• Transactions on Electrical and Electronic Materials
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• v.6 no.4
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• pp.159-163
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• 2005

We analyzed the fault current limiting characteristics of a flux-lock type $high-T_c$ super­conducting fault current limiter (HTSC-FCL) using series resonance between capacitor for series resonance and magnetic field coil which was installed in coil 3. The capacitor for the series resonance in the flux-lock type HTSC-FCL was inserted in series with the magnetic field coil to apply enough magnetic field into HTSC element, which resulted in higher resistance of HTSC element. However, the impedance of the flux lock type HTSC-FCL has started to decrease since the current of coil 3 exceeded one of coil 2 after a fault accident. The decrease in the impedance of the FCL causes the line current to increase and, if continues, the capacitor for the series resonance to be destructed. To avoid this operation, the flux-lock type HTSC-FCL requires an additional device such as fault current interrupter or control circuit for magnetic field. From the experimental results, we investigated the parameter range where the operation as mentioned above for the designed flux-lock type HTSC-FCL using series resonance occurred.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.185-196
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• 2002

MRAM(magnetic random access memory) is a promising candidate for a universal memory with non-volatile, fast operation speed and low power consumption. The simplest architecture of MRAM cell is a combination of MTJ(magnetic tunnel junction) as a data storage part and MOS transistor as a data selection part. This article will review the general development status of MRAM and discuss the issues. The key issues of MRAM technology as a future memory candidate are resistance control and low current operation for small enough device size. Switching issues are controllable with a choice of appropriate shape and fine patterning process. The control of fabrication is rather important to realize an actual memory device for MRAM technology.

• Proceedings of the Korean Magnestics Society Conference
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• 2003.06a
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• pp.24-24
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• 2003

Metallic magnetoelectronic devices have studied intensively and extensively for last decade because of the scientific interest as well as great technological importance. Recently, the scientific activity in spintronics field is extending to the hybrid devices using ferromagnetic/semiconductor heterostructures and to new ferromagnetic semiconductor materials for future devices. In case of the hybrid device, conductivity mismatch problem for metal/semiconductor interface will be able to circumvent when the device operates in ballistic regime. In this respect, spin-valve transistor, first reported by Monsma, is based on spin dependent transport of hot electrons rather than electron near the Fermi energy. Although the spin-valve transistor showed large magnetocurrent ratio more than 300%, but low transfer ratio of the order of 10$\^$-5/ prevents the potential applications. In order to enhance the collector current, we have prepared magnetic tunneling transistor (MTT) with single ferromagnetic base on Si(100) collector by magnetron sputtering process. We have changed the resistance of tunneling emitter and the thickness of baser layer in the MTT structure to increase collector current. The high transfer ratio of 10$\^$-4/ range at bias voltage of more than 1.8 V, collector current of near l ${\mu}$A, and magnetocurrent ratio or 55% in Si-based MTT are obtained at 77K. These results suggest a promising candidate for future spintronic applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.1
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• pp.9-14
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• 2016

This study evaluated a digital locking device design using detection distance of 13.4mm of a human body sensing type magnetic field coil. In contrast to digital locking devices that are used nowadays, the existing serial number entering buttons, lighting, number cover, corresponding pcb, exterior case, and data delivery cables have been deleted and are only composed of control ON/OFF power switches and emergency terminals. When the magnetic field coil substrates installed inside the inner case detects the electric resistance delivered from the opposite side of the 12mm interval exterior contacting the glass body part, the corresponding induced current flows. At this time, the magnetic field coil takes the role as a sensor when coil frequency of the circular coil is transformed. The magnetic coil as a sensor detects a change in the oscillation frequency output before and after the body is detected. This is then amplified to larger than 2,000%, transformed into digital signals, and delivered to exclusive software to compare and search for embedded data. The detection time followed by the touch area of the body standard to a $12.8{\emptyset}$ magnetic field coil was 30% contrast at 0.08sec and 80% contrast at 0.03sec, in which the detection distance was 13.4mm, showing the best level.

