• Title, Summary, Keyword: MEMS

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Recent research trends on Bio-MEMS (Bio-MEMS분야의 최근 연구동향)

  • Park, Se-Kwang;Yang, Joo-Ran
    • Journal of Sensor Science and Technology
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    • v.19 no.4
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    • pp.259-270
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    • 2010
  • MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

Chaotic Phenomena in MEMS with Duffing Equation (Duffing 방정식을 가진 MEMS에서의 카오스 현상)

  • Bae, Young-Chul
    • The Journal of the Korea institute of electronic communication sciences
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    • v.6 no.5
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    • pp.709-716
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    • 2011
  • Recently, there are many difficult for maintenance in the power in established sensor networks. In order to solve this problems, the power development has been interested using vibration in MEMS that insert the MEMS oscillator. In this paper, we propose the MEMS system with Duffing equation to generate vibration signal that can be use power signal in MEMS and confirm and verify the chaotic behaviors in vibration signal of MEMS by computer simulation. As a verification methods, we confirm the existence of period motion and chaotic motion by parameter variation through the time series, phase portrait, power spectrum and poincare map.

Structural Design and Verification of MEMS Solid Thruster for CubeSat Application (큐브위성 탑재를 위한 MEMS 고체 추력기의 구조설계 및 검증)

  • Jang, Su-Eun;Han, Sung-Hyeon;Kim, Tae-Gyu;Lee, Jong-Kwang;Jang, Tae-Seong;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.43 no.5
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    • pp.432-439
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    • 2015
  • MEMS solid thruster module is composed of solid thruster and its control board. It was developed for the purpose of an academic research. Therefore, thermo-mechanical design and verification for space usage were not considered in the design phase. To mount it on a cube satellite without any design modification, technical efforts at the system level structure design is required. In this study, we proposed a structural design concept to mount the MEMS thruster module by using brackets for guaranteeing structure safety under launch loads and easier mating and de-mating of MEMS thruster module during test phase. The effectiveness of the design has been verified through structural analysis and vibration test. In addition, electrical connection method using spring pins between MEMS thruster and control board is effective for guaranteeing the structural safety under launch vibration loads.

Reliability Assessment and Improvement of MEMS Vacuum Package with Accelerated Degradation Test (ADT) (가속열화시험을 적용한 MEMS 진공패키지의 신뢰성 분석 및 개선)

  • 최민석;김운배;정병길;좌성훈;송기무
    • Journal of Applied Reliability
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    • v.3 no.2
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    • pp.103-116
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    • 2003
  • We carry out reliability tests and investigate the failure mechanisms. of the wafer level vacuum packaged MEMS gyroscope sensor using an accelerated degradation test. The accelerated degradation test (ADT) is used to evaluate reliability (and/or life) of the MEMS vacuum package and to select the accelerated test conditions, which reduce the reliability testing time. Using the failure distribution model and stress-life model, we are able to estimate the average life time of the vacuum package, which is well agreed with the measured data. After improving several package reliability issues such as prevention of gas diffusion through package, we carry out another set of accelerated tests at the chosen acceleration level. The results show that reliability of the vacuum packaged gyroscope has been greatly improved and can survive without degradation of performance, which is the Q-factor in gyroscope sensor, during environmental stress reliability tests.

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Advances in MEMS Based Planar VOA

  • Lee, Cheng-Kuo;Huang, RueyShing
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.7 no.3
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    • pp.183-195
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    • 2007
  • MEMS technology is proven to be an enabling technology to realize many components for optical networking applications. Due to its widespread applications, VOA has been one of the most attractive MEMS based key devices in optical communication market. Micromachined shutters and refractive mirrors on top of silicon substrate or on the device layer of SOI (Silicon-on-insulator) substrate are the approaches trapped tremendous research activities, because such approaches enable easier alignment and assembly works. These groups of devices are known as the planar VOAs, or two-dimensional (2-D) VOAs. In this review article, we conduct the comprehensively literature survey with respect to MEMS based planar VOA devices. Apparently MEMS VOA technology is still evolving into a mature technology. MEMS VOA technology is not only the cornerstone to support the future optical communication technology, but the best example for understanding the evolution of optical MEMS technology.

RF MEMS Passives for On-Chip Integration (단일칩 집적화를 위한 RF MEMS 수동 소자)

  • 박은철;최윤석;윤준보;하두영;홍성철;윤의식
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.2
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    • pp.44-52
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    • 2002
  • 본 논문에서는 RF와 마이크로파 응용을 위한 MEMS 수동 소자에 대한 내용이다. 이 수동 소자들을 만들기 위해서 개발된 3타원 MEMS공정은 기존의 실리콘 공정과 완전한 호환성을 가지고 한 칩으로 집적화 시킬 수 있는 공정이다. 이 3차원 MEMS 공정은 기존 실리콘 긍정이 가지고 있는 한계를 극복하기 위한 방법으로써 개발되었다. 개발된 공정을 이용하여 실리콘 공정에서 구현할 수 없었던 좋은 성능의 인덕터, 트랜스포머 및 전송선을 RF와 마이크로파 응용을 위해서 구현하였다. 저 전압, 높은 차단율을 위한 push-pull 개념을 도입한 MEMS 스위치를 구현하였다. 또한 높은 Q를 갖는 MEMS 인덕터를 최초로 CMOS 칩과 집적화에 성공하여 600kHz 옵셋 주파수에서 -122 dBc/Hz의 특성을 갖는 2.6 GHz 전압 제어 발진기를 제작하였다.

MEMS Packaging Technology and Micro Sensors (MEMS Packaging 기술 및 마이크로센서)

  • 최상언
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • pp.55-85
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    • 2000
  • MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

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세라믹 재료를 이용한 MEMS 센서

  • 양상식
    • Ceramist
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    • v.7 no.3
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    • pp.21-27
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    • 2004
  • MEMS(Micro Electro Mechanical Systems)는 초소형 구조물의 제작 기술인 마이크로머시닝 기술을 이용하여 제작되는 초소형 전자기계 시스템을 말한다. 최근 10여 년간 MEMS 기술이 상당히 진척되었고 다양한 마이크로머시닝 기술이 개발되었다. 이에 따라 이를 이용하여 다양한 MEMS 소자의 개발이 이루어지고 있다. 그 중에서도 MEMS 센서는 비교적 간단한 제작 공정과 작은 크기, 그리고 저비용으로 인하여 상품화가 쉽게 이루어지고 있다. (중략)

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Ultra Fast Flash Observatory to observe the prompt photons from Gamma Ray Bursts

  • Nam, Ji-Woo;Boggs, Steven;Ripov, G.;Grossan, Bruce;Jeon, Jin-A;Jin, Joo-Young;Jung, Ae-Ra;Kim, Ji-Eun;Kim, Min-Soo;Kim, Yong-Kweon;Klimov, P.;Khrenov, B.;Lee, Chang-Hwan;Lee, Jik;Na, Go-Woon;Nam, Shin-Woo;Park, Il-Heung;Park, Jae-Hyoung;Smoot, G.F.;Suh, Jung-Eun;Yoo, Byoung-Wook
    • Bulletin of the Korean Space Science Society
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    • pp.64.3-64.3
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    • 2009
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