• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.208-211
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• 2003

In this paper, mechanical property of electric epoxy with water aging was discussed. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hour. As a result, diffusion factor of elastic epoxy showed $20-21{\times}10^{-4}mm^2/s$ and general epoxy showed $9.5{\times}10^{-4}mm^2/s$. Elastic property increased linearly according to amount of addictives and decreased elastic property according to amount of water absorption. Tensile strength was reduced to add to addictives. It was effected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.910-915
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• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Applied Microscopy
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• v.50
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• pp.25.1-25.11
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• 2020

Scanning acoustic microscopy (SAM) or Acoustic Micro Imaging (AMI) is a powerful, non-destructive technique that can detect hidden defects in elastic and biological samples as well as non-transparent hard materials. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity. In recent years, advanced techniques such as ultrasound impedance microscopy, ultrasound speed microscopy, and scanning acoustic gigahertz microscopy have been developed for applications in industries and in the medical field to provide additional information on the internal stress, viscoelastic, and anisotropic, or nonlinear properties. X-ray, magnetic resonance, and infrared techniques are the other competitive and widely used methods. However, they have their own advantages and limitations owing to their inherent properties such as different light sources and sensors. This paper provides an overview of the principle of SAM and presents a few results to demonstrate the applications of modern acoustic imaging technology. A variety of inspection modes, such as vertical, horizontal, and diagonal cross-sections have been presented by employing the focus pathway and image reconstruction algorithm. Images have been reconstructed from the reflected echoes resulting from the change in the acoustic impedance at the interface of the material layers or defects. The results described in this paper indicate that the novel acoustic technology can expand the scope of SAM as a versatile diagnostic tool requiring less time and having a high efficiency.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Restorative Dentistry and Endodontics
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• v.19 no.2
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• pp.473-484
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• 1994

To investigate the effect of resin cement, which had been known to increase the adhesive capacity of the cast gold inlay, on the gingival marginal fit and whether the tin-planting of the beveled area affects the marginal fit, Class II cast gold inlays were made on the 25 sound molars. Control group(ZPC goup) was cemented with the ZPC by conventional method. Experimental groups were cemented with the resin cement(Super-hond & $Panavia_{EX}$) and subdivided further by the existence or nonexistence of the tin-plating of the beveled area(ST & PT groups: with plating, SNT & PNT groups: without plating). So, each group was consisted of 5 teeth and the gingival margin of each specimen was mesiodistally sectioned by 3 times and the marginal and internal gap were evaluated by the Stereo Microscope (${\times}180$) and the Scanning Electron Micrascope(${\times}5,000$) was used for examining the adhesive relationship of the resin cement to the cavity wall and to the cast gold surface. The results were as follows : 1. Marginal gap was less than internal gap in all groups. 2. ZPC and SNT(bevel without tin-plating) groups showed the least gap and gap in PNT(bevel without tin-plating) group, ST(bevel with tin-plating) group, PT(bevel with tin-plating) group showed the greater value in order in evaluation of the both internal gap and marginal gap. 3. With the exception of the relationships between ZPC and SNT groups, ST and PNT groups, relationships between any other groups showed the statistical significance in the internal gap(p<0.05). 4. In the marginal gap, all relationships between groups showed the statistical significance (p<0.05) except the relationships between ZPC and SNT groups, ST and PNT groups, ZPC and PNT groups. 5. ZPC group showed more soluble phenamena than the resin groups(ST, SNT, PT, PNT). 6. Resin cement showed the void spaces in spite of good penetration into the micro-irregularities on both the tooth surface and the cast surface. The void was shown more in PT and PNT groups than in the ST and SNT groups. 7. After the treatment of heat and desiccation for SEM specimen, resin cements were detached more easily from the tooth surface than from the cast surface.

