• Nuclear Engineering and Technology
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• 제51권2호
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• pp.546-555
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• 2019

Since the first nuclear reactor first critical, nuclear systems has gone through four generations of history, and the fourth generation nuclear system will be truly realized in the near future. The notions of SVBR and lead-bismuth eutectic alloy coolant put forward by Russia were well received by the international nuclear science community. Lead-bismuth eutectic alloy with the ability of the better neutron economy, the low melting point, the high boiling point, the chemical inertness to water and air and other features, which was considered the most promising coolant for the 4th generation nuclear reactors. This study mainly focuses on the structural design optimization of the 4th-generation reactor coolant pump, including analysis of external characteristics, inner flow, and transient characteristic. It was found that: the reactor coolant pump with a central symmetrical dual-outlet volute structure has better radial-direction balance, the pump without guide vane has better hydraulic performance, and the pump with guide vanes has worse torsional vibration and pressure pulsation. This study serves as experience accumulation and technical support for the development of the 4th generation nuclear energy system.

• 대한방사선치료학회지
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• 제31권1호
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• pp.57-65
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• 2019

목 적: 전자선 치료에서 저 용융점 납합금과 순수 납을 이용한 차폐 시 두께증가에 따른 블록 가장자리의 산란선 영향을 알아보고자 한다. 대상 및 방법: $10{\times}10cm^2$ 어플리케이터의 Insert Frame 절반을 차폐하도록 블록을 제작하였고, 두께는 각 재질당 3, 5, 10, 15, 20 (mm)로 하였다. 공통 조건을 에너지 6 MeV, 선량률 300 MU/Min, 갠트리 각도 0, 부여선량 100 MU으로 설정하였고, 블록의 위치와 측정점의 위치, 블록재질을 각각 달리하여 블록 두께증가에 따른 상대적인 산란비율을 평행평판형 전리함과 고체팬텀으로 측정하였다. 결 과: (측정 깊이 / 블록 위치 / 블록 재질)이 (표면 / 어플리케이터 / 순수 납)일 때 블록 두께가 3, 5, 10, 15, 20 (mm) 순으로 증가함에 따라 상대선량은 15.33 nC, 15.28 nC, 15.08 nC, 15.05 nC, 15.07 nC로 측정되었다. (표면 / 어플리케이터 / 합금 납)일 때 15.19 nC, 15.25 nC, 15.15 nC, 14.96 nC, 15.15 nC로 측정되었다. (표면 / 팬텀 위 / 순수 납)일 때 15.62 nC, 15.59 nC, 15.53 nC, 15.48 nC, 15.34 nC로 측정되었다. (표면 / 팬텀 위 / 합금 납)일 때 15.56 nC, 15.55 nC, 15.51 nC, 15.42 nC, 15.39 nC로 측정되었다. (심부 / 어플리케이터 / 순수 납)일 때 16.70 nC, 16.84 nC, 16.72 nC, 16.88 nC, 16.90 nC로 측정되었다. (심부 / 어플리케이터 / 합금 납)일 때 16.83 nC, 17.12 nC, 16.89 nC, 16.77 nC, 16.52 nC로 측정되었다. (심부 / 팬텀 위 / 순수 납)일 때 17.41 nC, 17.45 nC, 17.34 nC, 17.42 nC, 17.25 nC로 측정되었다. (심부 / 팬텀 위 / 합금 납)일 때 17.45 nC, 17.44 nC, 17.47 nC, 17.43 nC, 17.35 nC로 측정되었다. 결 론: 차폐블록을 이용하여 전자선 치료를 진행할 때 블록위치는 환자 체표면보다는 어플리케이터에 삽입하고 두께는 각 사용 에너지에 해당되는 최소 적정차폐두께로 제작해야 한다. 또한 블록 가장자리 경계선으로부터 떨어진 거리에 따라 변화하는 산란선의 영향을 충분히 고려하여 치료를 시행하는 것이 바람직하다고 사료된다.

• Journal of Radiation Protection and Research
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• 제4권1호
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• pp.14-20
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• 1979

고(高)에너지 방사선(放射線) 치료(治療)에 있어서 정상조직(正常組織)의 완전차폐(完全遮蔽)를 위하여 $5{\sim}8cm$ 납두께의 부정형(不定形) 차폐(遮蔽)벽돌을 제작(製作)해야하는 난점(難點)이 있었다. 저자(著者)들은 납 30.0%, 주석 11.5% 비스므스 48.5%, 카드미늄 10.0%를 사중(四重) 공정결합(共晶結合)시켜 밀도(密度)가 $9.8g/cm^3$ 용융온도(熔融溫度)가 $68^{\circ}C$인 저용융(低熔融) 차폐물질(遮蔽物質)을 개발(開發)하여 이를 Lead Y라고 명명(名命)하였다. 제작(製作)된 Lead Y Block을 $68^{\circ}C$에서 용융(熔融)시켜 보호(保護)해야할 중요(重要)한 장기(臟器)의 형태(形態)대로 제작(製作)된 styrofoam 음형(陰形)에 부어서 차폐효과(遮蔽效果)가 큰 차폐(遮蔽)벽돌을 쉽고 안전(安全)하게 제작(製作)할 수 있었고 납보다 더 단단하고 재현성(再現性)이 크며 저렴(低廉)한 가격(價格)으로 구입(購入)이 가능(可能)하므로 방사선(放射線) 치료효과(治療效果)에 큰 도움을 줄 수 있었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• 한국정밀공학회지
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• 제19권3호
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• pp.88-94
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• 2002

Recently, the life cycle and the lead-time of a product are to be shortened in order to satisfy consumer's demand. It is thus important to reduce the time and cost in manufacturing trial products. Several technique have been developed and successfully commercialized in the market of RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome these problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP(High-Speed RP) process. HisRP is a new RP process that is combined high-speed machining with automatic filling. In filling process, Bi58-Sn alloy is chosen as filling material because of the properties of low-melting point, low coefficient of thermal expansion and no harm to environment. Also the use of filling wire it if advantage since it needs simple and flexible mechanism. Then the rapid product, for example a skull, is manufactured for aluminum material by HisRP process with an automatic set-up device thor 4-faces machining.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.28-31
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• 2001

Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.