• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.273-278
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• 2021

Here, we studied the change in the mechanical stiffness of a diaphragm according to the corrugation pattern. The diaphragm consists of a silicon oxide and nitride double layer; a corrugation pattern was formed by dry etching, and the diaphragm was released by wet etching. The fabrication of the thin film was verified using focused ion beam and scanning electron microscopy images. The mechanical stiffness of the diaphragm was obtained by measuring the surface vibration using a laser Doppler vibrometer while applying external sound pressure. Flat squares, diaphragms with square corrugations, and circular corrugation patterns were measured and compared. The stiffness of the diaphragm with a corrugation structure was found to be smaller than that without a corrugation structure; in particular, circular corrugation showed a better effect because of the high symmetry. Furthermore, the effect of corrugation was theoretically predicted. The proposed corrugated diaphragm showed comparable flexibility with the state-of-the-art MEMS microphone diaphragm.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.71-75
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• 2021

Recently, transition-metal-based hydroxide materials have attracted significant attention in various electrochemical applications owing to their low cost, high stability, and versatility in composition and morphology. Among these applications, transition-metal-based hydroxides have exhibited significant potential in supercapacitors owing to their multiple redox states that can considerably enhance the supercapacitance performance. In this study, nanostructured Ni-Mn double hydroxide is directly grown on a conductive substrate using an electrodeposition method. Ni-Mn double hydroxide exhibits excellent electrochemical charge-storage properties in a 1 M KOH electrolyte, such as a specific capacitance of 1364 Fg-1 at a current density of 1 mAcm-2 and a capacitance retention of 94% over 3000 charge-discharge cycles at a current density of 10 mAcm-2. The present work demonstrates a scalable, time-saving, and cost-effective approach for the preparation of Ni-Mn double hydroxide with potential application in high-charge-storage kinetics, which can also be extended for other transition-metal-based double hydroxides.

• Journal of the Korean Magnetics Society
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• v.17 no.3
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• pp.141-146
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• 2007

A new class of LC-resonator for micro magnetic sensor device was invented and fabricated by means of MEMS technique. The micro LC-resonator consists of a solenoidal micro-inductor with a bundle of soft magnetic microwire cores and a capacitor connected in parallel to the micro-inductor. The core magnetic material is a tiny glass coated $Co_{83.2}B_{3.3}Si_{5.9}Mn_{7.6}$ microwire fabricated by a glasscoated melt spinning technique. The core materials were annealed at various temperatures $150^{\circ}C,\;200^{\circ}C\;,250^{\circ}C\;,$ and $300^{\circ}C$ for 1 hour in a vacuum to improve soft magnetic properties. The solenoidal micro-inductors fabricated by MEMS technique were $500{\sim}1,000{\mu}m$ in length with $10{\sim}20$ turns. The changes of inductance as a function of external magnetic field in micro-inductors with properly annealed microwire cores were varied as much as 370%. Since the permeability of ultra soft magnetic microwire is changing rapidly as a function of external magnetic field. The inductance ratio as well as magnetoimpedance ratio (MIR) in a LC-resonator was varied drastically as a function of external magnetic field. The MIR curves can be tuned very precisely to obtain maximum sensitivity. A prototype magnetic sensor device consisting of the developed microinductors with a multivibrator circuit was test successfully.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• Journal of the Korea institute for structural maintenance and inspection
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• v.23 no.1
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• pp.138-146
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• 2019

LoRa LPWAN network system uses a license-exempt wireless communication system and implements data measurement through the integrated sensor based on Mems and wireless communication of existing measurement sensors. This system has superior technological / economic superiority using existing network and long distance communication compared to existing wireless measurement system, and secured economical efficiency by minimizing system construction equipment compared to wired measurement system. It is confirmed that the economical efficiency can be reduced by 41% compared to the conventional wired metering system. Since the LoRa LPWAN network system is excellent in terms of maintenance and operation, if installed in many bridges in Korea in the future, it will be developed as an excellent system in the maintenance of bridges. Etc.), and plant field (fire safety, etc.).

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.264-266
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• 2005

Recently, on-line diagnosis methods through wired and wireless networks are widely adopted in the diagnosis of industrial Electric Facilities, such as generators, transformers and motors. Also smart sensors which includes sensors, signal conditioning circuits and micro-controller in one board are widely studied in the field of condition monitoring. This paper suggests an self-powered system suitable for condition-monitoring smart sensors, which uses parasitic vibrations of the facilities as energy source. First, vibration-driven noise patterns of the electric facilities are presented. And then, an electromagnetic generator which uses mechanical mass-spring vibration resonance are suggested and designed. Finally energy consumption of the presented smart sensor, which consists of MEMS vibration sensors, signal conditioning circuits, a low-power consumption micro-controller, and a ZIGBEE wireless tranceiver, are presented. The usefulness and limits of the presented electromagnetic generators in the field of electric facility monitoring are also suggested.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.146-153
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• 2006

Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1450-1455
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• 2005

This paper describes a DR construction for land navigation and the sigma point based receding horizon Kalman FIR (SPRHKF) filter for DR/GPS hybrid navigation system. A simple DR construction is adopted to improve the performance both of the pure land DR navigation and the DR/GSP hybrid navigation system. In order to overcome the flaws of the EKF, the SPKF is merged with the receding horizon strategy. This filter has several advantages over the EKF, the SPKF, and the RHKF filter. The advantages include the robustness to the system model uncertainty, the initial estimation error, temporary unknown bias, and etc. The computational burden is reduced. Especially, the proposed filter works well even in the case of exiting the unmodeled random walk of the inertial sensors, which can be occurred in the MEMS inertial sensors by temperature variation. Therefore, the SPRHKF filter can provide the navigation information with good quality in the DR/GPS hybrid navigation system for land navigation seamlessly.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.6
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• pp.483-500
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• 2007

Emerging sensor-based structural health monitoring (SHM) technology can play an important role in inspecting and securing the safety of aging civil infrastructure, a worldwide problem. However, implementation of SHM in civil infrastructure faces a significant challenge due to the lack of suitable sensors and reliable methods for interpreting sensor data. This paper reviews recent efforts and advances made in addressing this challenge, with example sensor hardware and software developed in the author's research center. It is proposed to integrate real-time continuous monitoring using on structure sensors for global structural integrity evaluation with targeted NDE inspection for local damage assessment.