• 제목/요약/키워드: Matched Die

검색결과 15건 처리시간 0.02초

금속 판재 성형 기술의 진보 (Progress in Sheet Metal Forming Technology)

  • 박종우
    • 소성∙가공
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    • 제11권3호
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    • pp.223-230
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    • 2002
  • Matched die forming technology has been used widely as a sheet metal forming method for a long time. This conventional method, however, needs a high cost and long delivery time to prepare a set of matched dies or, in many cases, several sets of dies. For more than ten years, some alternative methods using single die or non-matched dies have been developed and applied practically in various fields of industry. Elasto-forming, fluid forming, hydro-forming, and blow forming are some examples of these new methods. Recently, a dieless sheet forming technology using a reconfigurable matrix of punch elements has been developed, and started to be used in some industries such as aircraft and railroads. A new concept of dieless forming technology has also been proposed to overcome the drawback of the conventional dieless forming technology.

GaN HEMT Die를 이용한 S-대역 내부 정합형 고효율 고출력 증폭기 (S-Band Internally-Matched High Efficiency and High Power Amplifier Using GaN HEMT Die)

  • 김상훈;최진주;최길웅;김형주
    • 한국전자파학회논문지
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    • 제26권6호
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    • pp.540-545
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    • 2015
  • 본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) die를 이용하여 S-대역 내부 정합형 전력 증폭기 설계, 제작 그리고 실험 결과에 대해 기술하였다. S-대역 내부 정합형 전력 증폭기를 설계하기 위하여 고유전율을 가지는 기판과 알루미나 기판을 이용하여 입/출력단 정합 회로를 설계 및 제작하였다. 측정 결과로는 펄스 모드로 동작시켰을 때 3 GHz에서 55.4 dBm의 출력 전력, 78 % 드레인 효율 그리고 11 dB의 전력 이득을 얻었다.

박판용 가변성형공정의 수치적 연구 (Numerical Study on Flexible Forming Process for Sheet Metal)

  • 허성찬;서영호;박중원;구태완;송우진;김정;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 추계학술대회 논문집
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    • pp.281-284
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    • 2009
  • Flexible forming process for sheet metal using reconfigurable die is introduced based on numerical simulation. Numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. Elastic cushion which has high resilience behavior from excessive deformation are inserted between forming punches and blank material for smoothing the forming surface which has discrete due to characteristics of the flexile die. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation. Formability in view of surface defect such as onset of dimple is compared with regard to various punch sizes. Consequently, it is confirmed that the flexible forming process for sheet material has appropriate capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming process.

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표면실장용 IC 패키지 솔더접합부의 열피로 수명 예측 (A prediction of the thermal fatigue life of solder joint in IC package for surface mount)

  • 윤준호;신영의
    • Journal of Welding and Joining
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    • 제16권4호
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    • pp.92-97
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    • 1998
  • Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

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가변금형의 박판 성형공정 적용 연구 (Study on Application of Flexible Die to Sheet Metal Forming Process)

  • 허성찬;서영호;구태완;김정;강범수
    • 소성∙가공
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    • 제18권7호
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    • pp.556-564
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    • 2009
  • Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

금형분야 국가기술자격체계 구축방안 (A Study on Building of National Technical Qualification Framework;Focusing on the Die & Mold Field)

  • 박준석;구자길;편영식
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2007년도 춘계학술발표논문집
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    • pp.315-318
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    • 2007
  • 이 연구의 목적은 금형분야의 국가기술자격 운영현황을 검토하고, 금형분야 기능장, 기사, 산업기사, 기능사 자격의 새로운 발전방향을 제시하는데 있다. 금형분야 자격이 발전되기 위해서는 금형분야 자격에 대한 자격구조 분석을 실시하여 산업현장의 기술변화 내용을 수용할 수 있어야 한다. 따라서 이 연구에서는 금형분야 국가기술자격 종목을 대상으로 노동시장 수요에 맞는 역할 모형 설정 원칙을 기본으로 하여 자격의 구조를 분석하고, 자격에 대한 구체적인 신설${\cdot}$통합${\cdot}$폐지${\cdot}$출제기준 수정의 준거를 마련하여 산업현장전문가 표적집단면접조사(Focus Group Interview)를 통해 자격종목의 재정비 방안을 제시하였다.

