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• 제20권3호
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• pp.135-142
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• 2001

가정에서 발생되는 퇴비화 가능한 폐기물 중 종이류 및 골판지 등을 제외한 것을 퇴비화 용기에 투입하기 전에 주방용 야채 분쇄기로 잘게 분쇄한 것(Case III)과 가정에서 비용을 들이지 않고 간단하게 실행할 수 있는 방법인 손으로 대충 찢는 것(Case II)으로 퇴비화하면서 분해율과 생산된 퇴비의 이${\cdot}$화학성을 조사하였다. 퇴비화과정 중 퇴비화용기의 습윤 및 건조 상태 잔류 퇴비화물질의 양에 대한 회귀직선식들은 각각 $R^2$ 값이 0.95 및 0.90 이상으로 이들 식들을 이용한 잔류 퇴비화물질의 양에 대한 예측이 가능하였다. 하루 전체 퇴비화물질의 무게 감소율은 Case II와 III의 경우 각각 6.82% 및 6.93%이었으나 투입된 퇴비화 가능한 가정 폐기물만에 대한 하루 무게 감소율은 56.43% 및 53.30%로 하루 전체 퇴비화물질의 무게 감소율보다 대단히 높았다. 하루 전체 퇴비화물질의 분해 율은 Case II와 III의 경우 각각 8.81% 및 7.70%이었으나 투입된 퇴비화 가능한 가정 폐기물만에 대한 하루 분해율은 각각 19.26% 및 22.95%로 주방용 야채 분쇄기로 거의 죽 상태로 분쇄하였을 경우(Case III) 분해율이 약간 높았다. 생산된 퇴비 중 이${\cdot}$화학적 특성은 Case II와 III의 경우 예상된 바와 같이 큰 차이는 없었다.

• The Korean Journal of Ceramics
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• 제4권4호
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• pp.304-310
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• 1998

Carbothermal reduction has been one of the important processes for the production of ceramic raw materials such as silicon carbide, silicon nitride, boron carbide, etc. The process has also been one of several trials for the recovery of ZnO from ZnO-containing waste. It usually involves two consecutive steps: the evolution of Zn vapor and its oxidation with air. In this study a ZnO-containing raw material is reduced by carbon at $1250^{\circ}C$ and the evolved Zn vapor is oxidized with air, resulting in fine powders of ZnO. computer programs, THERMO and PYROSIM developed by MINTEK, are used to simulate the process thermodynamically and the results are compared with the experimental results. It is shown that the ZnO-containing raw material can be reduced and can form fine ZnO with the yield as high as 98.7% under a proper condition. Based on these results, a process is engineered for the production of ZnO in a rotary kiln at a rate of 3 tons/day. The produced ZnO powders show properties suitable to the usual applications in ceramic industries with a purity of > 95wt% and an average particle size of ∼3${\mu}m$.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 복식문화연구
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• 제16권3호
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• pp.461-474
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• 2008

The purpose of this study was to present a making method of jeans pattern with high fitness after deriving the appropriate shrinkage rate by material and washing process. Research Method of jeans pattern was presented after applying the optimized shrinkage rate. According to the result of the exterior evaluation of test jeans, all 6 jeans were rated high with scores close to 3.5. Following the evaluation of satisfaction of usage by physical movement, the highest ranking was in the order of walking with normal steps, back bending $90^{\circ}$, chair sitting, climbing stairs, and squatting. The shrinkage rate by physical area showed the highest score in the order of pants length, waist circumference, thigh circumference, knee circumference, hem circumference, hips circumference. In addition, the shrinkage rate was higher in warp direction than weft direction after washing finishing. As for the result of addition and reduction of pattern measurements by parts of jeans, waist circumference was $2.5{\sim}5.2cm$, hips circumference was $-1.8{\sim}2.8cm$, thigh circumference was $-1.3{\sim}2.0cm$ and knee circumference was $-1.0{\sim}1.7cm$. Also, hem circumference was $-1.0{\sim}1.8cm$ and pants length was $2.9{\sim}6.2cm$. That is, this results showed a wide range of addition and reduction according to material and washing finishing.