• 청정기술
• /
• 제14권1호
• /
• pp.14-20
• /
• 2008

본 연구에서는 LCD BLU에 적용 가능한 면광원용 저온소성 형광체 페이스트(paste)를 제조하여 그 특성을 검토하였다. 형광체 paste에는 저온 소성용 아크릴 레진을 바인더로 사용하였으며, 그 열분해특성을 검토한 결과 $400^{\circ}C$에서 잔탄이 0.1 wt% 이하인 것을 확인 할 수 있었다. 본 연구에서 제조한 paste로 스크린 인쇄를 통해 면광원용 device를 제작한 결과, 형광체 휘도에 대해 100%에 가까운 발광특성을 나타내었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.160-160
• /
• 2016

In this study, we applied the low temperature curing Ag paste to replace PVD System. The electrode formation of low temperature curing Ag paste for silicon Hetero-junction solar cells is important for improving device characteristics such as adhesion, contact resistance, fill factor and conversion efficiency. The low temperature curing Ag paste is composed various additives such as solvent, various organic materials, polymer, and binder. it depends on the curing temperature conditions. The adhesion of the low temperature curing Ag paste was decided by scratch test. The specific contact resistance was measured using the transmission line method. All of the Ag electrodes were experimented at various curing temperatures within the temperature range of $160^{\circ}C-240^{\circ}C$, at $20^{\circ}C$ intervals. The curing time was also changed by varying the conditions of 10-50min. In the optimum curing temperature $200^{\circ}C$ and for 20 min, the measured contact resistance is $19.61m{\Omega}cm^2$. Over temperature $240^{\circ}C$, confirmed bad contact characteristic. We obtained photovoltaic parameter of the industrial size such as Fill Factor (FF), current density (Jsc), open-circuit voltage (Voc) and convert efficiency of up to 76.2%, 38.1 mA/cm2, 646 mV and 18.3%, respectively.

• 한국인쇄학회지
• /
• 제26권1호
• /
• pp.97-111
• /
• 2008

BLU is a important part of the most representative LCD at flat panel display. In order to supplement the optical special quality which LCD cannot light itself, BLU is an essential property to supply with same brightness on the screen. In this study we have manufactured and characterized the low temperature calcined paste that can be used as a flat light source for LCD BLU. For the phosphor paste and intermediate paste, the low temperature calcined acryl resin was used as the binder. From the result of thermal decomposition measurement, residual carbonaceous materials was found to be less than 0.2wt% at $400^{\circ}C$.

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2010년도 추계학술대회 초록집
• /
• pp.53.2-53.2
• /
• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• Macromolecular Research
• /
• 제12권4호
• /
• pp.391-398
• /
• 2004

Thick-film photolithography is a new technology that combines lithography processes, such as exposure and development, with the conventional thick-film process applied to screen-printing. In this study, we developed a low-temperature cofireable silver paste applicable for thick-film processing to form fine lines using photolitho-graphic technologies. The optimum paste composition for forming fine lines was investigated. The effect of processing parameters, such as the exposing dose, had on the fine-line resolution was also investigated. As the result, we found that the type of polymer and monomer, the silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of the fine lines. The developed photoimageable silver paste was printed on a low-temperature cofireable green sheet, dried, exposed, developed in an aqueous process, laminated, and then fired. Our results demonstrate that thick-film fine lines having widths < 20 $\mu\textrm{m}$ can be obtained after cofiring.

• Journal of Electrochemical Science and Technology
• /
• 제13권4호
• /
• pp.453-461
• /
• 2022

A chemically sintered and binder-free paste of TiO₂ nanoparticles (NPs) was prepared using a binary-liquid mixture of 1-octanol and CCl₄. The 1:1 (v/v) complex of CCl₄ and 1-octanol easily interacted chemically with the TiO₂ NPs and induced the formation of a highly viscous paste. The as-prepared binary-liquid paste (P_BL)-based TiO₂ film exhibited the complete removal of the binary-liquid and residuals with the subsequent low-temperature sintering (~150℃) and UV-O₃ treatment. This facilitated the fabrication of TiO₂ photoanodes for flexible dye-sensitized solar cells (f-DSSCs). For comparison purposes, pure 1-octanol-based TiO₂ paste (P_O) with moderate viscosity was prepared. The P_BL-based TiO₂ film exhibited strong adhesion and high mechanical stability with the conducting oxide coated glass and plastic substrates compared to the P_O-based film. The corresponding low-temperature sintered P_BL-based f-DSSC showed a power conversion efficiency (PCE) of 3.5%, while it was 2.0% for P_O-based f-DSSC. The P_BL-based low- and high-temperature (500℃) sintered glass-based rigid DSSCs exhibited the PCE of 6.0 and 6.3%, respectively, while this value was 7.1% for a 500℃ sintered rigid DSSC based on a commercial (or conventional) paste.

• 한국인쇄학회:학술대회논문집
• /
• 한국인쇄학회 2007년도 추계 학술논문 발표회
• /
• pp.75-81
• /
• 2007

As manufacturing the low temperature firing paste applicable flat light source for LCD BLU, this study examined the specific quality. For the phosphor pastes, the low temperature firing acryl resin is used as the binder resin. As the result of thermal decomposition characteristics, residual hydroxylcarbon rested under 0.1wt% on 400$^{\circ}C$. With the manufactured paste in this study, the flat light source device is manufactured through the screen printing and it brought the almost 100% of special quality radiation about the phosphor brightness.

• 열처리공학회지
• /
• 제19권4호
• /
• pp.219-224
• /
• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• 한국전기전자재료학회논문지
• /
• 제32권1호
• /
• pp.53-57
• /
• 2019

Recently, the application field of solar panels is increasing. Accordingly, the demand for flexible devices is also steadily increasing. It is therefore necessary to develop $TiO_2$ paste for low-temperature annealing for flexible DSSC fabrication. In this study, the $TiO_2$ paste for low-temperature annealing with varying molar ratio of titanium isopropoxide (TTIP) was prepared, and DSSC was fabricated and its characteristics were compared. As a result, there was no deformation of the particles on the surface in the SEM data. However, the highest open circuit voltage, short circuit current, and fill factor were measured in the DSSC unit cell prepared by adding 0.5 mol of TTIP to the $TiO_2$ paste, and the highest efficiency was 4.148%.

• 한국재료학회지
• /
• 제29권3호
• /
• pp.183-188
• /
• 2019

Flexible dye-sensitized solar cells using binder free $TiO_2$ paste for low temperature sintering are developed. In this paste a small amount of titanium gel is added to a paste of $TiO_2$ nanoparticle. Analysis of titanium gel paste prepared at $150^{\circ}C$ shows that it has a pure anatase phase in XRD and mesoporous structure in SEM. The formation of the titanium gel 1-2 nm coated layer is confirmed by comparing the TEM image analysis of the titanium gel paste and the pristine paste. This coating layer improves the excited electron transfer and electrical contact between particles. The J-V curves of the organic binder DSSCs fabricated at $150^{\circ}C$ shows a current density of $0.12mA/cm^2$ and an open-circuit voltage of 0.47 V, while the titanium gel DSSCs improves electrical characteristics to $5.04mA/cm^2$ and 0.74 V. As a result, the photoelectric conversion efficiency of the organic binder DSSC prepared at low temperature is as low as 0.02 %, but the titanium gel paste DSSCs has a measured effciency of 2.76 %.