• 항공우주시스템공학회지
• /
• 제17권2호
• /
• pp.71-77
• /
• 2023

액상성형공정(LCM, Liquid Composite Molding) 은 복합재료 오토클레이브(Autoclave) 성형공정의 단점을 극복할 수 있는 탈 오토클레이브(OoA, Out of Autoclave) 공정의 하나로 매우 복잡한 형상이나 대형 구조물을 일체형으로 만들 수 있어 항공산업에서 큰 경쟁력을 가진 공법으로 알려져 있다. 이러한 장점 때문에 액상성형공정을 적용한 항공 부품제작 수요가 늘고 있으며 FAA에서는 액상성형공정을 적용한 복합재료에 대한 인증(Qualification) 방법을 제시한 바 있다. 국내에서도 액상성형공정 적용 복합재료에 대한 부품제작 수요 및 재료인증 수요가 꾸준히 제기되고 있다. 따라서 본 연구에서는 기존에 구축된 프리프레그 복합재료 인증방안 이외에 LCM 공정을 적용한 복합재료에 대한 인증방안을 수립하기 위한 연구를 진행하였다.

• 산업경영시스템학회지
• /
• 제40권3호
• /
• pp.1-6
• /
• 2017

Process capability is well known in quality control literatures. Process capability refers to the uniformity of the process. Obviously, the variability in the process is a measure of the uniformity of output. It is customary to take the 6-sigma spread in the distribution of the product quality characteristic as a measure of process capability. However there is no reference of process capability when maximum material condition is applied to datum and position tolerance in GD&T (Geometric Dimensioning and Tolerancing). If there is no material condition in datum and position tolerance, process capability can be calculated as usual. If there is a material condition in a feature control frame, bonus tolerance is permissible. Bonus tolerance is an additional tolerance for a geometric control. Whenever a geometric tolerance is applied to a feature of size, and it contains an maximum material condition (or least material condition) modifier in the tolerance portion of the feature control frame, a bonus tolerance is permissible. When the maximum material condition modifier is used in the tolerance portion of the feature control frame, it means that the stated tolerance applies when the feature of size is at its maximum material condition. When actual mating size of the feature of size departs from maximum material condition (towards least material condition), an increase in the stated tolerance-equal to the amount of the departure-is permitted. This increase, or extra tolerance, is called the bonus tolerance. Another type of bonus tolerance is datum shift. Datum shift is similar to bonus tolerance. Like bonus tolerance, datum shift is an additional tolerance that is available under certain conditions. Therefore we try to propose how to calculate process capability index of position tolerance when maximum material condition is applied to datum and position tolerance.

• 한국전기전자재료학회논문지
• /
• 제20권4호
• /
• pp.303-307
• /
• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• Tribology and Lubricants
• /
• 제32권2호
• /
• pp.56-60
• /
• 2016

Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

• 한국전기전자재료학회논문지
• /
• 제20권4호
• /
• pp.325-331
• /
• 2007

In this study, the inter-metal dielectric material of FSG was changed by low-k material in $0.13{\mu}m$ foundry-compatible technology (FCT) device process based on fluorinated silicate glass (FSG). Black diamond (BD) was used as a low-k material with a dielectric constant of 2.95 for optimization and yield-improvement of the low-k based device process. For yield-improvement in low-k based device process, some problems such as photoresist (PR) poisoning, damage of low-k in etch/ash/cleaning process, and chemical mechanical planarization (CMP) delamination must be solved. The PR poisoning was not observed in BD based device. The pressure in CMP process decreased to 2.8 psi to remove the CMP delamination for Cu-CMP and USG-CMP. $H_2O$ ashing process was selected instead of $O_2$ ashing process due to the lowest condition of low-k damage. NE14 cleaning after ashing process lot the removal of organic residues in vias and trenches was employed for wet process instead of dilute HF (DHF) process. The similar-state of SRAM yield was obtained in Cu/low-k process compared with the conventional $0.13{\mu}m$ FCT device by the optimization of these process conditions.

• 소성∙가공
• /
• 제27권1호
• /
• pp.60-65
• /
• 2018

• 항공우주시스템공학회지
• /
• 제8권4호
• /
• pp.39-43
• /
• 2014

This paper examines the statistical process that should be performed with caution in the composite material qualification and equivalency process, and describes statistically significant considerations on outlier finding and handling process, data pooling through normalization process, review for data distributions and design allowables determination process for structural analysis. Based on these considerations, the need for guidance on statistical process for aircraft manufacturers who use the composite material properties database are proposed.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2008년도 추계학술대회 논문집
• /
• pp.234-237
• /
• 2008

It was reported that the semi-solid forming process has many advantages over the conventional forming process, such as a long die life, good mechanical properties and energy savings. It is very important, however, to control liquid segregation to gain mechanical property improvement of materials. During forming process, Rheology material has complex characteristics, thixotropic behavior. Also, difference of velocity between solid and liquid in the semi-solid state material makes a liquid segregation and specific stress variation. Therefore, it is difficult for a numerical simulation of the rheology Process to be Performed. General Plastic or fluid dynamic analysis is not suitable for the behavior of rheology material. The behavior and stress of solid particle in the rheology material during forging process is affected by viscosity, temperature and solid fraction. In this study, compression experiments of aluminum alloy were performed under each other tool shape. In addition, the dynamics behavior compare with Okano equation to Power law model which is viscosity equation.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.27-27
• /
• 2003

• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2004년도 하계학술연구발표회 논문개요집
• /
• pp.82-83
• /
• 2004