• 제목/요약/키워드: MEMS

검색결과 1,884건 처리시간 0.276초

저전압구동 무선통신용 MEMS 스위치 (Low Pull-in Voltage MEMS Switches for Wireless Applications)

  • 심동하;이문철;이은성;박선희;김영일;송인상
    • 대한전기학회:학술대회논문집
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    • pp.1969-1971
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    • 2002
  • This paper presents the design and performance of low pull-in voltage MEMS switches for commercial cellular/PCS applications. The switches have all-metal (3 ${\mu}m$ thick Au) movable plates over CPW(Coplanar Waveguide) transmission line. The stress gradient in a movable plate is considered in mechanical design to obtain an accurate pull-in voltage. Series metal-to-metal contact switches are fabricated and evaluated. Those switches exhibit the low loss(<0.2 dB @1.9 GHz) with good isolation(55 dB @1.9 GHz).

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MEMS 패키징 및 접합 기술의 최근 기술 동향 (Recent Trends of MEMS Packaging and Bonding Technology)

  • 좌성훈;고병호;이행수
    • 마이크로전자및패키징학회지
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    • v.24 no.4
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    • pp.9-17
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    • 2017
  • In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

샘플 통계에 근거한 MEMS 자이로스코프의 설계변수 불확정성이 성능에 미치는 영향 분석 방법 (Analysis on Effects of Design Variable Uncertainty on the Performance of MEMS Gyroscope Based on Sample Statistics)

  • 김용우;유홍희
    • 한국소음진동공학회:학술대회논문집
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    • pp.119-123
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    • 2009
  • Recently, a MEMS gyroscope has been broadly fabricated and used due to development of a micromachining. However, there is a difference between the modeling design and the actual product and this difference can lead to the performance variation of a MEMS gyroscope. A classical design method does not exactly estimate the performance of a MEMS gyroscope. Therefore a design process considering the design variable uncertainty has to be employed to design MEMS gyroscope model. In this paper, the equation of motion of a MEMS gyroscope model is obtained to analyze the performance of a MEMS gyroscope and the effects of the design variables on the MEMS gyroscope performance are investigated. Finally the performance of MEMS gyroscope is estimated through a statistical analysis based on sample statistics.

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온도변화에 따른 MEMS 자이로스코프 패키지의 미소변형 측정 (Deformation Behavior of MEMS Gyroscope Package Subjected to Temperature Change)

  • 주진원;최용서;좌성훈;김종석;정병길
    • 마이크로전자및패키징학회지
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    • v.11 no.4
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    • pp.13-22
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    • 2004
  • MEMS 소자의 패키지는 일반적으로 패키징 과정에서 큰 온도변화를 받게 되는데, 이에 의한 패키지의 변형은 패키지 및 소자의 신뢰성에 큰 영향을 미칠 수 있다. 본 논문에서는 진동형 MEMS 자이로스코프 센서의 패키지를 대상으로 하여, 온도변화로 인한 열변형 거동에 대한 광학실험과 해석을 수행하였다. 이를 위하여 실시간 모아레 간섭계를 이용하여 각 온도단계에서 변위분포를 나타내는 간섭무늬를 얻고, 그로부터 MEMS 패키지의 굽힘변형 거동 및 인장변형에 대한 해석을 수행하였다. MEMS 칩과 EMC 및 PCB의 열팽창계수 차이로 인하여 패키지는 $125^{\circ}C$ 이하에서는 전체적으로 아래로 볼록한 굽힘변형이 발생하였으며, 온도 $140^{\circ}C$를 정점으로 그 이상의 온도에서는 반대의 굽힘변형이 발생하였다. MEMS의 주파수에 영향을 줄 수 있는 칩 자체의 수축변형률은 약 $481{\times}10^{-6}$로 측정되어서 MEMS 설계시 이를 고려하여야 함을 알 수 있다.

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An Availability of Low Cost Sensors for Machine Fault Diagnosis

  • SON, JONG-DUK
    • 한국소음진동공학회:학술대회논문집
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    • pp.394-399
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    • 2012
  • 최근 MEMS 센서는 기계상태감시에 있어서 전력소모, 크기, 비용, 이동성, 응용 등에 있어서 각광을 받고 있다. 특히, MEMS 센서는 스마트센서와 통합가능하고, 대량생산이 가능하여 가격이 저렴하다는 장점이 있다. 이와 관련한 기계상태감시를 위한 많은 실험적 연구가 수행되고 있다. 이 논문은 MEMS 센서들을 3 가지 인공지능 분류기 성능평가를 위한 비교연구에 대해 설명하고 있다. 회전기계에 MEMS 가속도와 전류센서들을 부착하여 데이터를 취득했고, 특징추출과 파라미터 최적화를 위해 Cross validation 기법을 사용하였다. MEMS 센서를 이용한 결함분류기 적용은 적합하다고 판단된다.

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마이크로/밀리미터파 대역에서 전력증폭기의 효율향상을 위한 MEMS 튜닝회로 (MEMS TUNING ELEMENTS FOR MICRO/MILLIMETER-WAVE POWER AMPLIFIERS)

  • 김재흥
    • 한국전자파학회:학술대회논문집
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    • pp.118-121
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    • 2003
  • A new approach, using MEMS, for improving the performance of high efficiency amplifiers is proposed in this paper. The MEMS tuning element is described as a variable-length shorted CPW stub. Class-E amplifiers can be optimally tuned by these MEMS tuning elements because their operation varies with the impedance of the output tuning circuit. A MEMS tuning element was simulated using full-wave EM simulators to obtain its S-parameters. A Class-E amplifier with the MEMS was designed at 8GHz. The non-linear operation of this amplifier was simulated to explore the effect of the MEMS tuning. Comparing the initially designed amplifier without MEMS, the Power Added Efficiency (PAE) of the amplifier with MEMS is improved from 46.3% to 66.9%. For the amplifier with MEMS, the nonlinear simulation results are PAE = 66.90%, $\eta$(drain efficiency) = 75.89%, and $P_{out}$ = 23.37 dBm at 8 GHz. In this paper, the concept of the MEMS tuning element is successfully applied to the Class E amplifier designed with transmission lines.

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