• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.15-23
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• 2015

Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

• 한국의류산업학회지
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• 제14권6호
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• pp.1024-1031
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• 2012

The thermal bonding PET fabrics were produced through high temperature steaming (HTS) of low melting PET yarn as warp and composite fancy yarn containing low melting PET yarn as weft. The low melting PET yarn of sheath-core structure consisted of a regular PET in core portion and low melting PET in sheath portion. The composite fancy yarn consisted of regular PET yarn as inner part and effect part and low melting PET yarn as binding part. This study was carried out to investigate the melting behavior of thermal bonded PET fabric, the effect of HTS on the thermal bonding, mechanical properties, and dyeing properties. The melting peak of low melting PET yarn showed two melting peaks caused by sheath-core structure. Almost the entire thermal bonding of the fancy PET fabrics containing low melting PET yarn has formed at $200^{\circ}C{\times}3min$ of HTS. The tensile strength in warp and weft direction of the fancy PET fabrics slightly decreased as temperature of HTS increased. The total K/S value of the fancy PET fabrics decreased slightly to $180^{\circ}C{\times}3min$ of HTS, while increased slightly above $200^{\circ}C{\times}3min$ of HTS. The changes in the hue angle ($H^{\circ}$) of the thermal bonded fancy PET fabrics dyed with disperse dyes hardly ever happened.

• 한국세라믹학회지
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• 제31권4호
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• 한국안전학회지
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• 제18권2호
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• pp.79-85
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• 2003

In this study, the behavior characteristics of specimen strengthened with CFRP plate were analyzed according to the change of temperature. CFRP plate itself has a good resistance at the high temperature, but epoxy used as a adhesive is lost its bonding strength at the relatively low temperature. Therefore, this study carries out experiment on the beams slot-bonded with CFRP plates in order to maintain the successful bonding strength of epoxy at high temperature. It is presented that the range of glass transition temperature is 60-8$0^{\circ}C$ and RC beams slot-bonded with CFRP plate shows more increasing resistance and failure load than that of interface bonded at the high temperature.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 마이크로전자및패키징학회지
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• 제31권3호
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• pp.1-9
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• 2024

본 논문은 반도체 패키징 기술의 발전에서 Cu/Polymer 하이브리드 본딩 기술의 중요성을 다룬다. 인공지능(AI) 시대의 요구에 부응하여, 반도체 업계는 높은 I/O 수, 저전력, 고열 방출, 다기능성, 소형화를 달성하기 위해 이종 집적 패키징 기술을 탐구하고 있다. 기존의 Cu/SiO₂ 하이브리드 구조는 1nm 이하의 표면거칠기 달성을 위한 CMP 공정과의 호환성 및 파티클 원인의 접합부 결함 발생 등의 한계점이 존재하지만, Polymer를 사용한 Cu/Polymer 하이브리드 본딩 기술이 이를 극복할 수 있는 대안으로 주목받고 있다. 본 연구는 Cu/Polymer 하이브리드 본딩에 필요한 Polymer의 증착, 패터닝, 그리고 물성 변화를 중점적으로 탐구하며, 이를 통해 Cu/Polymer 하이브리드 본딩 구조가 기존 기술 대비 갖는 장점과 잠재적 응용 가능성을 제시한다. 특히, 낮은 유리전이온도(Tg)를 가진 Polymer의 사용이 가질 수 있는 저온 접합 공정에서의 이점과 높은 열팽창계수로 인한 기계적 특성의 향상에 대해 논의된다. 또한, Polymer의 표면 특성 변화와 플라즈마 처리를 통한 접합 메커니즘의 개선을 다루며, 본 연구는 Cu/Polymer 하이브리드 본딩 기술이 반도체 업계의 고성능, 저전력 소자 개발에 기여할 수 있는 중요한 돌파구가 될 것임을 강조한다.

• Journal of Welding and Joining
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• 제20권4호
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 한국주조공학회지
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• 제38권1호
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• pp.16-26
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• 2018

In this study, the effects of the pouring temperature, preheating temperature, surface condition and fraction of the wear resistant part on the production of duo-castings were investigated using a high Cr white cast iron with excellent abrasion resistance and a low Cr alloy steel with good toughness. The constituent materials of the duo-castings were designed to have high hardness, fracture toughness and abrasive wear resistance for the replacement of high Mn alloy steels with low abrasive wear resistance. In particular, the amount of abrasive wear of 17% Cr white cast iron was about 1/20 of that of high Mn alloy steel. There was an intermediate area of about 3mm due to local melting at the bonding interface of the duo-castings. These intermediate regions were different from those of the constituent materials in chemical composition and microstructure. This region led to fracture within the wear resistant part rather than at the bonding interface in the bending strength test. The bending fracture strengths were 516-824 MPa, which were equivalent to the bending proof strength of high Mn steel. The effects of various casting conditions on the duo-cast behavior were studied by simple pouring of low Cr alloy steel melt, but the results proved practically impossible to manufacture duo-castings with a sound bonding interface. However, the external heating method was suitable for the production of duo-castings with a sound bonding interface.

• 한국전기전자재료학회논문지
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• 제19권12호
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• pp.1106-1111
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• 2006

To improve warpage, delamination and the chemical reaction between 2 different co-fired materials, the bonding behavior with common glass was studied. As shown in the previous paper, the phenomenon of the infiltration is different with the composition of the glass. In particular, in the case of low temperature melting glass, infiltration is experimented in this study. GA-1 glass is infiltrated among $BaTiO_3$ particles below $800^{\circ}C$ and is made by glass/ceramic composite. Until the laminate is fired under $850^{\circ}C$, provskite phase is observed. Although in the case of GA-12 glass, the temperature of the glass infiltration is lower than it of GA-l glass, the perovskite phase already disappears at $800^{\circ}C$. As a result, GA-1 and GA-12 glasses are infiltrated among particles at low temperature, however, the chemical reactivity of the glass/ceramic and sintering temperature should be considered.

• 마이크로전자및패키징학회지
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• 제28권4호
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• pp.109-114
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• 2021

상압 수소 플라즈마 전처리가 구리-구리 직접 본딩에 미치는 영향에 대해서 조사하였다. 상압 수소 플라즈마 처리를 통해 구리 박막의 표면 산화층을 환원시킬 수 있었음을 GIXRD 분석을 통해 확인하였다. 플라즈마 파워가 크고 플라즈마 처리 시간이 길수록 환원력 및 표면 거칠기 관점에서 효과적이었다. DCB를 이용한 계면 결합 에너지 측정에서 상압 수소 플라즈마 전처리 후 300℃에서 본딩한 경우 양호한 계면 결합 에너지를 나타내었으나, 본딩 온도가 낮아질수록 계면 결합 에너지가 낮아져 200℃에서는 본딩이 이루어지지 않았다. 습식 전처리의 경우 250℃ 이상에서 본딩한 경우 강한 결합력을 보였으며, 200℃에서는 낮은 계면 결합 에너지를 나타내었다.