• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.6
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• pp.526-534
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• 2011

The MFS (Mlti-Functional Structure) concept, which integrates the electronics, thermal control and structure into a single packaging system, has been developed and applied to reduce the volume and weight of the satellite. Therefore, this MFS can eliminate the bulky chassis/frames, cables and connectors of the electronic equipment. The main point of this traditional MFS is the replacement of the electrical chassis/frames with MCMs (Multi-Chip Modules) that require much costs and efforts for developing. This paper shows the new MFS concept that effectively saves the volume and weight. The structure including the thermal control and radiation shielding elements will be designed and manufactured as the rectangular grid-stiffened structure. The rectangular grid-stiffened structure is the modification of the iso-grid structure, and provides the enough spaces for putting the general PCBs without the chassis/frames.