• Title/Summary/Keyword: Main-Bonding

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Utilizing Channel Bonding-based M-n and Interval Cache on a Distributed VOD Server (효율적인 분산 VOD 서버를 위한 Channel Bonding 기반 M-VIA 및 인터벌 캐쉬의 활용)

  • Chung, Sang-Hwa;Oh, Soo-Cheol;Yoon, Won-Ju;kim, Hyun-Pil;Choi, Young-In
    • The KIPS Transactions:PartA
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    • v.12A no.7 s.97
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    • pp.627-636
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    • 2005
  • This paper presents a PC cluster-based distributed video on demand (VOD) server that minimizes the load of the interconnection network by adopting channel bonding-based MVIA and the interval cache algorithm Video data is distributed to the disks of each server node of the distributed VOD server and each server node receives the data through the interconnection network and sends it to clients. The load of the interconnection network increases because of the large volume of video data transferred. We adopt two techniques to reduce the load of the interconnection network. First, an Msupporting channel bonding technique is adopted for the interconnection network. n which is a user-level communication protocol that reduces the overhead of the TCP/IP protocol in cluster systems, minimizes the time spent in communicating. We increase the bandwidth of the interconnection network using the channel bonding technique with MThe channel bonding technique expands the bandwidth by sending data concurrently through multiple network cards. Second, the interval cache reduces traffic on the interconnection network by caching the video data transferred from the remote disks in main memory Experiments using the distributed VOD server of this paper showed a maximum performance improvement of $30\%$ compared with a distributed VOD server without channel bonding-based MVIA and the interval cache, when used with a four-node PC cluster.

Effect of Environment and Parent-Bodning Relationship on rural high School students' Differentiation of Self (환경변인 및 부모-자녀 유대관계가 농촌 고등학생들의 자아분화에 미치는 영향)

  • 백양희
    • Journal of the Korean Home Economics Association
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    • v.35 no.6
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    • pp.71-86
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    • 1997
  • The purpose of this study was to investigate the effect of parent-bonding patterns & environmental variables on rural high school students' self-differentiationf. The subjects were 600 rural high school students in the 2nd grade. The rural high school students' self-differentiation, according to parent-bonding style & environmental variables were researched with DOSS(Differentiation of self Scale) PBI(Parent-bonding Instrument) & environmental Scale. The data were analyzed by frequency & Reliability, ANOVA (scheffe'test) & Regression analysis of SPSS PC+ program. The main results were as follows. First, In P-B patterns generally frequencies of mother's care were higher than father's But in overprotection frequencies of father's were higher. Degree of rural highschool students' self-differentiation was on the level of 2.84 Second, According to parent-bonding patterns, the difference of self-differentiation were as follow. In P-B patters, father and mother on each level of P<.001 brought differences in the self-differentiation of the 4 sub-divisions Third, In short the effect on self-differentiation showed that in family environmental variables, parent's scolding, gender, family atmosphere & health conditions are crucial variables in self-differentiation and in P-B patterns, father's overprotection, mother's care, father's care are all influential on self-differentiation.

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Bonding Stress Analysis of Cable Fairings used in Small Guided Missiles and Strength Tests of Bonding Materials (유도무기 케이블 페어링의 강도 해석 및 접착재 강도 시험)

  • Goo, N.-S.;Yoo, K.-J.;Shin, Y.-S.;Lee, Y.-H.;Cheong, H.-Y.;Kim, B.-H.
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.6
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    • pp.76-82
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    • 2005
  • Cable fairings of guided missiles are generally used for protection of electric cables under aerodynamic heating and mechanical loading. The stress distributions between a cable fairing and missile main body along a cable fairing are necessary for its design. In this paper, a method for bonding stress and strength analysis of a cable fairing has been investigated and its computer program developed. Tensile and three-point bending tests of generally used bonding materials were also conducted to supply basic material properties for design of cable fairings.

