• Journal of Powder Materials
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• v.31 no.2
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• pp.146-151
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• 2024

Pure SnO₂ has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO₂ with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO₂ have a porous microstructure, with a porosity of > 40%. In pure SnO₂, a high sintering temperature of approximately 1300℃ is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO₂, the compositions of the samples were Sn_1-xTi_xO₂-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO₂, densification was shown to be improved when the samples were sintered at 950℃. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950℃.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.308-317
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• 2012

Reactive processing, such as reactive hot pressing (RHP) and reactive spark plasma sintering (R-SPS), is effective densification method to prepare $ZrB_2$-based ultra high temperature ceramics (UHTCs). The present paper reviewed some typical reactive processing of $ZrB_2$-based UHTCs. All the reactions from the starting materials in the reactive processing are thermodynamically favorable, which generate enough energy and driving force for the densification of the final products under a relatively low temperature. Besides, compared with non-reactive processing, anisotropic $ZrB_2$ grains, such as $ZrB_2$ platelets, can only be obtained in the reactive processing, resulting in an improvement of the mechanical properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1200-1204
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• 2003

In this study, in order to develop the low temperature sintering ceramics for multi-layer piezoelectric transformer, PSN-PZT system ceramics were manufactured as a function of CuO addition and their dielectric and piezoelectric characteristics were Investigated. CuO addition facilitated densification at low temperature due to the effect of Cu$_2$O-PbO liquid phase. Through the X-ray diffraction pattern study, absence of second phase unwanted was confirmed. Among the specimen to which CuO was added, the 0.6wt% CuO added specimen sintered at 900$^{\circ}C$ and 920$^{\circ}C$ showed the most excellent mechanical quality factor and electromechanical coupling factor, respectively. Besides the densification accelerator, CuO acted as a accepter and increased mechanical quality. Compared with the specimen with no addition sintered at 1150$^{\circ}C$ , the 0.6wt% CuO added specimen sintered at 920$^{\circ}C$ showed the appropriate dielectric and piezoelectric characteristics for multi-layer piezoelectric transformer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2004.04a
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• pp.19-19
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• 2004

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.3
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• pp.97-102
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• 2005

This research was a fundamental study for the low temperature sintering of PZTN by glass phase transient processing. To lower the sintering temperature, the glass phase Processing was used. Also to improve the electrical properties, the transient processing was utilized. After characterization, the various analytic techniques, such as Archimedes method for the measuring densification, x-ray diffraction patterns for the quantitative analysis of crystalline phases were utilized. Also the dielectric constant, dissipation factor, and piezoelectric coefficients were measured to evaluate the PZTN sintered at the $950^{\circ}C$ and $1050^{\circ}C$. This was confirmed that the sintering temperature of PZTN was reduced by $950^{\circ}C$ and the electrical properties were improved by the transition processing. Therefore, the glass phase transient processing can be applicable to low the sintering temperature with the dielectric and piezoelectric properties.

• Journal of Powder Materials
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• v.5 no.4
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• pp.312-318
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• 1998

The effect of the mechanical alloying of elemental Mo and Si powders on the combustion densification behavior of MoSi$_2$ was investigated. The ignition temperature of the combustion reaction of the mechanically alloyed powder was measured to be significantly lower than that of the powder mixture prepared by the low energy ball milling process. The densification of the products after the combustion reaction under compressive pressure from the mechanically alloyed powders, however, was found to be poorer than that of the products from the ball milled powder.

• Journal of the Korean Ceramic Society
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• v.32 no.6
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• pp.726-734
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• 1995

Pb(Zr0.53Ti0.47)O3 (PZT) ceramics having different microstructures were fabricated at low temperatures using calcined PZT powders with addition of excess PbO powder and/or ball milling. The effects of excess PbO and ball milling time on the microstructure, the sintering characteristic, and the mechanical properties of these ceramics were studied. Fine powders with average particle size of 0.38㎛ could be obtained by ball milling with 2.5 mm Ф zirconia balls for 120 hours. By the addition of 2mol% of excess PbO to these powders, it was possible to obtain well-densitified PZT ceramics at low sintering temperature of 980℃. Densification behavior of PZT was affected by the addition of excess PbO powder, while, grain growth was hardly affected by PbO addition. It was observed that Vicker's hardness decreased and fracture toughness increased with the increasing amount of PbO. At 1mol% excess PbO, it was shown that the minimum values of hardness and maximum fracture toughness were achieved. In addition, with increasing sintering time, the fracture toughness decreased and the hardness increased.

• Particle and aerosol research
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• v.4 no.1
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• pp.21-25
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• 2008

$Pb(Zr_{0.53}Ti_{0.47})O_3$ (PZT) was synthesized by a multiple wet dry process. Precipitates prepared from reaction between $ZrOCl_2{\cdot}8H_2O$ and $TiOCl_2$ and $NH_4OH$ in an aqueous solution was dried at $100^{\circ}C$, and calcined at $500^{\circ}C$ and $700^{\circ}C$. The mixture mixed with PbO and as-dried or calcined $Zr_{0.53}Ti_{0.47}O_4$ (ZT) powders was calcined again at 700 and $800^{\circ}C$. Well crystallized ZT and PZT were formed at even $700^{\circ}C$. PZT piezoelectric ceramics of more than 98.5% in a relative density was obtained by sintering at as low as $900^{\circ}C$.

• Journal of Powder Materials
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• v.7 no.4
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• pp.218-227
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• 2000

It is well known that the Cu-Cr alloys are very difficult to be made by conventional sintering methods. This difficulty originates both from limited solubility of Cr in the Cu matrix and from limited sintering temperature due to high vapor pressures of Cr and Cu components at the high temperature. Densification of Cu-50%Cr Powder compacts by conventional Powder metallurgy Process has been studied. Three kinds of sintering methods were tested in order to obtain high-density sintered compacts. Completely densified Cu-Cr compacts could be obtained neither by solid state sintering method nor by liquid phase sintering method. Both low degree of shrinkage and evolution of large pores in the Cu matrix during the solid state sintering are attributed to the anchoring effect of large Cr particles, which inhibits homogeneous densification of Cu matrix and induces pore generation in the Cu matrix. In addition, the effect of undiffusible gas coming from the reduction of Cu-oxide and Cr-oxide was observed during liquid phase sintering. A two-step sintering method, solid state sintering followed by liquid phase sintering, was proved to have beneficial effect on the fabrication of high-dendsity Cu-Cr sintered compacts. The sintered compacts have properties similar to those of commercial products.