• Journal of Aerospace System Engineering
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• v.17 no.2
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• pp.71-77
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• 2023

Liquid Composite Molding (LCM), an Out of Autoclave (OoA) composite manufacturing process, has big advantages when making large and complex structures of airplanes. Since the importance of LCM process is increasing, FAA has suggested recommended guidance and criteria for the development of material and process specifications for LCM materials and process. The importance of LCM process is also raised by domestic composite material suppliers and OEM. This study suggested structures of material specifications and process specification of LCM materials. Material qualification method for LCM process and material was also developed in this study.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.40 no.3
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• pp.1-6
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• 2017

Process capability is well known in quality control literatures. Process capability refers to the uniformity of the process. Obviously, the variability in the process is a measure of the uniformity of output. It is customary to take the 6-sigma spread in the distribution of the product quality characteristic as a measure of process capability. However there is no reference of process capability when maximum material condition is applied to datum and position tolerance in GD&T (Geometric Dimensioning and Tolerancing). If there is no material condition in datum and position tolerance, process capability can be calculated as usual. If there is a material condition in a feature control frame, bonus tolerance is permissible. Bonus tolerance is an additional tolerance for a geometric control. Whenever a geometric tolerance is applied to a feature of size, and it contains an maximum material condition (or least material condition) modifier in the tolerance portion of the feature control frame, a bonus tolerance is permissible. When the maximum material condition modifier is used in the tolerance portion of the feature control frame, it means that the stated tolerance applies when the feature of size is at its maximum material condition. When actual mating size of the feature of size departs from maximum material condition (towards least material condition), an increase in the stated tolerance-equal to the amount of the departure-is permitted. This increase, or extra tolerance, is called the bonus tolerance. Another type of bonus tolerance is datum shift. Datum shift is similar to bonus tolerance. Like bonus tolerance, datum shift is an additional tolerance that is available under certain conditions. Therefore we try to propose how to calculate process capability index of position tolerance when maximum material condition is applied to datum and position tolerance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• Tribology and Lubricants
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• v.32 no.2
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• pp.56-60
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• 2016

Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.325-331
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• 2007

In this study, the inter-metal dielectric material of FSG was changed by low-k material in $0.13{\mu}m$ foundry-compatible technology (FCT) device process based on fluorinated silicate glass (FSG). Black diamond (BD) was used as a low-k material with a dielectric constant of 2.95 for optimization and yield-improvement of the low-k based device process. For yield-improvement in low-k based device process, some problems such as photoresist (PR) poisoning, damage of low-k in etch/ash/cleaning process, and chemical mechanical planarization (CMP) delamination must be solved. The PR poisoning was not observed in BD based device. The pressure in CMP process decreased to 2.8 psi to remove the CMP delamination for Cu-CMP and USG-CMP. $H_2O$ ashing process was selected instead of $O_2$ ashing process due to the lowest condition of low-k damage. NE14 cleaning after ashing process lot the removal of organic residues in vias and trenches was employed for wet process instead of dilute HF (DHF) process. The similar-state of SRAM yield was obtained in Cu/low-k process compared with the conventional $0.13{\mu}m$ FCT device by the optimization of these process conditions.

• Transactions of Materials Processing
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• v.27 no.1
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• pp.60-65
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• 2018

• Journal of Aerospace System Engineering
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• v.8 no.4
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• pp.39-43
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• 2014

This paper examines the statistical process that should be performed with caution in the composite material qualification and equivalency process, and describes statistically significant considerations on outlier finding and handling process, data pooling through normalization process, review for data distributions and design allowables determination process for structural analysis. Based on these considerations, the need for guidance on statistical process for aircraft manufacturers who use the composite material properties database are proposed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.234-237
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• 2008

It was reported that the semi-solid forming process has many advantages over the conventional forming process, such as a long die life, good mechanical properties and energy savings. It is very important, however, to control liquid segregation to gain mechanical property improvement of materials. During forming process, Rheology material has complex characteristics, thixotropic behavior. Also, difference of velocity between solid and liquid in the semi-solid state material makes a liquid segregation and specific stress variation. Therefore, it is difficult for a numerical simulation of the rheology Process to be Performed. General Plastic or fluid dynamic analysis is not suitable for the behavior of rheology material. The behavior and stress of solid particle in the rheology material during forging process is affected by viscosity, temperature and solid fraction. In this study, compression experiments of aluminum alloy were performed under each other tool shape. In addition, the dynamics behavior compare with Okano equation to Power law model which is viscosity equation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.27-27
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• 2003

• Proceedings of the Korean Magnestics Society Conference
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• 2004.06a
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• pp.82-83
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• 2004