• Proceedings of the Korean Society for Quality Management Conference
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• 2006.11a
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• pp.327-332
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• 2006

A study to build a reliability model of electronic ballasts for the fluorescent lamp has been performed in this paper. We selected the widely being used specification, MIL-HDBK-217 for the study. We briefly reviewed the basic concepts of the electronic ballast with the selected reliability specification. We then developed a reliability model for the ballast using MIL-HDBK-217 and predicted the reliability.

• Journal of Applied Reliability
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• v.17 no.2
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• pp.92-102
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• 2017

Purpose: Reliability prediction standards consider environmental conditions, such as temperature, humidity and vibration in order to predict the reliability of the electronics components. There are many types of standards, and each standard has a different failure rate prediction model, and requires different environmental conditions. The purpose of this study is to make a sensitivity analysis by changing the temperature which is one of the environmental conditions. By observing the relation between the temperature and the failure rate, we perform the sensitivity analysis for standards including MIL-HDBK-217F, RiAC-HDBK-217Plus and FIDES. Methods: we establish environmental conditions in accordance with maneuver weapon systems's OMS/MP and mission scenarios then predict the reliability using MIL-HDBK-217F, RiAC-HDBK-217Plus and FIDES through the case of DC-DC Converter. Conclusion: Reliability prediction standards show different sensitivities of their failure rates with respect to the changing temperatures.

• IE interfaces
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• v.25 no.4
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• pp.472-479
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• 2012

Before an aircraft is delivered to customers, manufacturers have to verify required reliability for the aircraft. In usual, reliability of electronic equipments in military aircraft are predicted based on MIL-HDBK-217. But the specification has not been revised since 1995. Some alternatives including SR-332 and 217PLUS are suggested in this study. The processes and methods specified in MIL-HDBK-217 are compared with those of SR-332. Additionally, the predicted reliability of aircraft electronic equipment between usage data and field data are investigated using MIL-HDBK-217. The results show that predicted reliability of MIL-HDBK-217 is more conservative (underestimated) than that of usage data and field data.

• Proceedings of the Korean Nuclear Society Conference
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• 1999.10a
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• pp.90.1-90
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• 1999

• Journal of Korean Society for Quality Management
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• v.35 no.2
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• pp.27-36
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• 2007

A study to build a reliability model of electronic ballasts for the fluorescent lamp has been performed in this study. We selected the widely being used specification, MIL-HDBK-217 for the study. We briefly reviewed the basic concepts of the electronic ballast with the selected reliability specification. We then developed a reliability model for the ballast using MIL-HDBK-217 and predicted the reliability. We further provided some guides which should be considered in future model development.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.171-179
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• 2016

Purpose: The purpose of this study is to provide a comparison of reliability prediction models between MIL-HDBK-217F and Telcordia SR-332 and to analyze the reliability prediction results. Methods: The reliability of industrial tablet PC was predicted using MIL-HDBK-217F and Telcordia SR-332. To analyze the results, sensitivity analysis was conducted. Results: The reliability of MIL-HDBK-217F was predicted lower than the one of Telcordia SR-332. Considering the factors such as temperature, quality and environment, those provided reliability change of a particular part which highly contribute to the system failure. Conclusion: It is necessary to design the industrial tablet PC that consists of integrated circuits such as microprocessor and memory considering the operating temperature and quality factors.

• Proceedings of the Korean Reliability Society Conference
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• 2000.04a
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• pp.135-143
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• 2000

일반적으로 제어시스템은 독립된 기능을 갖는 전자제어모듈들로 구성되고, 제어시스템의 보수에 있어서 최소 교체단위가 전자제어모듈이기 때문에 제어시스템의 신뢰성을 평가하는 것은 전자제어모듈의 신뢰성을 평가하는 것으로부턴 출발한다. 전자모듈의 신뢰성을 평가할 때 주로 사용하는 평가척도는 MTBF이고, 제조업체에서는 일반적으로 MIL-HDBK-217의 수명예측방법을 이용하여 산출한 MTBF를 제시하고 있다. 하지만 현장의 구매자들은 물론 전자모듈을 개발하는 엔지니어도 MIL-HDBK-217 데이터를 이용한 계산만으로 산출한 MTBF가 실제 사용할 때와 큰 차이가 없는지 확인하기를 원한다. 본 논문에서는 이러한 요구에 따라서 MIL-HDBK-217의 수명예측 방법을 이용하여 예측한 수명을 가속수명시험을 통하여 보증하는 방법을 제시하고, 제시한 방법을 실제 국내에서 제작한 2종류의 전자제어모듈에 적용한 사례를 기술하였다. 국내에서 제작한 2종류의 전자제어모듈에 대하여 본 논문에서 제시한 보증시험방법에 따라서 시험한 결과 신뢰수준 60%에서 예측 수명을 보증할 수 있었고, 보증시험 후에 수명을 추정하기 위하여 추가적으로 장시간 시험하여 수명을 추정한 결과 추정된 수명이 MIL-HDBK-217을 이용하여 예측된 수명에 비하여 2.86∼3.40배길게 나타났다.

• Journal of the Korean Society for Aviation and Aeronautics
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• v.17 no.4
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• pp.25-31
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• 2009

In development phase of the Aircraft Systems, the reliability prediction of electronic equipments are usually performed using MIL-HDBK-217. The reliability of fielded electronic systems, however, used to be underestimated with MIL-HDBK-217. To solve this problem, some alternatives are suggested and Telcordia SR-332 is among them. In this case study, the reliability of ESU which controls gas turbine engine is predicted using Telcordia SR-332 along with the development test data. The predicted reliabilities of ESU using Telcordia SR-332 and MIL-HDBK-217 are also compared. As a result this case study showed that the predicted reliability using Telcordia SR-332 was better close to field(operation) reliability than MIL-HDBK-217.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.227-234
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• 2008

Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.

• Journal of Industrial Technology
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• v.29 no.A
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• pp.27-36
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• 2009

Reliability plays a pivotal role in products safety and quality. DoD RIAC recently developed a new reliability prediction methodology, $217Plus^{TM}$, for electronic systems. It officially replaces the well-known MIL-HDBK-217 and is expected to be widely used. Although theoretic study about $217Plus^{TM}$ and its application towards field systems seem to be attractive, it is also desirable to understand the general background of its development. In this paper, we performed a historical review of the arenas related to reliability prediction. Due to the vast of materials, our scope was limited to the development of $217Plus^{TM}$. We first reviewed Rome Laboratory and RIAC. We then explained the development course of reliability methods, MIL-HDBK-217, PRISM, and 217-Plus. This review will form not only a good understanding of the methodology but a basis for future study. We conclude this study with provision of future research areas.