• Title, Summary, Keyword: MEMS

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Vibration Analysis for a Coupled MEMS-Gyroscope Design (연성된 MEMS 자이로스코프 모델의 설계를 위한 진동특성 해석)

  • 방선호;신상하;유홍희
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.946-969
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    • 2003
  • Vibration analysis for a coupled MEMS gyroscope design is presented in this paper. MEMS gyroscopes have shown that slight mistuning in fabricated process often leads to significant difference of vibration characteristics between expected and real designs. The difference frequently affects the MEMS gyroscope design in a negative way. As long as the coupling between excited and sensed motions exists, such difference occurs inevitably. In this paper, dimensionless parameters that govern the vibration characteristics of coupled MEMS gyroscope are identified and the effects of the parameters on the vibration characteristics are investigated for the design of the MEMS gyroscope.

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MEMS97' 참관기

  • 이승기
    • 전기의세계
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    • v.46 no.3
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    • pp.45-48
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    • 1997
  • 이상에서 MEMS97' 학회의 개략적인 내용을 간략히 살펴보았다. 전체적으로 MEMS97' 학회에 참석하여 받은 개인적인 느낌은, 대부분의 연구자들이 Si 공정을 소자나 구조물의 제작에 가장 필수적인 공정으로 이용하고 있으며 MEMS에 이용되는 Si 공정이 이제는 비교적 안정적이고 표준화된, 그래서 그 공정 자체에 대해서는 전혀 새로운 이야기를 할 필요가 없는 공정으로 자리잡아 가고 있다는 것이다. 이러한 점은 국내의 MEMS 연구자들이 깊이 생각해 보아야 할 점으로 생각되며, 앞으로 MEMS 관련 연구자들이 국내의 MEMS 연구를 어떤 방향으로 이끌어 가야 할 것인가, 혹은 우리 실정에서 어떤 방법이 가장 효율적인 연구 방법이 될 수 있을 것인가 등의 방법론적인 문제들을 깊이 있게 생각하고 토의할 필요가 있을 것이라고 판단된다. 다른 무엇보다도 MEMS 학회에서 발표하는 연구자의 수, 논문의 수가 훨씬 더 많아질 수 있도록 모든 연구자들이 혼신의 힘을 다하는 것이 가장 중요한 과제일 것이다.

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A Novel Tensile Specimen and Test Machine for Mechanical Properties of MEMS Materials (MEMS 소재의 기계적 특성 평가를 위한 인장형 시편 및 시험기 제작)

  • Park, Jun-Hyub;Kim, Chung-Youb;Lee, Chang-Seun;Choa, Sung-Hoon;Song, Ji-Ho
    • Proceedings of the KSME Conference
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    • pp.258-263
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    • 2004
  • Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of materials used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed an uniaxial testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, new techniques and procedures for measuring strength are described.

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Simulation methodology of MEMS sensor drop test (MEMS 센서 낙하시험의 모의진단법)

  • Han, Seung-Oh;Kim, Il-Jung;Koo, Kyung-Wan
    • Proceedings of the KIEE Conference
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    • pp.2079_2080
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    • 2009
  • MEMS 기술을 이용한 다양한 센서의 개발과정에서 신뢰성 확보는 매우 중요한 문제이며, 여러 가지 신뢰성 항목 가운데 낙하시험은 가장 기본이 되는 항목이다. 단시간 내에 낙하에 대한 내충격성을 확보하는 MEMS 센서를 개발하기 위해 본 논문에서는 FEA와 high-level 모델을 결합한 낙하시험 모의진단법을 제안하였다. 제안된 모의진단법을 통해 MEMS 소자에서의 최대응력과 응력분포, 최대변위, 그리고 낙하시의 과도응답과 오신호 등의 결과를 확보할 수 있으며 이들을 토대로 MEMS 소자에서의 취약부위를 파악하고 이를 보완할 수 있으며 낙하시의 오동작을 제거하도록 신호처리 회로 등을 보완할 수도 있을 것이며 이를 통해 단시간 내에 최소의 비용으로 내충격성을 확보한 MEMS 센서를 개발하는 것이 가능해질 것이다.