• Journal of the Korean institute of surface engineering
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• v.46 no.6
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• pp.248-257
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• 2013

It is generally recognized that thin Pd-Cu alloy films fabricated by sputtering show a wide range of microstructures and properties, both of which are highly dependent on the sputtering conditions. In view of this, the present study aims to investigate the relationship between the performance of hydrogen separation membranes and the microstructure of Pd alloy films depending on sputtering deposition conditions such as substrate temperature, working pressure, and DC power. We fabricated thin and dense Pd-Cu alloy membranes by the micro-polishing of porous Ni support, an advanced Pd-Cu sputtered multi-deposition under the conditions of high substrate temperature / low working pressure / high DC power, and a followed by Cu-reflow heat-treatment. The result of a hydrogen permeation test indicated that the selectivity for $H_2/N_2$ was infinite because of the void-free and dense surface of the Pd alloy membranes, and the hydrogen permeability was 10.5 $ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ for a 6 ${\mu}m$ membrane thickness.

• Membrane Journal
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• v.28 no.1
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• pp.37-44
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• 2018

Polysulfone composites including graphene were prepared, and their thermal characteristics in membrane states were analyzed by using a custome-made residual stress analyzer and a thermal diffusivity analyzer based on laser flash method. The residual stress analysis was carried out on the polysulfone composite films deposited on Si (100) substrates for 1 cycle of heating and cooling runs. The flat membrane of graphene-embedded polysulfone composites were prepared by the phase transfer method in distilled water and the thermal conductivity was separately measured in the out-of-plane and the in-plane directions. The residual stress of the graphene-embedded polysulfone film was gradually decreased with increasing graphene loading and the out-of-plane thermal conductivity was distinguished from the in-plane thermal conductivity in the flat membranes. These thermal characteristics are caused by the structural uniqueness of graphene and the micro-void structures formed during membrane fabrication.

• Composites Research
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• v.29 no.5
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• pp.315-320
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• 2016

Conventionally, composite aircraft structures are fabricated within autoclave at high pressure. However, autoclave process has several disadvantages including high curing costs and limitation of part size. Recently, out-of-autoclave (OoA) processes have been investigated in many studies to replace conventional autoclave process. A newly developed OoA prepreg, using conventional ovens, can significantly reduce the curing costs and produce autoclave-quality parts. Nevertheless, manufacture of void-free complex shape structure using OoA process presents significant challenges because of the low consolidation pressure. In this study, integrated skin-spar-rib composite part was fabricated using OoA prepreg. And cross-sectional macro- and micro-graphs of the part were examined in order to assess the possibility of replacing conventional autoclave process.

• Journal of the Society of Naval Architects of Korea
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• v.52 no.4
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• pp.356-363
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• 2015

Microbubbles moving in the turbulent boundary layer are visualized and investigated in the point of frictional drag reduction. The turbulent boundary layer is formed beneath the surface of the 2-D flat plate located in the tunnel test section. The microbubble generator produces mean bubble diameter of 30 – 50 μm. To capture the micro-bubbles passing through the tiny measurement area of 5.6 mm² to 200 mm², the shadowgraphy system is employed appropriately to illuminate bubbles. The velocity field of bubbles reveals that Reynolds stress is reduced in the boundary layer by microbubbles’ activity. To understand the contribution of microbubbles to the drag reduction rate more, much smaller field-of-view is required to visualize the bubble behaviors and to find the 2-D void fraction in the inner boundary layer.

• Composites Research
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• v.17 no.3
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• pp.1-7
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• 2004

In the vacuum assisted RTM (VARTM) process that has become the center of attention for manufacturing massive composite structures, a good evacuation of air in the fiber preform is recognized as the prime factor. The microvoids, or the dry spots, are formed as a result of improper gate/vent locations and the mold geometry. The non-uniform resin velocity at the flow front leads to the formation of microvoids in the fibers, whereas the air in the microvoids can migrate along with the resin flow during mold filling. The residual air in the internal voids of a composite structure may cause a degradation of the mechanical properties as well as the structural failure. In this study, a unified macro- and micro analysis methods were developed to investigate the formation and transport of air in resin during VARTM process. A numerical simulation program was developed to analyze the three-dimensional flow pattern as well as the macro- and microscopic distribution of air in a composite part fabricated by VARTM process.