• Title, Summary, Keyword: MEMS

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On-orbit Thermal Control of MEMS Based Solid Thruster by Using Micro-igniter (MEMS 기반 고체 추력기의 마이크로 점화기를 이용한 궤도 열제어)

  • Ha, Heon-Woo;Kang, Soo-Jin;Jo, Mun-Shin;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.42 no.9
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    • pp.802-808
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    • 2014
  • MEMS based solid propellant thruster researched for the purpose of an academic research will be verified at space environment through CubeSat program. For this, the temperature of the MEMS thruster should be within allowable operating temperature range by proper thermal control to prevent the ignition failure caused by ignition time delay and to guarantee the structural safety of the MEMS thruster in the low temperature. In this study, we proposed an effective thermal control strategy, that is to use micro-igniter as a heater and temperature sensor for active thermal control instead of using additional heater. The effectiveness of the strategy has been verified through on-orbit thermal analysis of CubeSats with MEMS thruster.

Development of bonding processes for micro-optical and thermo-fluidic components (광/열유체 부품의 접합공정 개발)

  • 김정호;이지혜;유중돈;최두선
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.137-140
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    • 2002
  • The main objectives in the first year include selection of the MEMS bonding methods and feasibility study of selected methods. The ultrasonic bonding method is chosen for MEMS packaging, and the processes to provide localized heating are proposed. The ultrasonic bonding process is analyzed using a lumped model. Preliminary experiments using the eutectic solder and copper pin were performed to verify possibility to MEMS packaging. The preliminary results show possibility of the ultrasonic bonding method for MEMS packaging.

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New Offset-compensation Technique for Capacitive MEMS-Sensor (정전형 MEMS 검출기의 새로운 Offset 보상 방법)

  • Min, Dong-Ki;Jeon, Jong-Up
    • Proceedings of the KIEE Conference
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    • pp.1896-1898
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    • 2001
  • An offset problem caused by the static parasitic capacitors is analyzed and then some techniques to reduce their effect on the capacitive position sensor are presented. Also new offset compensation technique is proposed that by adjusting the magnitudes of the modulating signals independently, the charge imbalance between electrodes caused by the parasitic capacitors is eliminated without sensor gain variation. Simulation results are given to validate the proposed compensation technique.

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Characterization of High Temperature MEMS Heater (고온 구동 MEMS 히터의 특성 분석)

  • Lee, Kook-Nyung;Jung, Suk-Won;Seong, Woo-Kyeong
    • Proceedings of the KIEE Conference
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    • pp.1527_1528
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    • 2009
  • 떠 있는 열선 구조를 채택한 고온 구동 마이크로 MEMS 히터의 특성을 평가하고 분석하였다. 고온 MEMS 히터는 적외선을 이용한 광학식 가스센서의 주요한 핵심 부품인 적외선 발광원으로 활용할 수 있다. MEMS 기술을 이용하여 대량생산이 가능하여 가격을 낮출 수 있고 소비전력이 작아 적외선 센서의 광원으로 응용되는 등 관련 분야의 연구가 많이 이루어지고 있다. 본 논문에서는 실리콘 기판으로부터 떠 있는 실리콘 지지구조물 위에 형성된 백금 저항성으로 고온 발열 동작하는 새로운 구조의 MEMS 히터에 대한 온도 특성을 고해상도 적외선 카메라로 측정한 이미지를 이용하여 분석하였다.

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RF MEMS Package 기술 및 응용

  • 김진양;이해영
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.2
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    • pp.60-70
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    • 2002
  • 최근 고성능/고집적 RF 소자 및 시스템들의 경박 단소화 추세에 따라 RF 무선 통신 분야에도 초소형미세 가공 기술인 MEMS 기술이 크게 주목받고 있다. 이에 본 고에서는 RF 부품 및 시스템을 MEMS 기술로서 실장하는 RF MEMS 패키지 기술에 대하여 간단히 살펴보았다. 우선, 실리콘 기반의 MEMS 패키지가 우수한 열 전달 특성과 저 손실의 고주파특성으로 인해 RF 시스템의 실장에 매우 적합함을 확인하였다. 또한, MEMS 기술을 이용함으로써 RF회로와 패키지 제작 공정이 동시에 이루어질 수 있도록 하는 일괄터리공정에 대하여 소개하였다.

