• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.15-23
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• 2015

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

• 한국재료학회지
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• 제18권5호
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• pp.283-288
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• 2008

The effect of sintering aids and glass-frit on the densification and resistivity of silver paste was investigated in an effort to enhance the sintered density and electrical conductivity of the silver electrode. To prepare Pb-free silver paste for use at low sintering temperatures, two commercial silver powders ($0.8\;{\mu}m$ and $1.6\;{\mu}m$ in size) and 5wt.% lab-synthesized nanoparticles (30-50 nm in size) as a sintering aids were mixed with 3 wt.% or 6 wt.% of glass frit ($Bi_2O_3$-based) using a solvent and three roll mills. Thick films from the silver paste were prepared by means of screen printing on an alumina substrate followed by sintering at $450^{\circ}C$ to $550^{\circ}C$ for 15 min. Silver thick films from the paste with bimodal particles showed a high packing density, high densification during sintering and low resistivity compared to films created using monomodal particles. Silver nanoparticles as a sintering aid enhanced the densification of commercial silver powder at a low sintering temperature and induced low resistivity in the silver thick film. The glass frit also enhanced the densification of the films through liquid phase sintering; however, the optimum content of glass frit is necessary to ensure that a dense microstructure and low resistivity are obtained, as excessive glass-frit can provoke low conductivity due to the interconnection of the glass phase with the high resistivity between the silver particles.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.381-381
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• 2011

In this study, a TiO2 colloidal sol was synthesized by sol-gel process, which was used as a "glue" agent to enhance interconnection of TiO2 particles in low temperature process for plastic dye sensitized solar cell. The crystalline phase of this TiO2 glue is pure anatase with average particles size of 5 nm, which was characterized by powder X-ray diffraction and high revolution-TEM. The viscous alcoholic paste without any organic binder was prepared from the mixture of commercial P25 powder and glue. Paste composition and sintering process parameters were optimized for high photovoltaic performance based on low temperature process. The electrochemical impedance spectroscopy and photocurrent-photovoltage transient spectroscopy were also employed to investigate the mechanism of electron transport in this binder free TiO2 film system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.876-879
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system $BaO-ZnO-B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize $BaO-ZnO-B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
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• pp.75.1-75
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• 2003

• 한국식품과학회지
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• 제36권2호
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• pp.355-360
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• 2004

시판중인 딸기의 미생물에 대한 잔류오염 정도를 파악하기 위하여 그들 잔류 미생물들을 총호기성균, 대장균군, 대장균, 유산균, 그리고 효모/곰팡이 등의 5가지로 구분하여 각각 측정하였다. 총호기성균은 약 8 log CFU/g, 대장균군은 약 2 log CFU/g, 그리고 유산균은 약 3 log CFU/g 정도씩 각각 검출되었다. 그리고 대장균과 효모/곰팡이는 검출한계(< 10 cells/g)미만에서 불검출되었다. 그리고 model system으로서 딸기 paste를 제조하여 7일 동안 저장하면서 저장온도, 보존제, 딸기 paste의 pH 등 3가지 hurdle들이 딸기에 잔류하는 총호기성균, 대장균군, 그리고 유산균의 증식억제에 미치는 영향을 파악하였다. 딸기 paste의 저장온도는 저온($4^{\circ}C$), 상온($20^{\circ}C$), 그리고 고온($37^{\circ}C$)을 선정하였고, 보존제는 0.1% potassium sorbate를 사용하였으며, 딸기 paste의 pH는 4와 7로 조정하였다. 이들 3가지 hurdle별 딸기 paste의 저장기간 중 잔류미생물에 대한 증식억제 효과는 저장온도 >pH> potassium sorbate 첨가의 순으로 나타났다. 그리고 이들 hurdle을 복합적으로 사용할 경우 딸기 paste의 pH를 4로 하여 potassium sorbate를 0.1% 첨가한 후, $4^{\circ}C$에서 저장하는 것이 가장 효율적으로 딸기 중 잔존미생물의 증식을 억제할 수 있었다.

• 콘크리트학회논문집
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• 제20권6호
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• pp.797-807
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• 2008

본 연구에서는 온도균열 저감이 기대되는 3성분계 시멘트를 사용한 페이스트 및 콘크리트의 간이단열온도 상승실험을 실시하여 3성분계 시멘트의 활성화를 위한 기초자료를 제공하고자 하였다. 페이스트 실험은 3가지 결합재를 단독사용 및 혼합사용 하였으며, 콘크리트 실험은 3가지 결합재를 동시에 혼입하여 실시하였다. 페이스트실험 결과 BFS보다 FA의 사용이 온도저감 효과가 좋았으며, 3성분계 시멘트페이스트에서는 BFS의 혼입률이 작고 FA의 혼입률이 클수록 온도가 낮게 나타났다. 온도상승속도 및 하강속도 또한 BFS의 혼입률이 작고 FA의 혼입률이 클수록 늦어졌다. 한편, 물결합재비가 높을수록 최고온도가 낮게 나타났다. 최고온도 도달시간은 OPC100, 2성분계 시멘트, 3성분계 시멘트 순으로 짧게 나타나 3성분계 시멘트 사용은 온도상승지연효과가 있었다. 콘크리트 실험 결과 3성분계 시멘트를 사용한 콘크리트는 OPC사용 콘크리트에 비해 최고온도가 약 $8{\sim}11^{\circ}C$ 정도 낮게 나타났고, 온도상승속도는 $47{\sim}51%$ 수준이며, 온도하강속도는 $37{\sim}42%$ 수준으로 나타났다. 콘크리트 시험체는 페이스트 시험체에 비해 현저히 낮은 온도와 느린 온도상승속도 및 하강속도를 보였는데, 이는 콘크리트 중의 골재에 의한 영향으로 페이스트 시험체보다 열손실량이 컸기 때문이다.

• ETRI Journal
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• 제33권6호
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• 한국인쇄학회지
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• 제29권2호
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• pp.71-82
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• 2011

Electronic display markets has been developed. The cathode ray tube of brown form recently celebrated their 100th by first display. Also LCD of flat form recently celebrated their 25th by second display and it has advantage of small volume, lower consumption power. But FPD has problem that is property of brittle and noncarrying by glass substrate. Therefore the arrival of portable electronics devices has put an increasing premium on durable, lightweight and inexpensive display components. It is flexible display by third display. Also electronics field such as printed wiring board, RFID, membrane switch prefer flexible display. The conductive pattern can be used mostly in field of electronic displays and electronics. This manufacture of conductive pattern in present used is screen printing. The the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity. screen printing has problem that is low productivity and use not flexible substrate because of high fire temperature. This study was developed novel method to form the conductive pattern. It has advantages of flexibility, high conductivity, drying in low temperature, good conductivity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.295-298
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize BaO-ZnO-$B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.