• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.373-376
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• 2008

New glass compositions for lead free, low temperature sealing glass frit was examined in $ZnO-V_2O_5-P_2O_5$ glass system which can be used sealing material for PDP to be made of soda lime glass substrates. Among many glass compositions, KFS-C glass showed low glass transition point (Tg) and good fluidity and adhesion characteristics when it was tested by flow button method at low temperature of $420^{\circ}C$. Its Tg was $317^{\circ}C$ and thermal expansion coefficient (CTE) was $70{\times}10^{-7}/K$. The glass frit was mixed with an organic vehicle to make a paste and it was dispensed and sealed with soda lime glass substrates at $420^{\circ}C$ for 10min. Sealed glass panels also showed good adhesion strength even sealed at low temperature of $420^{\circ}C$.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.76-76
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• 2009

눈부신 전자산업의 발달로 대부분의 전자제품이 다기능/경박단소화 되고 있어, 고밀도 실장 기술인 양면 표면실장과 고집적 패키징 기술인 패키지 적층 공정의 적용이 점차 확대되고 있다. 따라서 양면 표면실장 및 패키지 적층 공정에 사용되는 저온 접합용 무연 솔더 즉, $183^{\circ}C$(Sn-37Pb 공정 솔더 융점) 이하의 융점을 가지는 저온 무연 솔더에 대한 관심이 높아지고 있다. 한편, 미세피치 적용 분야에 있어 ACF/P를 이용한 COG 접속 분야 외에도 최근 저온 접합용 무연 솔더를 이용한 접속 분야가 각광을 받고 있다. 따라서, 접속피치 미세화에 대응하기 위해 스크린 인쇄성을 향상시킬 수 있는 저온 무연 솔더 paste 제조 및 공정 기술의 개발이 필요한 실정이다. 현재 대표적인 저온 무연 솔더 조성은 Sn-Bi계($138^{\circ}C$ 융점)와 Sn-In계($120^{\circ}C$ 융점)이다. 하지만, 이들 조성의 신뢰성 등에 있어 개선의 여지가 있으므로 이를 해결하기 위한 무연솔더 조성의 개발이 필요하다. 이와 같은 관점에서, 본 연구는 $137^{\circ}C$의 융점을 갖는 Sn-57.6Ag-0.4Ag 저온 무연 솔더 paste를 $217^{\circ}C$의 융점을 갖는 Sn-3.0Ag-0.5Cu 솔더 paste와 비교하여 인쇄성, reflow 특성, void inspection, 미세조직 관찰 및 underfill 적용 등의 실험을 실시하였다.

• Korean Journal of Food Science and Technology
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• v.26 no.6
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• pp.791-798
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• 1994

Ohmic heating is a food processing operation in which heat is internally generated within foods by the passage of alternating electric current. The process enables highly viscous paste foods such as Kochujang, and fermented soybean paste to be heated very fast. In order to develope the novel pasteurization process of paste foods, static Ohmic heating system was built, and heating characteristic during Ohmic heating under various conditions were studied. Electric conductivities of Kochujang and fermented soybean paste at room temperature were 1.865 S/m and 2.510 S/m, respectively and increased linearly with increasing temperature. Specific heating rate was highly dependent on the frequency. The highest heating rate was achieved at 5 KHz for Kochujang and 20 KHz for fermented soybean paste. Uniform heating throughout the sample was achieved during Ohmic heating with low frequency electrical currents, however above 5 KHz frequency, surface temperature was several degrees higher than the bulk.

• Journal of Microbiology and Biotechnology
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• v.26 no.4
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• pp.666-674
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• 2016

The bacterial strains were screened as potential starters for fermenting low-salt doenjang (a Korean traditional fermented soybean paste) using Korean doenjang based on proteolytic and antipathogenic activities under 6.5-7.5% NaCl conditions. Phylogenetic analysis based on 16S rRNA gene sequences showed that they all belonged to the genus Bacillus. Proteolytic and antipathogenic activities against Escherichia coli, Bacillus cereus, Staphylococcus aureus, Listeria monocytogenes, and Aspergillus flavus, as well as fibrinolytic, amylase, and cellulase activities of the 10 strains were quantitatively evaluated. Of these, strains D2-2, JJ-D34, and D12-5 were selected, based on their activities. The functional, phenotypic, and safety-related characteristics of these three strains were additionally investigated and strains D2-2 and D12-5, which lacked antibiotic resistance, were finally selected. Strains D2-2 and D12-5 produced poly-γ-glutamic acid and showed various enzyme activities, including α-glucosidase and β-glucosidase. Growth properties of strains D2-2 and D12-5 included wide temperature and pH ranges, growth in up to 16% NaCl, and weak anaerobic growth, suggesting that they facilitate low-salt doenjang fermentation. Strains D2-2 and D12-5 were not hemolytic, carried no toxin genes, and did not produce biogenic amines. These results suggest that strains D2-2 and D12-5 can serve as appropriate starter cultures for fermenting low-salt doenjang with high quality and safety.