Deformation Behavior of MEMS Gyroscope Package Subjected to Temparature Change (온도변화에 따른 MEMS 자이로스코프 패키지의 변형측정)

  • Joo, Jin-Won;Choi, Yong-Seo;Choa, Sung-Hoon;Song, C.M.
    • Proceedings of the KSME Conference
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    • pp.1407-1412
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    • 2003
  • In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

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Design of an electrostatic 2-axis MEMS stage with large area platform (대면적 플랫폼을 갖는 정전형 2 축 MEMS 스테이지의 설계)

  • 정일진;전종업;백경록;박규열
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.373-378
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    • 2004
  • Recently the electrostatic 2-axis MEMS stages have been fabricated for the purpose of an application to PSD (Probebased Storage Device). However, most of them have low area efficiency, which is undesirable as data storage devices, since all of the components (springs, comb electrodes, anchors, platform, etc.) are placed in-plane. In this paper, we present a novel structure of electrostatic 2-axis MEMS stage that is characterized by having large area platform. For large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. In this article, the structures and operational principle of the MEMS stages are described, followed by design procedure, structural and modal analysis using FEM(Finite Element Method). The area efficiency of the MEMS stage was designed to be about 55%, that is very large compared with conventional ones having a few percentage.

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Development of MEMS Sensor-based High Resolution Tilt Monitoring System (MEMS 센서 기반 고정밀 기울기 모니터링 시스템 설계)

  • Son, Young-Dal;Eun, Chang-Soo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.23 no.11
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    • pp.1364-1370
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    • 2019
  • Tilt sensors are mainly used to measure the collapse of structures such as buildings, bridges and tunnels. Recently, due to the ease of use and low price, many tilt sensors using MEMS sensors have been used, but the measurement angle range is limited, and thus, they do not have high precision for 360 degree. This is due to the inherent offset and scale errors of MEMS sensors. In this paper, we proposed an algorithm for the calculation of precision angles to reduce the mechanical error of MEMS sensors, and produced a MEMS sensor module and a transmission module to compare the angle accuracy of sensor modules before calibration and the angle measurement accuracy after calibration. Experimental results show that the proposed technique has a precision of ± 0.015 degrees for all 360-degree.

극소형 MEMS 우주망원경 탑재체 개발 및 탑재

  • Lee, Jik;Kim, Ji-Eun;Na, Go-Un;Nam, Sin-U;Nam, Ji-U;Park, Il-Heung;Seo, Jeong-Eun;Lee, Hye-Yeong;Jeon, Jin-A;Jeong, Su-Min;Jeong, Ae-Ra;Park, Jae-Hyeong;Lee, Chang-Hwan;Park, Yong-Seon;Yu, Hyeong-Jun;Kim, Min-Su;Kim, Yong-Gwon;Yu, Byeong-Uk;Lee, Gyeong-Geon;Jin, Ju-Yeong;G., Garipov;B., Khrenov;P., Klimov
    • Bulletin of the Korean Space Science Society
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    • pp.47.4-47.4
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    • 2009
  • 초소형전기기계시스템(MEMS: Micro-Electro-Mechanical Systems) 기술로 제작된 마이크로미러 어레이를 장착한 MEMS 우주망원경은 특유의 광시야각 감시, 목표 확인, 확대 및 고속 추적 기능을 가지며 고층대기에서의 초대형 방전현상과 같이 넓은 영역에서 드물게 임의로 일어나는 섬광현상을 관측하기에 최적이다. 러시아 과학위성 Tatiana-2의 주 탑재체로 선정된 극소형 MEMS 우주망원경 MTEL(MEMS Telescope for Extreme Lightning)은 광시야각 감시와 목표 확인을 위한 트리거망원경, 목표 확대와 고속추적을 위한 확대망원경 및 섬광현상의 분광측정을 위한 분광계로 구성되어 있다. 1년간의 개발 및 성능 검증 후 MTEL은 위성탑재를 위한 모든 우주인증 시험을 성공적으로 마쳤다. 현재 MTEL은 Tatiana-2 위성에 탑재되어 있으며, 9월 18일에 우주로 발사되어 1-3년간 800km 궤도를 비행하며 지구 대기에서 발생하는 섬광현상을 관측할 예정이다. 이 발표에서는 MTEL 탑재체의 설계, 제작, 성능 측정 및 calibration 결과를 보고하고, 위성탑재를 위한 진동 및 충격, 열, 진공 및 전자기파 적합성 등의 우주인증 시험 결과 또한 보고한다. 또한 발사 후 과학위성 및 MTEL의 이 발표 때까지의 우주에서의 상황을 보고한다.

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