• 대한소아치과학회지
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• 제47권3호
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• pp.337-343
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• 2020

Molar-incisor malformation(MIM)은 최근 발견된 새로운 형태의 root anomaly로 제1대구치 및 제2유구치의 짧거나 미약한 치근 발달과 협착된 치수강, 그리고 cemento-enamel junction 높이에 석회화물질의 존재를 특징으로 한다. 이 증례는 MIM 이환 환자에서 유치열 전반에 걸쳐 치수강 내를 거의 가득 채우고 있는 free pulp stone을 방사선학적으로 확인할 수 있었다. 발치된 환자의 하악 제1대구치와 상악 제2유구치를 대상으로 micro-computed tomography(micro-CT) 촬영 및 scanning electron microscope-energy dispersive X-ray spectrometer 분석을 시행하였다. Micro-CT 영상을 통해, 하악 제1대구치의 치관 외부로 연결된 부근관의 존재가 확인되었다. 이것은 MIM 이환 치아에서 근관치료의 불량한 예후의 원인이 될 수 있을 것으로 사료된다.

• E2M - 전기 전자와 첨단 소재
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• 제8권2호
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• pp.176-183
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• 1995

The present work is concerned with the switching conduction characteristics of PI LB films in metal insulator metal sandwiches. By applying various DC voltage bias to MIM junctions, conduction characteristics of junctions can be changed between the high-voltage low-current(off) condition, the low-voltage high-current (on) condition and the medium(mid) condition. Switching conduction characteristics can be also observed in MIM junctions employing some aromatic compounds as insulators. Switching conduction characteristics is assumed to be owing to the existence of aromatic rings, space charge in films, impurities on metal-insulator interface, and difference in work functions of base and top electrodes metal. To study the conduction process of on, off, and mid conductions, we measured I-V, d$^{2}$V/d I$^{2}$-V characteristics of junctions with several different top electrodes under various temperatures. Small conductance changes of junctions can be measured by observing the second derivative, d$^{2}$V/dI$^{2}$, of I-V curve. A dynamical technique is used to get the second derivatives. That is, a finite modulation of the current is applied to the junctions and the second harmonic of the voltage is detected.

• 대한소아치과학회지
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• 제48권3호
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• pp.352-358
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• 2021

Molar-incisor malformation (MIM)은 치관은 정상이나 치근의 비정상적인 형태를 보이는 것이 특징적이다. 제1대구치에 가장 많이 발생하며, 제2유구치나 상악 중절치도 때때로 이환된다. 이 증례 보고에서는 제1대구치를 포함해, 제2유구치에 MIM이 나타난 환자의 증례를 보고하고, 치근이 건전하게 발거된 제2유구치의 micro computed tomography (CT)를 이용한 형태학적 분석을 시행하였다. 발거된 치아에서는 MIM의 외형적 특징인 치관 - 치근 이행부의 cervical constriction을 육안상으로 확인할 수 있었으며, micro CT 분석에서 백악법랑경계부의 광화된 부위 (Cervical Minelarized Diaphragm), 많은 부근관과 막힌 근관 등의 복잡한 근관 형태, 근관 내 석회화 물질, 영구치에 비해 상대적으로 협착된 치관부 치수강이 관찰되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.24-26
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• 2002

In this paper, we discuss the electrical properties of self-assembled (2'-amino-4,4-di(ethynylphenyl)-5'-nitro-l-(thioacetyl)benzene), which has been well known as a conducting molecule having possible application to molecular level NDR device. The phenomenon of negative differential resistance (NDR) is characterized by decreasing current through a junction at increasing voltage. also fabrication of MIM-type molecular electronic and the Molecular Level Using Scanning Tunneling Microscopy

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1572-1574
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• 2002

In this paper, we discuss the electrical properties of self-assembled (2'-amino-4,4-di(ethynylp henyl)-5'-nitro-1-(thioacetyl)benzene), which has been well known as a conducting molecule having possible application to molecular level NDR device. The phenomenon of negative differential resi(NDR) is characterized by decreasing current th a junction at increasing voltage, also fabricatio MIM-type molecular electronic device and the Molecular Level Using Scanning Tunneling Microscopy.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.767-768
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• 2006

In this study, copper vapor chambers with built-in cooling fins, which eliminated the soldered or brazed joints in the conventional vapor chamber, were fabricated using the metal injection molding process. The results show that with optimized molding parameters, fins with an aspect ratio up to 18 could be produced. After sintering, the densities of the fin and chamber reached 96%. With only 32 cooling fins and a small fan installed, the thermal resistance of the heat sink was $1.156^{\circ}C/W$, and the power dissipation was 40W when the junction temperature was $70^{\circ}C$. When copper powder was sintered onto the chamber to make a vapor chamber, the thermal resistance decreased to $1.046^{\circ}C/W$.