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탄소중합체를 이용한 다점 박판 성형 (Multi-Point Sheet Forming Using Elastomer)

  • 박종우
    • 소성∙가공
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    • 제13권2호
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    • pp.129-136
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    • 2004
  • Recently, instead of a matched die forming method requiring a high cost and long delivery term, a multi-point dieless forming method using a pair of matrix type punch array as flexible dies has been developed. Since the conventional multi-point dieless forming method has some disadvantages of difficulty in precise punch control and high-cost of equipment, a new concept of multi-point dieless forming method combined with an elasto-forming method has been suggested in this study. For optimal selection of elastomers, compression tests of rubbers, polyethylene and foams were carried out together with FEM analysis of the deformation behavior during sheet forming process using a rigid punch and elastomers. Compressive strain was concentrated on the upper central area of the elastomer under the punch, and the rubber exhibited higher concentration of the compressive strain than foams. Two-dimensional curved surface was formed successfully by the multi-point elasto-dieless forming method using an optimal combination of rubber and foam materials.

탄소중합체를 이용한 다점 박판 성형 (Multi-point sheet forming using elastomer)

  • 박종우
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 제4회 박판성형 심포지엄
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    • pp.21-28
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    • 2003
  • Recently, instead of a matched die forming method requiring a high cost and long deliverly ten a multi-point dieless forming method using a pair of matrix type punch array as flexible dies has been developed. As this multi-point dieless forming method has some disadvantage of difficulty in precise punch control and high-cost of equipment, a new concept of multi-point dieless forming method combined with elastomer forming was suggested in this study. For optimal selection of elastomers, compression tests of rubbers, polyethylene and foams were carried out together with FEM analysis of the deformation behavior during sheet forming process using a rigid punch and elastomers. Compressive strain was concentrated on the upper central area of the elastomer under the punch, and the rubber exhibited higher concentration of the compressive strain than foams. Two-dimensional curved surface was formed successfully by the multi-point elasto-dieless forming method using an optimal combination of a rubber and foam.

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컴퓨터 시뮬레이션(PC-CRASH)을 이용한 터널 내 피추돌 차량의 충돌 속도 추정에 관한 연구 (A study on the estimation of impact velocity of crashed vehicles in tunnel using computer simulation(PC-CRASH))

  • 한창평;최홍주
    • Design & Manufacturing
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    • 제14권4호
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    • pp.40-45
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    • 2020
  • In a vehicle-to-vehicle accident, the impact posture, braking status, final stopping position, collision point and collision speed are important factors for accident reconstruction. In particular, the speed of collision is the most important issue. In this study, the collision speed and the final stopping position in the tunnel were estimated using PC-CRASH, a vehicle crash analysis program used for traffic accident analysis, and the final stopping position of the simulation and the final stopping position of the traffic accident report were compared. When the Pride speed was 0km/h or 30km/h and the Sorento speed was 100m/h, the simulation results and reports matched the final stopping positions and posture of the two vehicles. As a result of the simulation, it can be estimated that Pride was collided in an almost stationary state.

A Rail-to-Rail Input 12b 2 MS/s 0.18 μm CMOS Cyclic ADC for Touch Screen Applications

  • Choi, Hee-Cheol;Ahn, Gil-Cho;Choi, Joong-Ho;Lee, Seung-Hoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제9권3호
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    • pp.160-165
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    • 2009
  • A 12b 2 MS/s cyclic ADC processing 3.3 Vpp single-ended rail-to-rail input signals is presented. The proposed ADC demonstrates an offset voltage less than 1 mV without well-known calibration and trimming techniques although power supplies are directly employed as voltage references. The SHA-free input sampling scheme and the two-stage switched op-amp discussed in this work reduce power dissipation, while the comparators based on capacitor-divided voltage references show a matched full-scale performance between two flash sub ADCs. The prototype ADC in a $0.18{\mu}m$ 1P6M CMOS demonstrates the effective number of bits of 11.48 for a 100 kHz full-scale input at 2 MS/s. The ADC with an active die area of $0.12\;mm^2$ consumes 3.6 m W at 2 MS/s and 3.3 V (analog)/1.8 V (digital).