A study on transient liquid phase diffusion bonding of 304 stainless steel and structural carbon steels (304 스테인레스강과 구조용탄소강과의 천이액상확산접합에 관한 연구)

  • 김우열;정병호;박노식;강정윤;박세윤
    • Journal of Welding and Joining
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    • v.9 no.4
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    • pp.28-39
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    • 1991
  • The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

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A Semi-MMIC Hair-pin Resonator Oscillator for K-Band Application (K-Band용 SEmi-MMIC Hair-pin 공진발진기)

  • 이현태
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.25 no.9B
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    • pp.1635-1640
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    • 2000
  • In this paper, a 18 GHz oscillator is designed with the push-push method an fabricated by semi-MMIC process, in which the second harmonic is the main output signal with the suppressed fundamental mode. In semi-MMIC process, passive components with microstrip transmission line are implemented using MMIC process on semi-insulating GaAs substrate. Then, chip types of P-HEMT, resistors, and capacitors are connected through Au wire-bonding. Also, the ground plane is inserted around the circuit and connected each other with the back-side of substrate through Au wire-bonding instead of via-hole. The semi-MMIC push-push oscillator shows the output powder of -10.5 dBm, the fundamental frequency suppression of -17.3 dBc/Hz, and the phase noise of -97.9 dBc/Hz at the offset frequency of 100 kHz.

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COMPARISON OF RETENTIVE FORCE OF REPAIR RESIN BY VARIOUS SURFACE TREATMENT METHODS IN THE REPAIR OF FRACTURED PORCELAIN FUSED TO METAL CROWN (도재소부전장관(陶材燒付前奬冠) 파절수리시(破折修理時) 표면처리(表面處理) 방법(方法)에 따른 수복(修復)레진의 유지력(維持力)에 관(關)한 연구(硏究))

  • Lim Heon-Song;Heo Seong-Joo;Cho In-Ho
    • The Journal of Korean Academy of Prosthodontics
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    • v.30 no.1
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    • pp.73-83
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    • 1992
  • Now composite resin restoration is clinically accepted in the repair of fractured PFM case, many mechanical surface treatment methods are performed to increase retentive force. The main purpose of this study was to compare the retentive force among the possible surface treatments and to insure the best method for the clinical application to the fractures porecelain and the exposed metal surface. To compare and to analyze the retentive force of repair resin, porcelain specimen were divided into 2 groups, etching group and non-etching group, and etching group were treated with 37% $H_3PO_4$, 1.23% APF, 10% HF and non-etching groups were treated with diamond bur, micro-sandblasasting. Also, metal specimens were divided by 2 groups : one was non-precious metal group which was treated with diamond bur, micro-sandblasting and tin plating and electrolytic etching, the other was precious metal group which was composed of micro-sandblasting treatment only and tin plating treatment with micro-sandblasting. Each specimen had been restored for 48 hours and the bond strength of each specimen was calculated with Universal testing machine. The results were as follows : 1. Porcelain specimen had higher bonding strength than metal specimen for the repair resin(P<0.01). 2. In porcelain specimen, 10% HF etching group had the highest bonding strength among etching and non-etching group. 3. Metal specimen treated with micro-sandblasting had highest bonding strength among the non-sandblasting had hightest bonding strength among the non-precious group, tin plating group had higher bonding strength than micro-sandblasting group between the precious metal groups. 4. Bonding strength of tin plating was increased in precious metal group only.

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Chemical Bonding and Surface Electronic Structures of Pt3Co (111), Pt3Ni (111) Single Crystals

  • Kim, Yong-Su;Jeon, Sang-Ho;Bostwick, Aaron;Rotenberg, Eli;Ross, Philip N.;Stamenkovic, Vojislav R.;Markovic, Nenad M.;Noh, Tae-Won;Han, Seung-Wu;Mun, Bong-Jin Simon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.139-139
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    • 2012
  • With angle resolved photoemission spectroscopy (ARPES), the surface electronic band structures of Pt3Co (111) and Pt3Ni (111) single crystals are investigated, which allow to study the bonding interaction between chemically absorbed atomic oxygen and its surfaces. The d-band electrons of subsurface TM are separated from the direct chemical bonding with atomic oxygen. That is, the TM does not contribute to direct chemical bonding with oxygen. From the density functional theory (DFT) calculations, it is identified that the main origin of improved oxygen absorption property, i.e. softening of Pt-O bonding, is due to the suppression of Pt surface-states which is generated from change of interlayer potential, i.e. charge polarization, between Pt-top and TM-subsurface. Our results point out the critical roles of subsurface TM in modifying surface electronic structures, which in turn can be utilized to tune surface chemical properties.