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Design and Analysis of MEMS Vibrating Ring Gyroscope Considering High-g shock reliability (고내충격용 MEMS 진동형 링 자이로스코프 설계 및 분석)

  • Yoon, Sung-Jin;Park, U-Sung
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.64 no.10
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    • pp.1440-1447
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    • 2015
  • This paper describes a study for anti high-shock design of MEMS vibrating ring gyroscope. Structure models was made by MEMS technology processing. MEMS Vibrating Ring Gyroscope mechanical structure were not only anti-high shock simulated with the LS Dyna Ver 971 software but also with mathematical analysis and the finite element method in order to confirm the shock reliability. Shock test result of a MEMS vibrating gyroscope being developed to have gun-hardened survivability while maintaining tactical grade navigation performance for application to various guided projectiles.

Implementation of a Piezoresistive MEMS Cantilever for Nanoscale Force Measurement in Micro/Nano Robotic Applications

  • Kim, Deok-Ho;Kim, Byungkyu;Park, Jong-Oh
    • Journal of Mechanical Science and Technology
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    • v.18 no.5
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    • pp.789-797
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    • 2004
  • The nanoscale sensing and manipulation have become a challenging issue in micro/nano-robotic applications. In particular, a feedback sensor-based manipulation is necessary for realizing an efficient and reliable handling of particles under uncertain environment in a micro/nano scale. This paper presents a piezoresistive MEMS cantilever for nanoscale force measurement in micro robotics. A piezoresistive MEMS cantilever enables sensing of gripping and contact forces in nanonewton resolution by measuring changes in the stress-induced electrical resistances. The calibration of a piezoresistive MEMS cantilever is experimentally carried out. In addition, as part of the work on nanomanipulation with a piezoresistive MEMS cantilever, the analysis on the interaction forces between a tip and a material, and the associated manipulation strategies are investigated. Experiments and simulations show that a piezoresistive MEMS cantilever integrated into a micro robotic system can be effectively used in nanoscale force measurements and a sensor-based manipulation.

Demonstration of Alternative Fabrication Techniques for Robust MEMS Device

  • Chang, Sung-Pil;Park, Je-Young;Cha, Doo-Yeol;Lee, Heung-Shik
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.4
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    • pp.184-188
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    • 2006
  • This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

Application of Bio-MEMS Technology on Medicine and Biology (Bio-MEMS : MEMS 기술의 의료 및 생물학 응용)

  • Jang, Jun-Geun;Jung, Seok;Han, Dong-Chul
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.7
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    • pp.45-51
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    • 2000
  • 지난 세기부터 MEMS 제작 기술을 이용하여 만들어진 시스템들을 의학이나 생물학적인 용도로 응용하기 위한 많은 연구가 활발히 이루어져 왔다. 기술적인 측면에서 이러한 연구들은 MEMS 분야의 초창기에 강조되어 온 표면 및 몸체 미세 가공 기술(surface & bulk micromachining)과 같은 미세 구조물 제작 기술의 발전에 힘입은 바 크다. 그러나 MEMS 기술이 점차 발전되어 오면서, 가공 기술이 고도화되고 미세 시스템의 구조가 점차 복잡해짐에 따라, 많은 연구들이 단순한 가공기술을 넘어 미세 시스템을 조립하고 집적화할 수 있는 기술, 접합 (bonding) 기술, 패키징 (packaging) 기술, 3차원 형상의 제작 기술, 실리콘(silicon)이나 유리(glass)가 아닌 다른 재료를 이용한 미세 가공 기술 등의 개발을 중심으로 이루어지고 있다.(중략)

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Alleviating Deformation of MEMS Structure in Surface Micromachining (표면미세가공시 발생하는 MEMS 구조물의 변형 억제)

  • Hong Seok-Kwan;Kweon Soon-Cheol;Jeon Byung-Hee;Shin Hyung-Jae
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.8
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    • pp.163-170
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    • 2006
  • By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

Vibration Analysis for a Coupled MEMS-Gyroscope Design (연성된 MEMS 자이로스코프 모델의 설계를 위한 진동 해석)

  • 방선호;신상하;유홍희
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.14 no.8
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    • pp.655-660
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    • 2004
  • Vibration analysis for a coupled MEMS gyroscope design is presented in this paper. Slight mistuning in fabricated MEMS gyroscopes often leads to significant difference of vibration characteristics between expected and real designs. This difference frequently results in a negative effect to the MEMS gyroscope performance. As long as the coupling between excited and sensed motions exists, such difference inevitably occurs. In this paper, dimensionless parameters that govern the vibration characteristics of coupled MEMS gyroscope are identified and the effects of the parameters on the vibration characteristics are investigated.