• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.52-58
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• 2000

최근 첨단 미세가공기술로 주목을 받고 있는 실리콘 마이크로머시닝 기술과 이를 기반으로 한 산업용 MEMS 개발현황을 소개한다. 전반부에서는 마이크로머시닝 기술의 종류를 소개하고 각각의 기술에 대해 기술근원, 미세가공원리와 기본 가공공정을 간략히 요약한 후 기전 집적형태의 마이크로머신과의 연계성을 고려한 시스템적인 측면에서의 기술특성을 상호 비교한다. 또한 가공의 양산성, 재현성, 조립성 측면에서 마이크로머시닝의 가공성을 조명함과 동시에 향후 발전방향을 전망한다.(중략)

• Transactions of Materials Processing
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• v.11 no.7
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.478-480
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• 2009

This experiment implemented a laser projection system that used the 2D MEMS scanner as the driving method for the display device. The 2D MEMS scanner, which can scan the images horizontally and vertically, was applied to drive the projection system using the interlaced scanning method. The laser was directly modulated to implement the grayscale and the images were WVGA resolution quality.

• 전기의세계
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• v.45 no.9
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• pp.42-45
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• 1996

MEMS의 가장 효율적인 연구 방법은 학제간의 연구 교류를 활발히 하는 것이다. 또한, 국내의 적은 연구인력으로 해외의 연구자와 어깨를 겨루기 위해서는 필연적으로 연구 교류가 있어야 한다. 이의 필요성을 절감한 대한전기학회 MEMS 연구회와 한국과학재단 마이크로메크트로닉스 연구회에서는 MEMS 연구인력을 조사해서 이를 데이터베이스화하고 배포하여 연구자간의 교류를 활성화 시키고자 했다. 지난 3월부터 자료를 수집하고 정리해서 7월에 발간, 배포했다. 이하는 1996년도 MEMS 연구인력 정보백서 중 자료수집 및 배포, 통계 및 분석에 관한 부분을 발췌한 것이다.

• 전기의세계
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• v.45 no.9
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• pp.37-41
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• 1996

MEMS 기술에 의해 개발되고 있는 많은 제품들 가운데 가장 잠재력 있고 큰 시장을 가진 대형 projector의 개발은 핵심 chip이 현재 DMD(Digital Micromirror Device), AMA(Actuated Mirror Array), 그리고 GLV(Grating Light Valve) 방식으로 진행되고 있으며 TI사가 개발 중인 DMD projector가 상품화에 근접해 있으며 고화질의 시제품을 SID(Society for Information Display) 국제 전시회에 출품하여 전세계 연구원들의 이목을 끌었으며 앞으로 어떻게 수율을 높이고 광학계의 단순화를 이루어 제작비를 낮추는 가가 관심의 초점이다. MEMS 연구를 하는 한 사람으로서의 사견으로도 이 제품이 성공하여야 범세계적으로 일어나고 있는 MEMS 기술이 더욱 확실한 신기술로서의 지위를 갖고 연구되리라 믿는다.

• Journal of the Korean Society of Marine Environment & Safety
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• v.19 no.6
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• pp.666-673
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• 2013

This paper proposes the performance evaluation test of attitude heading reference system (AHRS) suitable for small high speed autonomous underwater vehicle(AUV). Although IMU can provides the detail attitude information, it is sometime not suitable for small AUV with short operation time in view of price and the electrical power consumption. One of alternative for tactical grade IMU is the AHRS based micro-machined electro mechanical system(MEMS) which can overcome many problems that have inhibited the adoption of inertial system for small AUV such as cost and power consumption. A cost effective and small size AHRS which incorporates measurements from 3-axis MEMS gyroscopes, accelerometers, and 3-axis magnetometers has been developed to provide a complete attitude solution for AUV and the attitude calculation algorithm is derived based the coordinate transform equation and Kalman filter. The developed AHRS was validated through various performance tests as like the magnetometer calibration, operating experiments using land mobile vehicle and flight motion simulator (FMS). The test of magnetometer calibration shows the developed MEMS AHRS is robust to the external magent field change and the test with land vehicle proves the leveling error of developed MEMS AHRS is below $0.5^{\circ}/hr$. The results of FMS test shows the fact that AHRS provides the measurement with $0.5^{\circ}/hr$ error during 5 minutes operation time. These results of performance evaluation tests showed that the developed AHRS provides attitude information which error of roll and pitch are below $1^{\circ}$ and the error of yaw is below $5^{\circ}$ and satisfies the required specification. It is expected that developed AHRS can provide the precise attitude measurement under sea trial with real AUV.

• Journal of electromagnetic engineering and science
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• v.6 no.2
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1511_1512
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• 2009

This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.26 no.4
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• pp.271-274
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• 2013

Inclinometer sensors are widely applied in many fields. Especially in the field of construction of high-rise buildings also measure the horizontal and vertical help has been applied to monitor. Recent micro electro-mechanical system(MEMS) technology with the development of the many sensors have been developed. In this paper, a MEMS inclinometer is based on a MEMS accelerometer. The sensor can measure the angle of inclination using the relationship between static acceleration and gravity acceleration from an accelerometer. From this principle, inclinometer has been developed that has more accurate. The accuracy is proved by the experiment with laser displacement. Results in the experiment express high-accuracy, stability and economics of MEMS inclinometer. In conclusion, wireless MEMS inclinometer sensor is expected to be applicable in the areas of construction and many other industries with accurate and convenient monitoring system.