• 한국신뢰성학회지:신뢰성응용연구
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• 제7권3호
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• pp.127-136
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• 2007

The accelerated life tests(ALTs) and degradation characteristics of image intensifier assembly(KIT-7) under low illuminance and high temperature were investigated. The accelerated life tests were carried out at $5{\times}10^5\;fc-40^{\circ}C,\;10{\times}10^5\;fc-40^{\circ}C,\;5{\times}10^5\;fc-50^{\circ}C,\;10{\times}10^5\;fc-50^{\circ}C$ and relationship related to illuminance and temperature was used as an accelerated life test model. An ALTA program[6] was used to calculate an acceleration factor and the test of life distribution fit, and estimate three parameters of an life test model. To sum up, MTTF 10,000 h at $5{\times}10^{-5}\;fc-40^{\circ}C$ of image intensifier assembly was certificated.

• Nuclear Engineering and Technology
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• 제53권10호
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• pp.3207-3216
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• 2021

Three-dimensional structures of a vortical flow field and heat transfer characteristics in a partially blocked 7-pin fuel assembly mock-up of sodium-cooled fast reactor have been investigated through a numerical analysis using a commercial computational fluid dynamics code, ANSYS CFX. The simulation with the SST turbulence model agrees well with the experimental data of outlet and cladding wall temperatures. From the analysis on the limiting streamline at the wall, multi-scale vortexes developed in axial direction were found around the blockage. The vortex core has a high cladding wall temperature, and the attachment line has a low cladding wall temperature. The small-scale vortex structures significantly enhance the convective heat transfer because it increases the turbulent mixing and the turbulence kinetic energy. The large-scale vortex structures supply thermal energy near the heated cladding wall surface. It is expected that control of the vortex structures in the fuel assembly plays a significant role in the convective heat transfer enhancement. Furthermore, the blockage plate and grid spacer increase the pressure drop to about 36% compared to the bare case.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.185-189
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• 2002

Flexible displays such as plastic based LCDs and organic light-emitting diodes for mobile communication devices have been researched and developed at KETI in KOREA since 1997. The Plastic film substrate has so poor thermal tolerance and non-rigidness that the fabrication of active devices and panel assembly have to perform at low temperature and pressure. In addition, high thermal expansion of the substrate is also a serious problem for reliable metallic film deposition. In this paper, we investigated particularly on the fundamental characteristics of various plastic substrates and then, suggested novel methods that improve the fabrication processes of plastic LCD panel. In order to maintain stable substrate surface and uniform cell gap during panel assembly, we utilized newly-invented iii and vacuum chuck. Electro-optical characteristics of fabricated plastic LCD are better than or equivalent to those of typical glass based LCDs though it is thinner, lighter-weight and more robust.

• 한국광학회지
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• 제15권4호
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• pp.349-354
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• 2004

XFP(10 Gb/s Small Form Factor Pluggable) 트랜시버 모듈에 사용되는 광송신 서브어셈블리(TOSA: Transmitter Optical Sub-assembly)를 열적, 전기적 측면에서 설계, 제작 및 평가하였다. 저가격이며 소형인 TOSA를 제작하기 위해서 바이어스 티 및 정합저항등을 AlN서브마운트 위에 집적하였다. 10 Gb/s의 초고속 전기 신호의 입력을 위해 CPW형 마이크로파 전송로를 스템 구조체내에 도입하였다. 소자의 전기적 특성 분석을 위해 서브마운트내에 실장되는 각종 전기광학 부품들과 스템 구조체들을 고속회로 모델링 하였다. 제작한 TOSA의 특성평가를 통해, 85$^{\circ}C$에서 11 GHz 이상의 -3 dB 대역폭을 얻을 수 있었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Progress in Superconductivity
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• 제12권1호
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• pp.41-45
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• 2010

Low temperature micro-calorimeters have been employed in the field of high resolution alpha spectrometers. These alpha detectors typically consist of a superconducting or metal absorber and a temperature sensor. The temperature sensor can be a transition edge sensor (TES), a metallic magnetic calorimeter (MMC) or other low temperature detectors for an accurate measurement of temperature change due to an alpha particle absorption. We report a recent study of the heat flow between a replaceable absorber and a temperature sensor. A piece of gold foil in $2.4{\times}2.7{\times}0.03\;mm^3$ is used as an absorber. A $40\;{\mu}m$ diameter Au:Er paramagnetic sensor is attached to another small piece of gold foil in $400{\times}200{\times}30\;{\mu}m^3$ to serve as the temperature sensor. This sensor assembly, Au:Er and gold foil, is placed on a miniature SQUID susceptometer in a gradiometric configuration. The thermal connection between the absorber and the sensor was made with three gold bonding wires. The measured thermal conductance shows a linear dependence to the temperature. The values are in a good agreement with Wiedemann-Franz type thermal conductance of the gold wires.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.516-519
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• 1996

Sub-assembly in ship manufacturing is a sequence of filet joint welding of stiffeners on metal panels and the process is different depending on companies. In this paper, we introduce a new intelligent robotic system of the sub-assembly process in Samsung Heavy Industry, where one shift of 22m * 9m workspace includes one to ten panels and each panel includes up to 10 stiffeners. The inherent problems such as several hundreds of different panels, unstructured task environment and the large scale do not allow a fixed automation, but needs highly intelligent versatile automation. The robotic system is composed of four 14DOF macro-mini robots and a task recognition system. Application of this system has verified the task specification such as low temperature environment(-10.deg. C) and productivity is satisfied successfully.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of Astronomy and Space Sciences
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• 제30권4호
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• pp.307-314
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• 2013

Infrared optical systems are operated at low temperature and vacuum (LT-V) condition, whereas the assembly and alignment are performed at room temperature and non-vacuum (RT-NV) condition. The differences in temperature and pressure between assembly/alignment environments and operation environment change the physical characteristics of optical and opto-mechanical parts (e.g., thickness, height, length, curvature, and refractive index), and the resultant optical performance changes accordingly. In this study, using input relay optics (IO), among the components of the Immersion GRating INfrared Spectrograph (IGRINS) which is an infrared spectrograph, a simulation based on the physical information of this optical system and an actual experiment were performed; and optical performances in the RT-NV, RT-V, and LT-V environments were predicted with an accuracy of $0.014{\pm}0.007{\lambda}$ rms WFE, by developing an adaptive fitting line. The developed adaptive fitting line can quantitatively control assembly and alignment processes below ${\lambda}/70$ rms WFE. Therefore, it is expected that the subsequent processes of assembly, alignment, and performance analysis could not be repeated.