• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 2000년도 춘계공동학술대회 논문집
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• pp.625-629
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• 2000

The objective of ECMS(Environmentally Conscious Manufacturing Systems) is to consider environmental effects through the entire product life cycle from product development stage to design, manufacturing, supplying, using and disposing stage. Recently, environment-oriented recycling, reusing and manufacturing technologies have been researched actively in every engineering fields. In the field of chemical engineering, HHS (Health Hazard Scores) which classifies and analyzes hazardous materials in production processes has been presented. Metal cutting processes also have a lot of harmful factors, and especially hazardous components in cutting fluids have been known to have a bad effect on workers and working area. However, research works such as HHS have been little accomplished in metal cutting processes. In this research, a environmentally conscious machining process is presented by classifying hazardous components in cutting fluids, by using LCA(Life Cycle Assessments) and HHS method, and by evaluating environmental effects from cutting fluids.

• 경영과학
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• 제12권2호
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• pp.165-188
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• 1995

The conversion processes from traditional job shops to cellular manufacturing systems can be viewed as an aggregation of cause-and-effect relationships among many strategic, managerial, and technical variables. Therefore, management needs to fully understand these interacting variables and possible relationships between the variables to successfully convert their plants to cellular manufacturing systems. The purpose of this study is to assist such management's needs in part. The objectives of this research are i) investigating contingency variables that may affect the conversion processes and outcomes to cellular manufacturing systems and ii) examining relationships between the variables and the conversion processes and outcomes. In this paper, particularly three categories of variables are examined: product, process routing, and process technology / facilities characteristics. Literature review and the mail survey method are used. The results are compared and synthesized with the findings of previous studies for useful discussions. Some previous arguments and propositions are empirically supported.

• 한국공작기계학회논문집
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• 제11권4호
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• pp.12-18
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• 2002

Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.

• 한국산업보건학회지
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• 제22권1호
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• pp.52-59
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• 2012

Objectives: The purpose of this study was to evaluate the exposure possibility of by-products during the semiconductor manufacturing processes. Methods: The authors investigated types of chemicals generated during semiconductor manufacturing processes by the qualitative experiment on generation of by-products at the laboratory and a literature survey. Results: By-products due to decomposition of photoresist by UV-light during the photo-lithography process, ionization of arsine during the ion implant process, and inter-reactions of chemicals used at diffusion and deposition processes can be generated in wafer fabrication line. Volatile organic compounds (VOCs) such as benzene and formaldehyde can be generated during the mold process due to decomposition of epoxy molding compound and mold cleaner in semiconductor chip assembly line. Conclusions: Various types of by-products can be generated during the semiconductor manufacturing processes. Therefore, by-products carcinogen such as benzene, formaldehyde, and arsenic as well as chemical substances used during the semiconductor manufacturing processes should be controlled carefully.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.799-800
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• 2012

• 산업공학
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• 제14권2호
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• pp.120-126
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• 2001

Virtual manufacturing is a technology facilitating effective development and agile manufacturing of products via sophisticated computer models representing physical and logical schema and behavior of real manufacturing systems including manufacturing resources, environments, and products. Based on these models, virtual manufacturing supports decision making and error checking in the entire manufacturing processes from design to mass production. At first, we analyzed manufacturing preparation activities of the four major production shops such as press, body assembly, painting and final assembly, of a Korean automotive company. We then developed the workflow models out of the analysis by the IDEF methodology, and generated a strategic plan for the systematic application of the virtual manufacturing technologies. We identified many manufacturing preparation activities that can be improved by the application of virtual manufacturing technologies. Finally, we estimated the effect of improvement including time savings in car development processes and corresponding cost savings.

• 한국산업보건학회지
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• 제29권3호
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회 2008년도 추계학술대회 및 정기총회
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• pp.286-289
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• 2008

Production Information System make it possible to check and control the information of manufacturing processes. Based on this information companies are able to act to the price strategy and marketing strategy timely. In this study we will examine developing the MES(Manufacturing Execution System) as Production Information System in the Automobile Shock Absorber Piston rod Manufacturing Process of which processes are composed of heat treatment, lathing, grooving, milling, rolling, inspection and packing processes in order to control its production information efficiently.

• Journal of international Conference on Electrical Machines and Systems
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• 제2권4호
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• pp.380-389
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• 2013

Application of linear electric motors to automation of manufacturing processes, gantry robots, machining processes, machining centers, additive manufacturing and laser scribing has been discussed. The paper focuses on replacement of ball lead screw mechanisms with linear electric motors, linear motor driven positioning stages, linear motor driven gantries, machining centers, machining of large objects and industrial lasers. The best linear electric motors for application to machining processes are permanent magnet (PM) linear synchronous motors (LSMs), especially those without PMs in the reaction tail, e.g., high thrust density linear (HDL) LSMs and PM flux switching (FS) LSMs.

• 산업경영시스템학회지
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• 제34권4호
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• pp.57-65
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• 2011

Monitoring auto correlated processes is prevalent in recent manufacturing environments. As a proactive control for manufacturing processes is emphasized especially in the semiconductor industry, it is natural to monitor real-time status of equipment through sensor rather than resultant output status of the processes. Equipment's sensor data show various forms of correlation features. Among them, considerable amount of sensor data, statistically autocorrelated, is well represented by Box-Jenkins autoregressive moving average (ARMA) model. In this paper, we present a design method of statistical process control (SPC) used for monitoring processes represented by the ARMA model. The proposed method shows benefits in the power of detecting process changes, and considers robustness to ARMA modeling errors simultaneously. We prove benefits through Monte carlo simulation-based investigations.