• Korean journal of food and cookery science
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• v.24 no.6
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• pp.882-890
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• 2008

The present study investigated the influence of different volumes of red hot pepper juice on the quality characteristics of fresh Pasta noodle. Supplementation with 0% (control), 2.5%, 5%, 7.5%, or 10% red hot pepper juice produced similar gelatinization characteristics of peak viscosity, temperature at peak viscosity, hot paste viscosity and numerical value of breakdown. However, increasing concentrations of red hot pepper juice produced progressively and significantly low cold paste viscosity and setback. The chromaticity of wet and cooked noodles was significantly lower in L value and significantly higher in +a and +b values with increasing volumes of red hot pepper juice. The texture of fresh noodles displayed no significant differences in hardness, adhesiveness and chewiness. The springiness and cohesiveness were lower and higher with the increase of added red hot pepper juice, respectively, but the differences just attained significance. For cooked noodles, adhesiveness, springiness, cohesiveness and chewiness tended to be higher with increasing volumes of red hot pepper juice, but again the differences just attained significance. Cooking characteristics of weight, volume, moisture absorptive power and turbidity decreased with increasing volumes of red hot pepper juice. Sensory characteristics of acceptability including appearance, color, flavor, taste, texture and overall-acceptability improved with increasing red hot pepper juice volume, in particular with 5% and 7.5%. Amylograph characteristics for initial paste temperature positively correlated with the texture characteristics for chewiness (p<0.05). Negatively correlated amylograph parameters included texture for springiness with for peak viscosity (p<0.01), texture for adhesiveness with hot paste viscosity (p<0.01) and breakdown with texture for adhesiveness, cohesiveness and chewiness (p<0.05).

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of Powder Materials
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• v.22 no.6
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• pp.396-402
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• 2015

The organic binder-free paste for dye-sensitized solar cell (DSSC) has been investigated using peroxo titanium complex. The crystal structure of $TiO_2$ nanoparticles, morphology of $TiO_2$ film and electrical properties are analyzed by X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), Electrochemical Impedance Spectra (EIS), and solar simulator. The synthesized $TiO_2$ nanopowders by the peroxo titanium complex at 150, 300, $400^{\circ}C$, and $450^{\circ}C$ have anatase phase and average crystal sizes are calculated to be 4.2, 13.7, 16.9, and 20.9 nm, respectively. The DSSC prepared by the peroxo titanium complex binder have higher $V_{oc}$ and lower $J_{sc}$ values than that of the organic binder. It can be attributed to improvement of sintering properties of $TCO/TiO_2$ and $TiO_2/TiO_2$ interface and to formation of agglomerate by the nanoparticles. As a result, we have investigated the organic binder-free paste and 3.178% conversion efficiency of the DSSC at $450^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.27 no.3
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• pp.337-344
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• 1990

As a function of sintering temperature and time, the electrical properties of ruthenium based thick film resistors were investigated with microstructure. The variatio of resistivity and TCR(temperature coefficient of resistance)trends of sintered speciman at various sintering temperature were different low resistivity paste(Du Pont 1721) from high one(Du Pont 1741). These phenomena are deeply relative to microstructure of sintered film. With increasing the sintering temperature for 1721 system, the electrical sheet resistivity decreased, but again gradually increased above 80$0^{\circ}C$. And TCR trends in 1721 system are all positive. On the other hand the electrical sheet resistivity of 1741 resistor system decreased with sintering temperature. And TCR trends variable according to sintering temperature. TCR of speciman sintered at $700^{\circ}C$ was negative value, and TCR of 80$0^{\circ}C$ sintered speciman coexisted negative and positive value. But in case of speciman sintered at 90$0^{\circ}C$, TCR was positive value. As results of this fact, it was well known that the charge carrier contributied to electrical conduction in 1741 resistor system varied with sintering temperature.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.591-592
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• 2006

We studied about the manufacture of the drain-source contacts for OTFTs(organic thin-film transistors) by using screen printing method. The conductive fillers used Ag and carbon black. The conductive contacts with $100{\mu}m$ of channel length were screen printed on a silicon dioxide gate dielectric layer and, the pentacene semiconductor was deposited via vacuum deposition. As a result of studying various conductive pastes, we could obtain the OTFTs which exhibited field-effect behavior over arrange of drain-source and gate voltages, similar to devices employing deposited Au contacts. By using screen-printing with conductive paste, the contacts are processed at low temperature, thereby facilitating their integration with heat sensitive substrates.