• Structural Engineering and Mechanics
• /
• v.53 no.4
• /
• pp.645-659
• /
• 2015

This research investigates the thermoelastic transient behavior of a thermally loaded slab made of a thermal diode-like material which has two directional thermal conductivity values (low and high). Finite difference analysis is used to obtain the elastic response of the slab based on the temperature solutions. It is found that the rate of heat transfer through the thickness of the slab decreases with reducing the ratio between the low and high thermal conductivity values (R). In addition, reducing R makes the slab less responsive to the thermal load when heated from the direction associated with the low thermal conductivity value.

• New & Renewable Energy
• /
• v.2 no.2 s.6
• /
• pp.75-80
• /
• 2006

The effective thermal conductivities of $Mm(La_{0.6-0.8})Ni_{4.0}Co_{0.6}Mn_{0.2}Al_{0.2}$ [TL-492] with hydrogen and helium have been examined. Experiment results show that pressure has great influence on effective thermal conductivity in low pressure range [below 0.5 MPa]. And that influence decreases rapidly with increase of gas pressure. The reason is at low pressure, the mean free path of gas becomes greater than effective thickness of gas film which is important to the heat transfer mechanism in this research. And, carbon fibers have been used to try to enhance the poor thermal conductivity of TL-492. Three types of carbon fibers and three mass fractions have been examined and compared. Naturally, the highest effective thermal conductivity has been reached with carbon fiber which has highest thermal conductivity, and highest mass fraction. This method has acquired 4.33 times higher thermal conductivity than pure metal hydrides with quite low quantity of additives, only 0.99 wt% of carbon fiber. This is a good result comparing to other method which can reach higher effective thermal conductivity but needs much higher mass fraction of additives too.

• Journal of Ceramic Processing Research
• /
• v.19 no.6
• /
• pp.450-454
• /
• 2018

In recent years, thermal insulation coating technology for automotive engine parts has received significant attention as a means of improving the thermal efficiency of automotive engines. One of the characteristics of thermal insulation coatings is their low thermal conductivity, and, materials such as YSZ (Yttria-stabilized zirconia), which have low thermal conductivity, are used for this purpose. This research presents a study of the changes in the microstructure and thermal conductivity of $8YSZ/SiO_2$ multi compositional thermal insulation coating for different compositions, and particle size distributions of suspension, when it is subjected to suspension plasma spraying. To obtain a porous coating structure, the mixing ratio of 8YSZ and $SiO_2$ particles and the particle sizes of the $SiO_2$ were changed. The microstructure, phase formation behavior, porosity and thermal conductivity of the coatings were analyzed. The porosities were found to be 1.2-32.1%, and the thermal conductivities of the coatings were 0.797-0.369 W/mK. The results of the study showed that the microstructures of the coatings were strongly influenced by the particle size distributions, and that the thermal conductivities of the coatings were greatly impacted by the microstructures of the coatings.

• Current Applied Physics
• /
• v.18 no.12
• /
• pp.1534-1539
• /
• 2018

SnSe single crystal showed a high thermoelectric zT of 2.6 at 923 K mainly due to an extremely low thermal conductivity $0.23W\;m^{-1}\;K^{-1}$. It has anisotropic crystal structure resulting in deterioration of thermoelectric performance in polycrystalline SnSe, providing a low zT of 0.6 and 0.8 for Ag and Na-doped SnSe, respectively. Here, we presented the thermoelectric properties on the K-doped $K_xSn_{1-x}Se$ (x = 0, 0.1, 0.3, 0.5, 1.5, and 2.0%) polycrystals, synthesized by a high-temperature melting and hot-press sintering with annealing process. The K-doping in SnSe efficiently enhances the hole carrier concentration without significant degradation of carrier mobility. We find that there exist widespread Se-rich precipitates, inducing strong phonon scattering and thus resulting in a very low thermal conductivity. Due to low thermal conductivity and moderate power factor, the $K_{0.001}Sn_{0.999}Se$ sample shows an exceptionally high zT of 1.11 at 823 K which is significantly enhanced value in polycrystalline compounds.

