• 제목/요약/키워드: MEMS

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MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작 (Fabrication of MEMS Test Socket for BGA IC Packages)

  • 김상원;조찬섭;남재우;김봉환;이종현
    • 대한전자공학회논문지SD
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    • 제47권11호
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    • pp.1-5
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    • 2010
  • 본 논문에서는 외팔보 배열 구조를 가지는 MEMS 테스트 소켓을 SOI 웨이퍼를 이용하여 개발하였다. 외팔보는 연결부분의 기계적 취약점을 보완하기 위해 모서리가 둥근 형태를 가지고 있다. 측정에 사용 된 BGA IC 패키지는 볼 수 121개, 피치가 $650{\mu}m$, 볼 직경 $300{\mu}m$, 높이 $200{\mu}m$ 을 가지고 있다. 제작된 외팔보는 길이 $350{\mu}m$, 최대 폭 $200{\mu}m$, 최소 폭 $100{\mu}m$, 두께가 $10{\mu}m$인 곡선 형태의 외팔보이다. MEMS 테스트 소켓은 lift-off 기술과 Deep RIE 기술 등의 미세전기기계시스템(MEMS) 기술로 제작되었다. MEMS 테스트 소켓은 간단한 구조와 낮은 제작비, 미세 피치, 높은 핀 수와 빠른 프로토타입을 제작할 수 있다는 장점이 있다. MEMS 테스트의 특성을 평가하기 위해 deflection에 따른 접촉힘과 금속과 팁 사이의 저항과 접촉저항을 측정하였다. 제작된 외팔보는 $90{\mu}m$ deflection에 1.3 gf의 접촉힘을 나타내었다. 신호경로저항은 $17{\Omega}$ 이하였고 접촉저항은 평균 $0.73{\Omega}$ 정도였다. 제작된 테스트 소켓은 향 후 BGA IC 패키지 테스트에 적용 가능 할 것이다.

PZT 캔틸레버 구동기와 마이크로 시소구조를 적용한 저전압 SPDT MEMS RF 스위치 구현 (Implementation of a Low Actuation Voltage SPDT MEMS RF Switch Applied PZT Cantilever Actuator and Micro Seesaw Structure)

  • 이대성;김원효;정석원;조남규;성우경;박효덕
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2005년도 추계종합학술대회
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    • pp.147-150
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    • 2005
  • Low actuation voltage and no contact stiction are the important factors to apply MEMS RF switches to mobile devices. Conventional electrostatic MEMS RF switches require several tens of voltages for actuation. In this paper we propose PAS MEMS RF switch which adopt PZT actuators and seesaw cantilevers to meet the above requirements. The fundamental structures of PAS MEMS switch were designed, optimized, and fabricated. Through the developed processes PAS SPDT MEMS RF switches were successfully fabricated on 4" wafers and they showed good electrical properties. The driving voltage was less than 5 volts. And the insertion loss was -0.5dB and the isolation was 35dB at 5GHz. The switching speed was about 5kHz. So these MEMS RF switches can be applicable to mobile communication devices or wireless multi-media devices at lower than 6GHz.

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유전율 측정을 위한 MEMS 프로브 (MEMS Probes for Permittivity Measurement)

  • 정근석;정음민;김정무;박재형;조재원;천창율;김용권;권영우
    • 한국정보통신설비학회:학술대회논문집
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    • 한국정보통신설비학회 2004년도 하계학술대회
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    • pp.226-229
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    • 2004
  • 본 논문은 초고주파 영역에서 개방 단말 동축선을 대신해서 복소 유전율을 측정할 수 있는 MEMS 프로브와 그 응용예로 MEMS 프로브 어레이를 제안한다. MEMS 프로브는 기존의 동축선 프로브와 달리 커넥터와의 연결이 간단하여 일회용으로 프로브를 사용할 수 있다는 점에서 의료용으로 사용할 수 있는 가능성이 있다. 샘플의 유전율 분포를 구하기 위해서 기존의 센서는 반복 접촉을 요구하고 이로 인한 번거로움과 측정 오차를 줄일 목적으로 MEMS 프로브 어레이를 개발 하였다. MEMS 프로브 어레이는 RF 스위치를 사용하여 다수의 측정 포인트를 한번의 센서 접촉으로 측정할 수 있는 새로운 개념의 프로브이다. 1GHz부터 40GHz까지의 광대역에서 0.9% 식염수의 유전율을 측정하여 MEMS 프로브의 성능을 검증하였다.

