• 대한조선학회논문집
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• 제58권5호
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• pp.294-302
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• 2021

In this study, the 3D printing technique called design for additive manufacturing (DfAM) that is widely used in various industries was applied to marine leisure ships of equipment. The DfAM for the stanchion for crew safety was applied to the equipment used in an actual recreational craft. As design constraints, the design alternatives were not to exceed the safety and weight of the existing stainless steel material, which were reviewed, and the production of a low-cost FFF-type 3D printing method that can be used even in small shipyards was considered. Until now, additive manufacturing has been used for manufacturing only prototypes owing to its limitations of high manufacturing cost and low strength; however, in this study, it was applied to the mass production process to replace existing products. Thus, a design was developed with low manufacturing cost, adequate performance maintenance, and increased design freedom, and the optimal design was derived via structural analysis comparisons for each design alternative. In addition, a life-cycle assessment based on the ISO 1404X was conducted to develop sustainable products. Through this study, the effectiveness of additive manufacturing was examined for future applications in the shipbuilding industry.

• 통상정보연구
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• 제16권4호
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• pp.55-75
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• 2014

본 연구는 국내 ICT 제조업과 서비스업의 경쟁력 강화를 위한 기초 연구로서 효율성과 생산성 추이 및 생산성의 결정요인을 분석하는 것을 목적으로 하였다. 구체적으로 본 연구는 ICT산업의 효율성 분석을 위해 ICT 제조업 23개 업종과 ICT 서비스업 18개 업종에 대하여 2007년부터 2011년까지 5년간 규모의 수익불변을 가정한 DEA(Data Envelopment Analysis)의 CCR모형과 규모의 수익가변을 가정한 BCC모형을 통해 기술효율성과 순수기술효율성의 정태적 효율성을 살펴보고, 기술효율성에 대한 DEA/Window 분석과 Malmquist 생산성 지수를 이용하여 동태적 효율성을 분석하였다.

• International Journal of Quality Innovation
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• 제6권1호
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• pp.58-73
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• 2005

The objective of this study is to evaluate the equipment risk before and after SEMI S2-93A implementation, thus providing a guideline for safety improvement. Semiconductor Plant A located in Taiwan's Hsinchu Science Based Industrial Park with 147 manufacturing machines was used for risk assessment. This study was carried out in three steps. First, a preliminary hazard analysis was conducted. A detailed process safety evaluation was conducted (Hazard and Operability Study, HAZOP); and finally, the equipment risk comparison before and after Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation. The preliminary hazard analysis results showed high risk in 21.77% of the manufacturing machines under risk assessment at Plant A. The largest percentage existed in the Diffusion Department. The machine types specified by the hazardous work site review and inspection according to Article 26 of Labor Inspection Regulation (the machines that use such chemicals as, $SiH_4$, HF, HCL, etc. and that are determined to be highly hazardous through preliminary hazard analysis) were added to the detailed process analysis and evaluation. In the third part of this evaluation, the machines at Plant A used for detailed process safety assessment were divided into two groups based on the manufacturing data before and after 1993. The severity, possibility, and actual accident analysis before and after SEMI S2-93A implementation were compared. The Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation can reduce the severity and possibility of hazard occurrence.

• 산업경영시스템학회지
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• 제39권1호
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• pp.153-161
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• 2016

Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.

• 한국안전학회지
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• 제29권5호
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• pp.40-46
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• 2014

This paper deal with due to the additional equipment established on the vehicle fire accident cases. Recently, vehicle was recognized as other living spaces and it was increasing installation of additional devices such as a black box, multivision, additional battery and so on. However, these additional devices were established on the vehicle by non-specialists such as the general public user or manufacturing and distributors of additional devices since the vehicle factory. Resulting from the additional equipments due to installation errors in these additional equipments connected to the electrical wiring insulation damage or electrical breakdown occurs, and finally leading to a fire caused by the additional equipments. Therefore, additional equipment established on the vehicle due to a fire in order to prevent accidents during the manufacturing process of these devices are installed. If not installed unless the manufacturing process, the installation of additional equipments established by professional who knows the vehicle structure that will be able to prevent the fire.