• Carbon letters
• /
• v.11 no.4
• /
• pp.347-356
• /
• 2010

Recently, the use of thermal conductive polymeric composites is growing up, where the polymers filled with the thermally conductive fillers effectively dissipate heat generated from electronic components. Therefore, the management of heat is directly related to the lifetime of electronic devices. For the purpose of the improvement of thermal conductivity of composites, fillers with excellent thermally conductive behavior are commonly used. Thermally conductive particles filled polymer composites have advantages due to their easy processibility, low cost, and durability to the corrosion. Especially, carbon-based 1-dimensional nanomaterials such as carbon nanotube (CNT) and carbon nanofiber (CNF) have gained much attention for their excellent thermal conductivity, corrosion resistance and low thermal expansion coefficient than the metals. This paper aims to review the research trends in the improvement of thermal conductivity of the carbon-based materials filled polymer composites.

• Carbon letters
• /
• v.22
• /
• pp.25-35
• /
• 2017

The aim of the work was to investigate the thermo-electrical properties of low cost and rapidly produced randomly oriented carbon/carbon (C/C) composite. The composite body was fabricated by combining the high-pressure hot-pressing (HP) method with the low-pressure impregnation thermosetting carbonization (ITC) method. After the ITC method step selected samples were graphitized at $3000^{\circ}C$. Detailed characterization of the samples' physical properties and thermal properties, including thermal diffusivity, thermal conductivity, specific heat and coefficient of thermal expansion, was carried out. Additionally, direct current (DC) electrical conductivity in both the in-plane and through-plane directions was evaluated. The results indicated that after graphitization the specimens had excellent carbon purity (99.9 %) as compared to that after carbonization (98.1). The results further showed an increasing trend in thermal conductivity with temperature for the carbonized samples and a decreasing trend in thermal conductivity with temperature for graphitized samples. The influence of the thickness of the test specimen on the thermal conductivity was found to be negligible. Further, all of the specimens after graphitization displayed an enormous increase in electrical conductivity (from 190 to 565 and 595 to 1180 S/cm in the through-plane and in-plane directions, respectively).

• Korean Journal of Materials Research
• /
• v.30 no.2
• /
• pp.93-98
• /
• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• Macromolecular Research
• /
• v.12 no.1
• /
• pp.78-84
• /
• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Advanced Composite Materials
• /
• v.16 no.4
• /
• pp.377-384
• /
• 2007

'Green' composites were fabricated from poly lactic acid (PLA) and bamboo fibers by using a conventional hot pressing method. The insulating properties of the PLA-bamboo fiber 'green' composites were evaluated by determination of the thermal conductivity, which was measured using a hot-wire method. The thermal conductivity values were compared with theoretical estimations. It was demonstrated that thermal conductivity of PLA-bamboo fiber 'green' composites is smaller than that of conventional composites, such as glass fiber reinforced plastics (GFRPs) and carbon fiber reinforced plastics (CFRPs). The thermal conductivity of PLA-bamboo fiber 'green' composites was significantly influenced by their density, and was in fair agreement with theoretical predictions based on Russell's model. The PLA-bamboo fiber composites have low thermal conductivity comparable with that of woods.

• Proceedings of the KSME Conference
• /
• 2000.11a
• /
• pp.310-315
• /
• 2000

We analyzed thermal stress of the STS VOD ladle by the variation of material property of refractory, and determined the location of back filler using FE analysis. Thermal distribution of refractory of ladle between hot face and back face were decreased by the increasing the thermal conductivity, and thermal stress of refractory were decreased about 2 to 4 times with the decreasing the young's modulus coefficients. Back filler, which is constructed to absorb the thermal expansion of dolomite refractory, has relatively low thermal conductivity. Inner side of refractory of ladle maintained high temperature, but temperature of outer side of ladle decreased low. Consequently, inner expansion and outer contraction were appeared. and thermal stress were increased, so thermal stress by the construction of back filler were increased.