• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1969-1971
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• 2002

This paper presents the design and performance of low pull-in voltage MEMS switches for commercial cellular/PCS applications. The switches have all-metal (3 ${\mu}m$ thick Au) movable plates over CPW(Coplanar Waveguide) transmission line. The stress gradient in a movable plate is considered in mechanical design to obtain an accurate pull-in voltage. Series metal-to-metal contact switches are fabricated and evaluated. Those switches exhibit the low loss(<0.2 dB @1.9 GHz) with good isolation(55 dB @1.9 GHz).

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.183-195
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• 2007

MEMS technology is proven to be an enabling technology to realize many components for optical networking applications. Due to its widespread applications, VOA has been one of the most attractive MEMS based key devices in optical communication market. Micromachined shutters and refractive mirrors on top of silicon substrate or on the device layer of SOI (Silicon-on-insulator) substrate are the approaches trapped tremendous research activities, because such approaches enable easier alignment and assembly works. These groups of devices are known as the planar VOAs, or two-dimensional (2-D) VOAs. In this review article, we conduct the comprehensively literature survey with respect to MEMS based planar VOA devices. Apparently MEMS VOA technology is still evolving into a mature technology. MEMS VOA technology is not only the cornerstone to support the future optical communication technology, but the best example for understanding the evolution of optical MEMS technology.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.791-798
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• 2011

All mechanical-system parameters have uncertainty, and this uncertainty directly affects system performances and results in a decrease in the manufacturing outputs. In particular, since the size of a MEMS system is extremely small, the manufacturing tolerances of a MEMS system are relatively large when compared to the tolerances of a macro-scale system. High manufacturing tolerances result from an increase in the uncertainty of the system parameters, thereby affecting the performances and manufacturing yields. In this paper, the performance uncertainty of a MEMS accelerometer due to system parameter uncertainty is analyzed by using several uncertainty analysis methods. Finally, the performance distributions and manufacturing yields of the MEMS accelerometer are predicted.

• The Journal of the Korea institute of electronic communication sciences
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• v.6 no.5
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• pp.709-716
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• 2011

Recently, there are many difficult for maintenance in the power in established sensor networks. In order to solve this problems, the power development has been interested using vibration in MEMS that insert the MEMS oscillator. In this paper, we propose the MEMS system with Duffing equation to generate vibration signal that can be use power signal in MEMS and confirm and verify the chaotic behaviors in vibration signal of MEMS by computer simulation. As a verification methods, we confirm the existence of period motion and chaotic motion by parameter variation through the time series, phase portrait, power spectrum and poincare map.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.126-129
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• 2010

MEMS(micro electro-mechanical systems) inertial switch which is applicable to the ignition Safe-Arm- Unit of propulsion system is devised. The MEMS inertial switch is designed according to the general design procedure for conventional mechanical elements. Unlikely conventional MEMS accelerometer, threshold inertial switching mechanism is adopted which makes a MEMS element an abrupt switching in a certain acceleration level. By comparing the design data and test results of the specimen a small discrepancy in switching acceleration level is found which is presumably due to the nonlinear characteristics of the beam spring and the flexure hinge which are the main parts of the MEMS inertial switch.

• Korean Journal of Computational Design and Engineering
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• v.11 no.6
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• pp.447-454
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• 2006

Although there are many needs to use 3D models in MEMS field, it is not easy to generate 3D models based on MEMS CAD. This is because MEMS CAD is based on 2D and their popular format-GDSII file format- has its own limits and problems. The differences between GDSII file format and 3D CAD system, such as (1) superposed modeling, (2) duplicated entity, (3) restricted of entity type, give rise to several problems in data exchange. These limits and problems in GDSII file format have prevented 3D CAD system from generating 3D models from the MEMS CAD. To remove these limits and solve problems, it is important to extract the silhouette of data in the MEMS CAD. The proposed method has two main processes to extract silhouette; one is to extract the pseudo-silhouette from the original 2D MEMS data and the other is to remove useless objects to complete the silhouette. The paper reports on the experience gained in data exchange between 2D MEMS data and 3D models by the proposed method and a case study is presented, which employs the proposed method using MEMS CAD IntelliMask and Solidworks.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.7
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• pp.979-986
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• 2013

Recently, in the electric, electronic, robotic, and medical industries, a great attention has been paid to the development of MEMS-based smart devices with a compact size and highly intelligency. The MEMS technology is very effective in designing into a compact size and lightweight by combining into one the complex electrical, mechanical, chemical, and biological features which are required by smart devices, and at the same time, in bulk batch manufacturing. Therefore, this study, to prepare for upcoming new MEMS-based technological paradigm, analyzes MEMS processes and then considers its Applications.

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.259-270
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• 2010

MEMS(micro electro mechanical systems) is a technology for the manufacture hyperfine structure, as a micro-sensor and a driving device, by a variety of materials such as silicon and polymer. Many study for utilizing the MEMS applications have been performed in variety of fields, such as light devices, high frequency equipments, bio-technology, energy applications and other applications. Especially, the field of Bio-MEMS related with bio-technology is very attractive, because it have the potential technology for the miniaturization of the medical diagnosis system. Bio-MEMS, the compound word formed from the words 'Bio-technology' and 'MEMS', is hyperfine devices to analyze biological signals in vitro or in vivo. It is extending the range of its application area, by combination with nano-technology(NT), Information Technology(IT). The LOC(lab-on-a-chip) in Bio-MEMS, the comprehensive measurement system combined with Micro fluidic systems, bio-sensors and bio-materials, is the representative technology for the miniaturization of the medical diagnosis system. Therefore, many researchers around the world are performing research on this area. In this paper, the application, development and market trends of Bio-MEMS are investigated.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.5
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• pp.432-439
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• 2015

MEMS solid thruster module is composed of solid thruster and its control board. It was developed for the purpose of an academic research. Therefore, thermo-mechanical design and verification for space usage were not considered in the design phase. To mount it on a cube satellite without any design modification, technical efforts at the system level structure design is required. In this study, we proposed a structural design concept to mount the MEMS thruster module by using brackets for guaranteeing structure safety under launch loads and easier mating and de-mating of MEMS thruster module during test phase. The effectiveness of the design has been verified through structural analysis and vibration test. In addition, electrical connection method using spring pins between MEMS thruster and control board is effective for guaranteeing the structural safety under launch vibration loads.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.