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Packaging MEMS, The Great Challenge of the $21^{st}$ Century

  • Bauer, Charles-E.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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    • pp.29-33
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    • 2000
  • MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than $9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

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System identification of a building structure using wireless MEMS and PZT sensors

  • Kim, Hongjin;Kim, Whajung;Kim, Boung-Yong;Hwang, Jae-Seung
    • Structural Engineering and Mechanics
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    • 제30권2호
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    • pp.191-209
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    • 2008
  • A structural monitoring system based on cheap and wireless monitoring system is investigated in this paper. Due to low-cost and low power consumption, micro-electro-mechanical system (MEMS) is suitable for wireless monitoring and the use of MEMS and wireless communication can reduce system cost and simplify the installation for structural health monitoring. For system identification using wireless MEMS, a finite element (FE) model updating method through correlation with the initial analytical model of the structure to the measured one is used. The system identification using wireless MEMS is evaluated experimentally using a three storey frame model. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS estimates system parameters with reasonable accuracy. Another smart sensor considered in this paper for structural health monitoring is Lead Zirconate Titanate (PZT) which is a type of piezoelectric material. PZT patches have been applied for the health monitoring of structures owing to their simultaneous sensing/actuating capability. In this paper, the system identification for building structures by using PZT patches functioning as sensor only is presented. The FE model updating method is applied with the experimental data obtained using PZT patches, and the results are compared to ones obtained using wireless MEMS system. Results indicate that sensing by PZT patches yields reliable system identification results even though limited information is available.

마이크로 구조를 가진 패드를 이용한 MEMS CMP 적용에 관한 연구 (A study on the application of MEMS CMP with Micro-structure pad)

  • 박성민;정석훈;정문기;박범영;정해도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.481-482
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    • 2006
  • Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.

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금/주석 공융점 접합과 유리 기판의 건식 식각을 이용한 고주파 MEMS 스위치의 기판 단위 실장 (Wafer-Level Package of RF MEMS Switch using Au/Sn Eutectic Bonding and Glass Dry Etch)

  • 강성찬;장연수;김현철;전국진
    • 센서학회지
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    • 제20권1호
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    • pp.58-63
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    • 2011
  • A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

Consumable Approaches of Polysilicon MEMS CMP

  • Park, Sung-Min;Jeong, Suk-Hoon;Jeong, Moon-Ki;Park, Boum-Young;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • 제7권4호
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    • pp.157-162
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    • 2006
  • Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

Embedded 기술을 이용한 COS MEMS 시스템 설계 (COS MEMS System Design with Embedded Technology)

  • Hong, Seon Hack;Lee, Seong June;Park, Hyo Jun
    • KEPCO Journal on Electric Power and Energy
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    • 제6권4호
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    • pp.405-411
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    • 2020
  • In this paper, we designed the COS MEMS system for sensing the falling detection and explosive noise of fuse link in COS (Cut Out Switch) installing on the power distribution. This system analyzed the failure characteristics and an instantaneous breakdown of power distribution. Therefore, our system strengths the industrial competence and guaranties the stable power supply. In this paper, we applied BLE (Bluetooth Low Energy) technology which is suitable protocol for low data rate, low power consumption and low-cost sensor applications. We experimented with LSM6DSOX which is system-in-module featuring 3 axis digital accelerometer and gyroscope boosting in high-performance mode and enabling always-on low-power features for an optimal motion for the COS fuse holder. Also, we used the MP34DT05-A for gathering an ultra-compact, low power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The proposed COS MEMS system is developed based on nRF52 SoC (System on Chip), and contained a 3-axis digital accelerometer, a digital microphone, and a SD card. In this paper of experiment steps, we analyzed the performance of COS MEMS system with gathering the accelerometer raw data and the PDM (Pulse Data Modulation) data of MEMS microphone for broadcasting the failure of COS status.

MEMS 임베디드 시스템 설계 (MEMS Embedded System Design)

  • 홍선학
    • 디지털산업정보학회논문지
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    • 제18권4호
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    • pp.47-54
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    • 2022
  • In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.