• Title, Summary, Keyword: MEMS

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Fabrication Method of 3D Feed Horn Shape MEMS Antenna Array Using MRPBI(Mirror Reflected Parallel Beam Illuminator) with Inclined X-Y-Z Stage (MRPBI를 이용한 3D Feed Horn Shape MEMS Antenna Array의 제조)

  • Park, Jong-Yeon;Kim, Kun-Tae;Moon, Sung;Pak, Jung-Ho;Park, Jong-Oh
    • Proceedings of the KIEE Conference
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    • pp.1914-1917
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    • 2001
  • 3D Feed Horn Shape MEMS Antenna Array는 적외선 이미지 소자 또는 Tera hertz band 등에서 많은 응용을 할 수 있는 장점을 가진 MEMS 구조체 이다. 하지만 일반적인 MEMS 공정을 이용해서 3D Feed Horn Shape MEMS antenna array를 구현하기는 적합하지 않았다. 본 논문에서는 마스크와 웨이퍼가 일체 된 형태의 경사된 척이 초 저속으로 회전하면서 노광을 할 수 있는 새로운 방식과 미러 반사구조를 이용해서 평행광을 얻을수 있는 노광장치 (MRPBI : Mirror Reflected Parallel Beam Illuminator) System제작방법을 제안하였다. 3D Feed Horn Shape MEMS Antenna의 구조적인 high apect ratio의 특성에 의해서 SU-8과 PMER Negative Photo resist를 이용한 기본적인 실험을 통해 3D 구조체의 구현 가능성을 증명하였다. 또한 Microbolometer의 성능향상을 위한 이론적인 3D MEMS Antenna Model들을 HFSS(High Frequency Structure Simulator)을 이용해서 그 최적구조를 제안하고 3D MEMS Antenna Gain 값을 비교 분석하였다.

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Application of Au-Sn Eutectic Bonding in Hermetic Rf MEMS Wafer Level Packaging (Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징)

  • Wang Qian;Kim Woonbae;Choa Sung-Hoon;Jung Kyudong;Hwang Junsik;Lee Moonchul;Moon Changyoul;Song Insang
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.3
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    • pp.197-205
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    • 2005
  • Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

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Design of a Reconfigurable Slot Antenna using Sequentially Voltage-Applied RF MEMS Switches (순차적으로 전압 인가된 RF MEMS스위치를 이용한 재구성 슬롯 안테나의 설계)

  • Shim, Joon-Hwan;Yoon, Dong-Sik;Park, Dong-Kook;Kang, In-Ho;Jung-Chih Chiao
    • Journal of Navigation and Port Research
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    • v.28 no.5
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    • pp.429-434
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    • 2004
  • In this paper, we designed a reconfigurable slot antenna using sequentially voltage-applied RF MEMS switches. In order to obtain pull-in voltage and maximum stress of the MEMS switches, the switch structures in accordance with airgap height was analyzed by ANSYS simulation A actuation voltage of MEMS switches can be determined by switch geometry and airgap height between a movable plate and a bottom plate. The designed lengths of MEMS switches were 240 $\mu\textrm{m}$, 320 $\mu\textrm{m}$, 400 $\mu\textrm{m}$, respectively and the airgap was 6$\mu\textrm{m}$. The total size of the designed slot antenna was 10 mm x 10 mm and the slot length and width were 500 $\mu\textrm{m}$ and 200 $\mu\textrm{m}$, respectively. The length and size of the CPW feedline were 5 mm and 30-80-30 $\mu\textrm{m}$, respectively. and then the size of the CPW in the slot was 50-300-150 $\mu\textrm{m}$. The tuning of the resonant frequency of the proposed device is realized by varying the electrical length of the antenna, which is controlled by applying the DC bias voltages to the RF MEMS switches. The designed slot antenna has been simulated, fabricated and measured.

Study of the Respiratory Monitoring System by Using the MEMS Acceleration Sensor (MEMS 가속도 센서를 이용한 환자 호흡동작 모니터링 체계 연구)

  • Sung, Jiwon;Yoon, Myonggeun;Chung, Weon Kuu;Kim, Dong Wook;Shin, Dong Oh
    • Progress in Medical Physics
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    • v.24 no.1
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    • pp.61-67
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    • 2013
  • In this study, we developed and evaluated the patient respiration training method which can help to avoid the problems for the limitation of RGRT applicable patient cases. By using the MEMS (micro-electro-mechanical-system) acceleration sensor, we measured movement of motion phantom. We had compared the response of MEMS with commercially introduced real time patient monitoring (RPM) system. We measured the response of the MEMS with 1 dimensional motion phantom movement for 2.5, 3.0, 3.5 second of period and the 2.0, 3.0, 4.0 cm of the amplitudes. The measured period error of the MEMS system was 0.6~6.0% compared with measured period using RPM system. We found that the shape of MEMS signals were similar with RPM system. From this study, we found the possibility of MEMS as patient training system.

