• 제목/요약/키워드: MEMS

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Bio-MEMS : MEMS 기술의 의료 및 생물학 응용 (Application of Bio-MEMS Technology on Medicine and Biology)

  • 장준근;정석;한동철
    • 한국정밀공학회지
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    • 제17권7호
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    • pp.45-51
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    • 2000
  • 지난 세기부터 MEMS 제작 기술을 이용하여 만들어진 시스템들을 의학이나 생물학적인 용도로 응용하기 위한 많은 연구가 활발히 이루어져 왔다. 기술적인 측면에서 이러한 연구들은 MEMS 분야의 초창기에 강조되어 온 표면 및 몸체 미세 가공 기술(surface & bulk micromachining)과 같은 미세 구조물 제작 기술의 발전에 힘입은 바 크다. 그러나 MEMS 기술이 점차 발전되어 오면서, 가공 기술이 고도화되고 미세 시스템의 구조가 점차 복잡해짐에 따라, 많은 연구들이 단순한 가공기술을 넘어 미세 시스템을 조립하고 집적화할 수 있는 기술, 접합 (bonding) 기술, 패키징 (packaging) 기술, 3차원 형상의 제작 기술, 실리콘(silicon)이나 유리(glass)가 아닌 다른 재료를 이용한 미세 가공 기술 등의 개발을 중심으로 이루어지고 있다.(중략)

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연성된 MEMS 자이로스코프 모델의 설계를 위한 진동 해석 (Vibration Analysis for a Coupled MEMS-Gyroscope Design)

  • 방선호;신상하;유홍희
    • 한국소음진동공학회논문집
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    • 제14권8호
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    • pp.655-660
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    • 2004
  • Vibration analysis for a coupled MEMS gyroscope design is presented in this paper. Slight mistuning in fabricated MEMS gyroscopes often leads to significant difference of vibration characteristics between expected and real designs. This difference frequently results in a negative effect to the MEMS gyroscope performance. As long as the coupling between excited and sensed motions exists, such difference inevitably occurs. In this paper, dimensionless parameters that govern the vibration characteristics of coupled MEMS gyroscope are identified and the effects of the parameters on the vibration characteristics are investigated.

정보통신 광 MEMS 기술의 동향분석 (Technical Overview of Optical MEMS in Information and Telecommunication)

  • 백문철;한기평;김약연;손영준;김태엽;조경익
    • 전자통신동향분석
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    • 제16권4호통권70호
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    • pp.23-40
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    • 2001
  • 광 MEMS(Optical MEMS)는 미세 기계, 전자 및 광학기술이 조합하여 이루어지는 종합적인 기술분야로서 정보통신 핵심부품의 정밀화, 고성능화, 경량화 추세에 의해 그 중요성을 더해가고 있다. 본 논문은 정보통신 기술분야에 적용되고 있는 광 MEMS 기술에 대하여 살펴본 것으로, MEMS 시스템을 구성하고 있는 광학적 구성요소의 기술개발 현황, 신소재 및 새롭게 도출된 아이디어 등에 대하여 최신 연구동향을 중심으로 조사.분석하였다. 정보통신 기술의 발전에 따라 응용분야도 다양해지며 신소재의 출현에 따른 새로운 연구분야가 확대되는 등 광 MEMS 기술의 전반적인 기술추세에 대해 전망하였다.

Demonstration of Alternative Fabrication Techniques for Robust MEMS Device

  • Chang, Sung-Pil;Park, Je-Young;Cha, Doo-Yeol;Lee, Heung-Shik
    • Transactions on Electrical and Electronic Materials
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    • 제7권4호
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    • pp.184-188
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    • 2006
  • This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

고내충격용 MEMS 진동형 링 자이로스코프 설계 및 분석 (Design and Analysis of MEMS Vibrating Ring Gyroscope Considering High-g shock reliability)

  • 윤성진;박우성
    • 전기학회논문지
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    • 제64권10호
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    • pp.1440-1447
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    • 2015
  • This paper describes a study for anti high-shock design of MEMS vibrating ring gyroscope. Structure models was made by MEMS technology processing. MEMS Vibrating Ring Gyroscope mechanical structure were not only anti-high shock simulated with the LS Dyna Ver 971 software but also with mathematical analysis and the finite element method in order to confirm the shock reliability. Shock test result of a MEMS vibrating gyroscope being developed to have gun-hardened survivability while maintaining tactical grade navigation performance for application to various guided projectiles.

표면미세가공시 발생하는 MEMS 구조물의 변형 억제 (Alleviating Deformation of MEMS Structure in Surface Micromachining)

  • 홍석관;권순철;전병희;신형재
    • 한국정밀공학회지
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    • 제23권8호
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    • pp.163-170
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    • 2006
  • By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

TOC (Transceiver-on-Chip)를 위한 RF MEMS (Micro Electromechanical Systems) 기술

  • 전국진;성우경
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.55-60
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    • 2001
  • RF MEMS is an exciting emerging technology that has great potential to develop TOC (Transceiver-on-Chip). Applications of the RF MEMS to wireless communications systems are presented. The ability of the RF MEMS technology to enhance the performance and to reduce the size of passive components, in particular, switches, inductors, and tunable capacitors, is addressed. A number of potential wireless system opportunities for the TOC are awaiting the maturation of the RF MEMS technology.

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MEMS 신뢰성 평가 기술의 현황과 필요성

  • 박준협
    • 기계저널
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    • 제43권6호
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    • pp.52-54
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    • 2003
  • 이 글에서는 MEMS 신뢰성 평가 기술의 필요성에 대하여 알아보고, MEMS 신로성 평가 기술의 국.내외의 연구 동향에 대해 설계된다.

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