• Journal of Magnetics
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• v.14 no.1
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• pp.11-14
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• 2009

We investigated the I-V curves and differential tunneling conductance of two, CoFeB/MgO/CoFeB-based, magnetic tunnel junctions (MTJs): one with a low tunneling magnetoresistance (TMR; 22%) and the other with a high TMR (352%). This huge TMR difference was achieved by different MgO sputter conditions rather than by different annealing or deposition temperature. In addition to the TMR difference, the junction resistances were much higher in the low-TMR MTJ than in the high-TMR MTJ. The low-TMR MTJ showed a clear parabolic behavior in the dI/dV-V curve. This high resistance and parabolic behavior were well explained by the Simmons' simple barrier model. However, the tunneling properties of the high-TMR MTJ could not be explained by this model. The characteristic tunneling properties of the high-TMR MTJ were a relatively low junction resistance, a linear relation in the I-V curve, and conduction dips in the differential tunneling conductance. We explained these features by applying the coherent tunneling model.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.7
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• pp.515-521
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• 2013

Magnetoelectric(ME) bulk composites with PZT-PNN-PZN/$Fe_2O_4$ were prepared by using a conventional ceramic methods and investigated on the ME voltage vs frequency of ac magnetic fields. We made the electric equivalent circuits by using the Maxwell-Wagner model and simulated the frequency dependence of ME voltage in low frequency region. ME devices were described by a series of two equivalent circuits of piezoelectric and magnetic, which have the relaxation time ${\tau}$ due to the interaction between ME device and load resistor. Equivalent circuit of piezoelectric material is independent of frequency. However ferrite magnetic materials have Debye absorption and dipolar dispersion, whose equivalent circuit is a function of frequency. Therefore we suggest the resistance in the equivalent circuit is proportion to $1+{\omega}^2{\tau}^2$ and the capacitance is in inverse proportion to $1+{\omega}^2{\tau}^2$ in the magnetic materials.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.11
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• pp.617-624
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• 1999

The spiral type thin-film inductor performed in high frequency at 2-5[MHz] range is analyzed by 2-dimensional Finite Element Method(2D FEM). The features of micro thin-film inductor have complicated electromagnetic phenomenon such as skin effect, proximity effect and magnetic saturation. To develope miniatured magnetic device considering these features, it is important to predict the property of the thin film inductor according to design parameter. In this paper, we present the 2D FEM analysis for the spiral type thin film inductor. The characteristics of inductor from point of view of inductance, resistance and quality factor are studied according to design parameter and various pattern construction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.6-9
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• 2000

InSb hall effect of multilayerd structures were investigated. According to variation of magnetic field measured hall coefficient, Hall mobility, carrier density and hall voltage. For the measurement of electrical properties of hall device, evaperated InSb thin film fabricated with series and parallel multilayers. We found that the XRD analysis of InSb thin film showed good properties at $200^{\circ}C$, 60 minutes. Resistance of ohmic contact increased linearly due to increasing current. Some of device fabrication technique and analysis of Hall effect were discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.582-585
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• 2001

InSb temperature dependent hall effect of multilayerd structures were investigated. According to variation of magnetic field measured hall coefficient, Hall mobility, carrier density and hall voltage. For the measurement of electrical properties of hall device, evaperated InSb thin film fabricated with series and parallel multilayers. We found that the XRD analysis of InSb thin film showed good properties at 200$^{\circ}C$, 60 minutes. Resistance of ohmic contact increased linearly due to increasing current. Some of device fabrication technique and analysis of Hall effect were discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.21-24
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• 2000

lnSb temperature dependent hall effect of multilayerd structures were investigated. According to variation of magnetic field measured hall coefficient, Hall mobility, carrier density and hall voltage. For the measurement of electrical properties of hall device, evaperated InSb thin film fabricated with series and parallel multilayers. We found that the XRD analysis of InSb thin film showed good properties at 20$0^{\circ}C$, 60 minutes. Resistance of ohmic contact increased linearly due to increasing current. Some of device fabrication technique and analysis of Hall effect were discussed.