• Journal of the Korea Society of Computer and Information
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• v.25 no.5
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• pp.73-79
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• 2020

As the number of earthquakes gradually increases on the Korean Peninsula, much research has been actively conducted to detect earthquakes quickly and accurately. Because traditional seismic stations are expensive to install and operate, recent research is currently being conducted to detect earthquakes using low-cost MEMS sensors. In this article, we evaluate how a low-cost MEMS acceleration sensor installed in a smartphone can be used to detect earthquakes. To this end, we installed about 280 smartphones at various locations in Korea to collect acceleration data and then assessed the installed sensors' noise floor through PSD calculation. The noise floor computed from PSD determines the magnitude of the earthquake that the installed MEMS acceleration sensors can detect. For the last few months of real operation, we collected acceleration data from 200 smartphones among 280 installed smartphones and then computed their PSDs. Based on our experiments, the MEMS acceleration sensor installed in the smartphone is capable of observing and detecting earthquakes with a magnitude 3.5 or more occurring within 10km from an epic center. During the last several months of operation, the smartphone acceleration sensor recorded an earthquake of magnitude 3.5 in Miryang on December 30, 2019, and it was confirmed as an earthquake using STA/LTA which is a simple earthquake detection algorithm. The earthquake detection system using MEMS acceleration sensors is expected to be able to detect increasing earthquakes more quickly and accurately.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1536-1540
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• 1997

Recently, many advanced technologies in electronics, mechanics, material and computer science have been applied to medictine and they have changed the method of diagnosis and treatment to more quantitative way than before. Now day, with the aid of this technology, the device for the minimal invasive diagnosis and treatment is being developed for the convenience and safety of patients. this paper introduces application of senso and MEMS(Micro Electro Mechnical System) in medicine and biotechnology, which are essential factor for the realization of minimal invasive diagnosis and treatment.

• Transactions of Materials Processing
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• v.11 no.2
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• pp.108-113
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• 2002

The application fields of medicine and biology are spotlighted because of the increasing concentration of health and the abundance of life. MEMS is very good solution in this fields for the concept of point of care which makes systems more useful and spread wide. This paper shows the major fabrication schemes and application fields of microelectromechanical system specially in medicine and biology fields.

• Transactions of Materials Processing
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• v.11 no.2
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• pp.103-107
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• 2002

With the great demand for WDM (Wavelength Division Multiplexing) optical communications, optical switches are expected to become one of the dominant components in future networks. Conventional mechanical switches suffer from poor reliability and large size; however, many micromachined optical switches with moving mirrors have been proposed for high scale OXC (Optical Crossconnect) or ADM (Add/Drop Multiplex) because of the low power consumption and high reliability of these switches. In this paper, we introduce the technological trends of optical switches using MEMS, related micromachining technologies and their characteristics.

• Proceedings of the Optical Society of Korea Conference
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• 2002.07a
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• pp.254-255
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• 2002

Optical elements such as small glass lenses or optical fibers can be permanently bonded to substrates using Al inter-layer by applying Pressure and heating. As an example aspherical lens was bonded on a silicon V-groove. The bonding has high shear strength and good thermal cycling stability.

• 기계와재료
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• v.23 no.1
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• pp.82-93
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• 2011

마이크로폰은 소리를 전기적 신호로 바꾸어주는 청각소자이며, 초소형 마이크로폰의 경우 보청기에서 사용되어 왔을 뿐만 아니라, 최근 들어 개인용 휴대전자기기가 널리 보급되면서 그 수요가 크게 증가하고 있다. 초소형 청각소자 시장에서 MEMS 마이크로폰은 반도체 공정 생산기술의 장점과 더불어 CMOS 신호변환기를 MEMS 마이크로폰의 진동막 구조물과 동일 칩에 통합할 수 있다는 점에서 크게 주목을 받아 왔다. 이 글에서는 초소형 MEMS 마이크로폰의 국내외 기술동향과 특허 동향에 대해 소개하고자 한다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.5
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• pp.1038-1043
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• 2003

A capacitive-coupled configuration MEMS switch is designed and fabricated, and its characteristics are measured. Low actuation voltage has been achieved by means of small distance between signal line and membrane. Minimum actuation voltage is about 11V. Isolation is around 40dB and insertion loss is about 0.2dB at 2GHz.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1896-1898
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• 2001

An offset problem caused by the static parasitic capacitors is analyzed and then some techniques to reduce their effect on the capacitive position sensor are presented. Also new offset compensation technique is proposed that by adjusting the magnitudes of the modulating signals independently, the charge imbalance between electrodes caused by the parasitic capacitors is eliminated without sensor gain variation. Simulation results are given to validate the proposed compensation technique.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.39.1-39
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• 2002

We present nanoactuators and nanodetectors for high-precision Micro Electro Mechanical System (MEMS) applications. Major technical difficulties in the high-precision MEMS are arising from the fabrication uncertainty and electrical noise problems. In this paper, we present high-precision actuators and detectors, overcoming the technical limitations placed by the conventional MEMS technology. For the nano-precision actuation, we present a nonlinearly modulated digital actuator (NMDA). NMDA composed of a digital microactuator and a nonlinear micromechanical modulator. The nonlinear micromechanical modulator is intended to purify the actuation errors in the stroke of the digital a...

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2000.11a
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• pp.104-108
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• 2000

In this paper, we characterized a novel MEMS package using high resistivity silicon for microwave and millimeter-wave devices. The manufactured MEMS package shows -20dB of S$\sub$11/ and -0.4dB of S$\sub$21/ up to 200GHz. The new package can be a low cost and high performance solution due to process compatibility with on-chip devices and very small and precise dimensions by semiconduotor technology.