• 한국정밀공학회지
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• 제30권5호
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• pp.486-492
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• 2013

Energy cost has been increasing rapidly to comply with environmental regulations worldwide and the manufacturing industry who consumes more than half of the total energy needs to improve their cost competitiveness considering environmental costs. Machine tools are essential elements in manufacturing industry and efforts have been made recently to increase their energy efficiency mainly by German and Japanese machine tool builders. In this paper, trends in energy saving technology are described on the hardware and software sides of peripheral equipment of machine tools. In addition, the power consumption of a machining center is measured and analyzed to develop a software-based standby strategy for energy saving with peripheral equipment of machine tools.

• 한국기계가공학회지
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• 제19권10호
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• pp.74-80
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• 2020

Crawler-type hydraulic devices facilitate forward and backward driving of construction equipment by converting power into mechanical energy. The existing hydraulic device performance test process is time- and labor-intensive. This study aims to improve efficiency and productivity by automating the hydraulic device production performance test processes, which have been separately conducted so far. We also used SolidWorksⓇ, a 3D modeling program, and ANSYSⓇ, a structural analysis tool, for structural analysis and to verify the suitability of fixing pins required for connecting a hydraulic device to performance test equipment. Our results that employing an automated hydraulic device performance test process improves efficiency.

• 한국기계가공학회지
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• 제21권7호
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• pp.114-119
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• 2022

The analysis conditions were established using the self-weight of the FCT automation equipment, and natural frequency analysis was performed under the same conditions. For the structural analysis, 3D modeling was performed using Inventor, and structural analysis was performed using the Ansys workbench. From the structural analysis, it was concluded that the resulting values of the stress and deformation of the equipment do not affect the equipment. From the dynamic analysis, the resonance does not occur in the equipment driving area, and thus it is judged to be stable.

• 한국컴퓨터정보학회논문지
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• 제17권2호
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• pp.167-176
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• 2012

본 논문은 장비엔지니어링 시스템(EES) 프레임워크에서 반도체와 광전자 제조장비를 위한 새로운 하이브리드 생산설비데이터 습득 시스템을 설계하고 구현한다. 장비엔지니어링 분야에서 장비로부터 수집되는 데이터 량이 급격히 증가하고 있다. 제안된 HEDAS(Hybrid Equipment Data Acquisition System)는 EES 프레임워크에서 발생하는 대용량의 실시간 데이터를 효율적으로 처리한다. 또한, 제안된 시스템은 실시간 EES 응용 뿐만 아니라 비실시간 EES 응용을 지원할 수 있다. 실시간 EES 응용을 위해서 HEDAS는 메모리 기반의 연속질의와 필터링 기술을 이용하여 고속의 실시간 처리를 수행한다. HEADS는 비 실시간 장비 데이터를 HEADS 기반의 데이터베이스 또는 기존의 데이터베이스에 선택적으로 저장할 수 있다. 특히, 급격하게 증가하는 장비 데이터에 대해 디스크 저장 비용을 절감하기 위해 타임스템프 기반의 압축 인덱싱과 질의처리 기법을 제공한다. HEDAS는 EES 프레임워크에서 대용량의 실시간 및 비 실시간 장비 데이터를 수집하여 다양한 EES 응용에 수집된 데이터를 전송할 수 있는 효율적인 시스템이다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1676-1681
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• 2006

We report on Organic Vapor Phase Deposition $(OVPD^{(R)})$ an innovative deposition technology for organic light emitting device (OLED) and organic semiconductor manufacturing. The combination of $OVPD^{(R)}$ with Close Coupled Showerhead (CCS) technology results in manufacturing equipment with vast potential for cost effective manufacturing of OLED displays commercially competitive to LCD. The actual $OVPD^{(R)}$ equipment concept and design is discussed: Computational Fluid Dynamic (CFD) modeling is compared with experimental results proving the excellent controllability of the deposition process. Further other production relevant deposition properties are being reviewed e.g. high deposition rates and high organic material utilization efficiency of the $OVPD^{(R)}$ - Technology. Data from devices made by $OVPD^{(R)}$ show comparable/ superior performance to those fabricated with conventional vacuum thermal evaporation (VTE) techniques. An outlook on further potentials of $OVPD^{(R)}$ with respect to enabling advanced organic device structures is given.