• Proceedings of the KWS Conference
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• 2002.10a
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• pp.539-544
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• 2002

Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature (about 1000 C) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at 900 C or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point 825 C) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: 825 C) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of 820 C or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

• International Journal of Korean Welding Society
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• v.2 no.2
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• pp.14-18
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• 2002

Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature ( about $1000^{\circ}C$ ) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at $900^{\circ}C$ or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point: $825^{\circ}C$) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: $825^{\circ}C$) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of $820^{\circ}C$ or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

• Particle and aerosol research
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• v.9 no.1
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• pp.31-36
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• 2013

In this study, Mo metal powder was prepared by hydrogen reduction of Mo trioxides with different purity of 2N and 3N grades. We have obtained Mo metal powder with oxygen content of 1450 ppm by hydrogen reduction and subsequent heat treatment for degassing. Using the Mo metal powder, a low-oxygen Mo ingot was prepared by repetitive vacuum arc melting. The oxygen content of the obtained Mo ingot was less than 70 ppm after vacuum arc melting for 30 min. The purity of the Mo metal powder and the ingot was evaluated using glow discharge mass spectrometry. The purity of the respective Mo ingots was increased to 3N and 4N grades from the Mo powder of 2N and 3N grades after the repetitive vacuum arc melting. The low oxygen Mo ingot thus can be used as a raw material for sputtering targets.

• Journal of the Korean Ceramic Society
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• v.11 no.1
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• pp.3-9
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• 1974

The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.126-131
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• 2008

In this investigation, various factors affecting manufacturing conductive inks are presented, examined and discussed. The discussion includes inherent difficulties in making conductive inks successful and at the same time offers ways in which these difficulties might be overcome. One of the solutions to overcome such difficulties is to use low melting metals and alloys. This aspect is also detailed.

• Journal of Korea Foundry Society
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• v.22 no.5
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• pp.265-270
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• 2002

A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.191-200
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• 2012

The purpose of this paper is to review the state of laser processing technology using metal powders. In recent years, a series of research and development efforts have been undertaken worldwide to develop laser processing technologies to fabricate metal-based parts. Layered manufacturing by the laser melting process is gaining ground for use in manufacturing rapid prototypes (RP), tools (RT) and functional end products. Selective laser sintering / melting (SLS/SLM) is one of the most rapidly growing rapid prototyping techniques. This is mainly due to the processes's suitability for almost any materials, including polymers, metals, ceramics and many types of composites. The interaction between the laser beam and the powder material used in the laser melting process is one of the dominant phenomena defining feasibility and quality. In the case of SLS, the powder is not fully melted during laser scanning, therefore the SLS-processed parts are not fully dense and have relatively low strength. To overcome this disadvantage, SLM and laser cladding (LC) processes have been used to enable full melting of the powder. Further studies on the laser processing technology will be continued due to the many potential applications that the technology offers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Laser Solutions
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• v.7 no.1
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• pp.37-47
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• 2004

Laser-assisted selective infiltration is a new method of building metal layers to make metal parts layer by layer, in which superheated microscopic metal droplets are infiltrated into a laser-preheated layer of microscopic metal powders. In this work, the selective infiltration of a low melting-point metal, Sn-37Pb wt%, was conducted to investigate the effects of such dominant parameters as superheating temperature, Nd:YAG laser power for preheating, substrate temperature, etc. The optimal conditions for successful selective infiltration of a single layer of microscopic metal powder were experimentally obtained