• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.760-763
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• 2003

Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.

• Transactions on Electrical and Electronic Materials
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• v.13 no.1
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• pp.23-26
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• 2012

A zero-shrinkage sintering process in which the shrinkage of x-y axis is controlled to be zero is in great demand due to the trend of high integration in the ceramic modules. Among the zero-shrinkage sintering processes that are available, the proposed glass infiltration method where the viscous but fluidic glass infiltrates of the $Al_2O_3$ particles in the structure of $Al_2O_3$/glass/$Al_2O_3$ during firing is one of the applicable methods. However, the above proposed glass infiltration method has the problem of the warpage-like delamination. This occurred at the outermost surface of the multiple-bundle substrate. It is thought that the decomposed gas rapidly expands in low viscous glass to create vacant space. To solve this problem, the vacant space was tamped with $Al_2O_3$ particles to lead to the actual improvement of the sintered properties. With 15 wt% of tamping $Al_2O_3$ particles in glass, most of the vacant space disappeared. Fully densified zero-shrinkage substrate without delamination can be obtained.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.4
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• pp.219-224
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• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.39-43
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• 1997

Effects of B$_2$O$_3$ addition in the Li$_2$O-MgO-MgF$_2$-SiO$_2$g1ass system were investigated in order to make glass-ceramics for low temperature firing substrate. Base glass was made by melting at 145$0^{\circ}C$ . This glass was analyzed by THA and DTA to settle nucleation and crystallization temperature. After crystallization. crystal phase and microstructure were absorvated by XRD and SEM. Glass powders were made by water swelling method. Average particle size was 5.44${\mu}{\textrm}{m}$

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.323-329
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• 2009

Influences of ceramic filler types and dose on the sintering, phase evolution, and dielectric properties of ceramic/CaO-$Al_2O_3-SiO_2$ glass composites were investigated. All of the specimens were sintered at $900^{\circ}C$ for 2 h, which conditions are required by the lowtemperature co-firing ceramic (LTCC) technology. Ceramic fillers of $Al_2O_3,\;SiO_2$, kaolin, and wollastonite were used. The addition of $Al_2O_3$ filler yielded the crystalline phases of alumina and wollastonite, and the densification over 95% of the relative density was achieved up to 50 wt% addition of the filler. For the cases of the fillers of $SiO_2$, kaolin, and wollastonite, crystalline phases of quartz, mullite, and wollastonite formed, while the densification decreased monotonically with the filler addition. In overall, all the investigated fillers with 10 wt% addition resulted in a reasonable sintering (over 95 %) and low dielectric constants (less than 6), demonstrating the feasibility of the investigated composites for application to a LTCC substrate material with a low dielectric constant.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.5
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• pp.218-227
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• 2021

A thick film NTC thermistor for low temperature co-firing was manufactured by printing and sintering a paste prepared using NTC powder of Mn_1.5Ni_0.4Co_0.9Cu_0.4O₄ composition, lead free frit, and RuO₂ on a 96 % alumina substrate. The effect of frit and RuO₂ on the electrical properties of thick film NTC thermistor was studied. The resistance of the thick film NTC thermistor was higher than that of the bulk phase sintered at the same temperature, but it was found that the negative resistance temperature characteristic appeared more clearly and linearly in the resistance - temperature characteristic. On the other hand, the area resistance decreased as the sintering temperature increased, and the area resistance increased as the amount of frit added increased. The B constant of the thick film NTC thermistor was 3000 K or higher. Among them, it was found that the B constant of the thick film NTC thermistor made of paste with 5 wt% of frit added and sintered at 900℃ showed the highest B constant. Also, it can be seen that the area resistance decreased with the addition of RuO₂, and the change in the area resistance decrease of the thick film NTC thermistor obtained by sintering the paste containing 5 wt% of RuO₂ at 900℃ is the most obvious.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.5
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• pp.397-404
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• 2009

Effects of ceramic filler types and dose on the low temperature sintering and dielectric properties of ceramic/$CaO-Al_2O_3-SiO_2$ (CAS) glass composites were investigated. All of the specimens were sintered at $850{\sim}900^{\circ}C$ for 2 h, which conditions are required by the low-temperature co-firing ceramic (LTCC) technology. Ceramic fillers of $CaCO_3$, $Al_2O_3$, $CaCO_3-Al_2O_3$ mixture, and $CaCO_3-Al_2O_3$ compound ($CaAl_2O_4$), respectively, were used. The addition of $Al_2O_3$ yielded the crystalline phase of alumina, which was associated with the inhibition of sintering, while, $CaCO_3$ resulted in no apparent crystalline phase but the swelling was significant. The additions of $CaCO_3-Al_2O_3$ mixture and $CaAl_2O_4$, respectively, yielded the crystalline phases of alumina and anorthite, and the sintering properties of both composites increased with the increase of filler addition and the sintering temperature. In addition, the $CaAl_2O_4$/CAS glass composite, sintered at $900^{\circ}C$, demonstrated good microwave dielectric properties. In overall, all the investigated fillers of 10 wt% addition, except $CaCO_3$, yielded reasonable sintering (relative density, over 93 %) and low dielectric constant (less than 5.5), demonstrating the feasibility of the investigated composites for the application of the LTCC substrate materials.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.43.1-43.1
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• 2010

In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

• Journal of the Microelectronics and Packaging Society
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• v.3 no.2
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• pp.27-38
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• 1996

Lithium fluorhectorite 결정상을 함유한 glass ceramics 분말의 형성과 제조된 glass ceramics 분말을 이용한 저온 소결기판의 특성평가를 하였다. Li2O-MgO-MgF2-SiO2 계 유 리로 핵형성 및 결정 성장을 실시하여 lithium fluorhectorite 결정상을 지닌 glass ceramics 를 제조하였다. 유리시편의 핵형성 온도는 46$0^{\circ}C$였고 결정성장온도는 600, 640, 110$0^{\circ}C$에서 나타났다. $600^{\circ}C$에서의 결정상으 Li2.4LiSi4O10F2가 나타났다. Li2.4Mg8LiSi4와 Li2.8Mg0.6SiO4은 lithium fluorhectorite 결정상으로 되기 위한 중간상임을 확인할수 있었다. 64$0^{\circ}C$에서 열처리 후 110$0^{\circ}C$에서 재열처리하여 형성된 결정은 lithium fluorhectorite 와 tridymite가 최종 결정 상으로 나타났다. 이것은 수중에서 water swelling 현상에 의하여 분말화할 수 있었다, 기판 제조용 slurry를 제조하기 위해 glass ceramics 분말에 Al2O3분말을 0,25,50wt%로 혼합한것 과 glass ceramics 분말에 potashborosilica-te glass 분말을 15, 30, 45, 60 wt% 로 배합하 여 doctor blade 법으로 green sheet를 제조하였다. green sheet 는 950~150$0^{\circ}C$로소성하여 기판의 특성을 평가하였다. 겉보기 기공율은 3.06~19,14%이었고, 전기적 특성으로 유전상수 는 3~5(100KHz)를 나타내었다.