• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.243-244
• /
• 2013

• Journal of the Korean Graphic Arts Communication Society
• /
• v.26 no.1
• /
• pp.73-85
• /
• 2008

We have manufactured a photoresist which has excellent dispersity and good applying property due to 330cps of viscosity for environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with CRT light source. Then it was developed by air spray with $1.7kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were worse than those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making was 0.5 mm since the exposure system for maskless plate making has weak light intensity and the diffusion of light. But we could obtain maskless screen plate which has sharp edges of line image and confirm a possibility of dry development process by air spray method.

• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.6
• /
• pp.36-40
• /
• 2009

Development of maskless lithography techniques can provide a potential solution for the photomask cost issue. Furthermore, it could open a market for small scale manufacturing applications. Since femtosecond lasers have been found suitable for processing of a wide range of materials with sub-micrometer resolution, it is attractive to use this technique for maskless lithography. As a femtosecond laser has recently been developed, both of high power and high photon density are easily obtained. The high photon density results in photopolymerization of photoresist whose absorption spectrum is shorter than that of the femtosecond laser. The maskless lithography using the two-photon absorption (TPA) makes micro structures. In this paper, we present a femtosecond laser direct write lithography for submicron PR patterning, which show great potential for future application.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2009.10a
• /
• pp.421-426
• /
• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.19 no.12
• /
• pp.1322-1328
• /
• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.26 no.2
• /
• pp.55-64
• /
• 2008

We designed a UV-LED exposure system which has 365nm dominant wavelength due to the environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with UV-LED light source. Then it was developed by air spray with $1.7\;kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were excellent as those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making. was $100{\mu}m$, so we could establish the possibility of environment-friendly maskless screen plate making technology. But the sharpness of the patterns were ${\pm}40{\mu}m$ since the exposure system for maskless plate making has weak light intensity and the diffusion of light.

• Journal of the Optical Society of Korea
• /
• v.14 no.3
• /
• pp.266-276
• /
• 2010

In the present study, an optical system is proposed for maskless lithography using a digital micromirror device (DMD). The system consists of an illumination optical system, a DMD, and a projection lens system. The illumination optical system, developed for 95% uniformity, is composed of fly's eye lens plates, a 405 nm narrow band pass filter (NBPF), condensing lenses, a field lens and a 250W halogen lamp. The projection lens system, composed of 8 optical elements, is developed for 4 ${\mu}m$ resolution. The proposed system plays a role of an optical engine for PCB and/or FPD maskless lithography. Furthermore, many problems arising from the presence of masks in a conventional lithography system, such as expense and time in fabricating the masks, contamination by masks, disposal of masks, and the alignment of masks, may be solved by the proposed system. The proposed system is verified by lithography experiments which produce a line pattern with the resolution of 4 ${\mu}m$ line width.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.5
• /
• pp.674-680
• /
• 2017

Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.

• 제어로봇시스템학회:학술대회논문집
• /
• 2005.06a
• /
• pp.389-392
• /
• 2005

In the maskless photolithography based on the Digital Micromirror Device (DMD) by Texas Instruments Inc. (TI), the micromirror array works as a virtual photomask to write patterns directly onto Flat Panel Display (FPD) at high speed with low cost. However, it is neither simple to generate region-based patterns for the micromirror array nor easy to deliver sequences of patterns for the micromirror controller. Moreover, the quality of lithography yields the precise synchronization between generating sequence of patterns and irradiation rate off micromirrors. In this study, the region-based pattern generating system for maskless photolithography is devised. To verify salient features of devised functionalities, the prototype system is implemented and the system is evaluated with actual DMD based photolithography. The results show that proposed pattern generating method is proper and reliable. Moreover, the devised region-based pattern generating system is robust and precise enough to handle any possible user specified mandate and to achieve the quality of photolithography required by FPD manufacturer.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.4
• /
• pp.65-68
• /
• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.