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Effects of DC Substrate Bias Power Sources and Reactant Gas Ratio on Synthesis and Tribological Properties of Ternary B-C-N Coatings (기판 바이어스 DC 전원의 종류와 반응가스 분압비가 3성분계 B-C-N 코팅막의 합성과 마찰 특성에 미치는 영향)

  • Jeong, Da-Woon;Kim, Doo-In;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
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    • v.44 no.2
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    • pp.60-67
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    • 2011
  • Ternary B-C-N coatings were deposited on Si(100) wafer substrate from $B_4C$ target by RF magnetron sputtering technique in $Ar+N_2+CH_4$ gas mixture. In this work, the effect of reactant gas ratio, $CH_4/(N_2+CH_4)$ on the composition, kinds and amounts of bonding states comprising B-C-N coatings were investigated using two different bias power sources of continuous and unipolar DCs. In addition, the tribological properties of coatings were studied with the composition and bonding state of coating. It was found that the substrate bias power had an effect on chemical composition, and all of the obtained coatings were nearly amorphous. Main bonding states of coatings were revealed from FTIR analyses to be h-BN, C-C, C-N, and B-C. The amount of C-C bonging mainly increased with increase of the reactant gas ratio. From our studies, both C-C and h-BN bonding states improved the tribological properties but B-C one was found to be harmful on those. The best coating from tribological points of view was found to be $BC_{1.9}N_{2.3}$ composition.

Molecular approach to hexagonal and cubic diamond nanocrystals

  • Abdulsattar, Mudar Ahmed
    • Carbon letters
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    • v.16 no.3
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    • pp.192-197
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    • 2015
  • In the present work, we propose a molecule (C14H14) that can be used as a building block of hexagonal diamond-type crystals and nanocrystals, including wurtzite structures. This molecule and its combined blocks are similar to diamondoid molecules that are used as building blocks of cubic diamond crystals and nanocrystals. The hexagonal part of this molecule is included in the C12 central part of this molecule. This part can be repeated to increase the ratio of hexagonal to cubic diamond and other structures. The calculated energy gap of these molecules (called hereafter wurtzoids) shows the expected trend of gaps that are less than that of cubic diamondoid structures. The calculated binding energy per atom shows that wurtzoids are tighter structures than diamondoids. Distribution of angles and bonds manifest the main differences between hexagonal and cubic diamond-type structures. Charge transfer, infrared, nuclear magnetic resonance and ultraviolet-visible spectra are investigated to identify the main spectroscopic differences between hexagonal and cubic structures at the molecular and nanoscale. Natural bond orbital population analysis shows that the bonding of the present wurtzoids and diamondoids differs from ideal sp3 bonding. The bonding for carbon valence orbitals is in the range (2s0.982p3.213p0.02)-(2s0.942p3.313p0.02) for wurtzoid and (2s0.932p3.293p0.01)-(2s0.992p3.443p0.01) for diamantane.

Change of Dimensional Stability and Dip Elongation of Handsheets Depending on Wet Pressing (습부압착에 따른 수초지의 치수안정성과 침지신장성의 변화)

  • Park, Chang-Soon;Lee, Jin-Ho;Kil, Jung-Ha;Park, Jong-Moon
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.43 no.4
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    • pp.31-39
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    • 2011
  • One of the main drawbacks of wood fibers based composite materials are their tendency to swell due to moisture uptake in wet and moist environments. The main contribution to the hygroexpansion usually comes from the hydrophilic wood fibers. Recent trend toward the high speed printing, copying, and precision converting precesses demands a high level of dimensional stability under various environmental conditions. The purpose of this study was to investigate the dimensional stability of softwood bleached kraft pulp handsheets depending on wet pressing conditions. By increasing the number of wet pressing, dimensional stability was decreased because of increased fiber-to-fiber bonding. Hygroexpansion of handsheets had a linear relationship with the relative bonded area and equilibrium moisture contents. Dip elongation was decreased when the number of wet pressing was increased because of increased fiber-to-fiber bonding to resist low load in water.