MEMS-BASED MICRO FLUXGATE SENSOR USING SOLENOID EXCITATION AND PICK-UP COILS (MEMS 공정 제작방법에 의한 솔레노이드형 여자 코일과 검출코일을 사용한 마이크로 플럭스게이트 센서)

  • 나경원;박해석;심동식;최원열;황준식;최상인
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.172-176
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    • 2002
  • This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structured solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20um width and 3um thickness is electroplated on Cr(300${\AA}$)/Au(1500${\AA}$) films for the pick-up(42turn) and the excitation(24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3 $\mu\textrm{m}$ is obtained under 2000Gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ∼1,100 and coercive field of -0.1Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150V/T at the excitation frequency of 2MHz and the excitation voltage of 4.4Vp-p. The power consumption is estimated to be 50mW.

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Si-MEMS package Having a Lossy Sub-mount for CPW MMICs (손실층 Sub-mount를 갖는 CPW MMIC용 실리콘 MEMS 패키지)

  • 송요탁;이해영
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.15 no.3
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    • pp.271-277
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    • 2004
  • A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

MEMS-based Micro Fluxgate Sensor Using Solenoid Excitation and Pick-up Coils (MEMS 공정 제작방법에 의한 솔레노이드형 여자 코일과 검출코일을 사용한 마이크로 플럭스게이트 센서)

  • 나경원;박해석;심동식;최원열;황준식;최상언
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.2
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    • pp.120-124
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    • 2003
  • This paper describes a MEMS-based micro-fluxgate magnetic sensing element using Ni$\_$0.8/Fe$\_$0.2/ film formed by electroplating. The micro-fluxgate magnetic sensor composed of a thin film magnetic core and micro-structure solenoids for the pick-up and the excitation coils, is developed by using MEMS technologies in order to take advantage of low-cost, small size and lower power consumption in the fabrication. A copper with 20${\mu}$m width and 3${\mu}$m thickness is electroplated on Cr (300${\AA}$) / Au (1500${\AA}$) films for the pick-up (42turn) and the excitation (24turn) coils. In order to improve the sensitivity of the sensing element, we designed the magnetic core into a rectangular-ring shape to reduce the magnetic flux leakage. An electroplated permalloy film with the thickness of 3${\mu}$m is obtained under 2000 gauss to induce magnetic anisotropy. The magnetic core has the high DC effective permeability of ~1,100 and coercive field of ~0.1 Oe. The fabricated sensing element using rectangular-ring shaped magnetic film has the sensitivity of about 150 V/T at the excitation frequency of 2 MHz and the excitation voltage of 4.4 V$\_$p p/. The power consumption is estimated to be 50mW.

Design and Performance Analysis of Lateral Type MEMS Inertial Switch (수평 구동형 MEMS 관성 스위치 설계 및 성능해석)

  • Gim, Hakseong;Jang, Seung-gyo
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.48 no.7
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    • pp.523-528
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    • 2020
  • A lateral type MEMS inertial switch was designed on the same principle as spring-mass system. The MEMS switch is used for arming mechanism of the arm-fire device by sensing the applied acceleration. We analyzed the switching capability of the MEMS switch under various acceleration conditions via performance model. Simulation results showed that the MEMS switch works very well at 10 g when the applied acceleration slope does not exceed 10 g/msec. On the other hand, the threshold operating acceleration level simulation exceeded the requirement (10±2 g) due to the width and length of the spring by considering 10% tolerance of the design values. Design modification of doubling the width of the spring, which is difficult to reduce less than 10% tolerance in fabrication process, was proposed after confirming the simulation results comply the requirement.

Technical Overview of Optical MEMS in Information and Telecommunication (정보통신 광 MEMS 기술의 동향분석)

  • Pack, M.C.;Han, G.P.;Kim, Y.Y.;Sohn, Y.J.;Kim, T.Y.;Cho, K.I.
    • Electronics and Telecommunications Trends
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    • v.16 no.4
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    • pp.23-40
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    • 2001
  • 광 MEMS(Optical MEMS)는 미세 기계, 전자 및 광학기술이 조합하여 이루어지는 종합적인 기술분야로서 정보통신 핵심부품의 정밀화, 고성능화, 경량화 추세에 의해 그 중요성을 더해가고 있다. 본 논문은 정보통신 기술분야에 적용되고 있는 광 MEMS 기술에 대하여 살펴본 것으로, MEMS 시스템을 구성하고 있는 광학적 구성요소의 기술개발 현황, 신소재 및 새롭게 도출된 아이디어 등에 대하여 최신 연구동향을 중심으로 조사.분석하였다. 정보통신 기술의 발전에 따라 응용분야도 다양해지며 신소재의 출현에 따른 새로운 연구분야가 확대되는 등 광 MEMS 기술의 전반적인 기술추세에 대해 전망하였다.

A Study on Dynamic Performance Improvement of HDD Disk-Spindle System (HDD 디스크-스핀들 시스템의 동특성 개선에 관한 연구)

  • 좌성훈;손진승;이행수;홍민표;고정석;곽주영;조은형
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.1130-1135
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    • 2001
  • This paper investigated the dynamic performance of HDD disk-spindle system to reduce disk fluttering. Rocking frequencies of the disk-spindle system and radial NRRO are measured to escape the ball defect frequencies and to determine the relative optimal position of the disk in the motor. It was found that disk fluttering was reduced by increasing disk thickness, inserting viscoelastic material between the disk and the spacer and decreasing the gap between the disk and the base.

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