• Title/Summary/Keyword: Low Contact Stress

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Finite Element Analysis on the Deformation Behavior Stability of Contact Sealing Rings (접촉식 밀봉 링의 변형거동 안정성에 관한 유한요소해석)

  • Kim, Chung Kyun;Kim, Do Hyun
    • Journal of the Korean Institute of Gas
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    • v.16 no.5
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    • pp.47-51
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    • 2012
  • In this study, the deformation behavior stability of sealing rings with three different cross sectional areas has been presented using a FEM technique. To investigate the deformation behavior stability, the initial compression rate of 25% has been applied to the sealing ring, which is molded with a nitrile butadiene rubber. The maximum strain, maximum stress, and maximum contact normal stress have been analyzed for the working fluid pressure of $25kgf/cm^2$. The FEM results show that the maximum strain of a hollow o-ring and a hollow rectangular ring with a hollow space in the center of a sealing ring is higher than that of a conventional o-ring, but the maximum stress and the maximum contact normal stress are low. In these results, the sealing rings with a hollow space in the center of the cross sectional area is recommended to increase an extended endurance stability of sealing rings. But, the solid sealing ring is designed to guarantee the sealing safety of a contact sealing ring.

finite Element Modeling of a Hemispherical Asperity Adhesively Contacting the Plane Surface of Semi-Infinite Rigid Body (강체평면에 흉착접촉하는 반구헝돌기의 유한요소모델링)

  • Cho, Sung-San;Park, Seung-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.11
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    • pp.2436-2441
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    • 2002
  • Finite element technique considering adhesive forces is proposed and applied to analyze the behavior of elastic hemispherical asperity adhesively contacting the plane surface of semi -infinite rigid body. It is demonstrated that the finite element model simulates interfacial phenomena such as jump -to-contact and adhesion hysteresis that cannot be simulated with the currently available adhesive contact continuum models. This simulation aiso provides valuable information on contact pressure, contact region and stress distributions. This technique is anticipated to be utilized in designing a low-adhesion surface profile for MEMS/NEMS applications since various contact geometries can be analyzed with this technique.

Effects of Contact Zone according to Geometries and Mechanical Properties of Pad for Fretting Contacts (프레팅 접촉에서 패드의 형상과 기계적 성질변화에 따른 접촉부의 영향)

  • Roh Hong-Rae;Jang Song-Koon;Cho Sang-Bong
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.125-134
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    • 2005
  • Recently, there have been reported on the results that the material life is reduced by fretting conditions and the initial crack made by low stress under fretting. The purpose of this paper is to show that the results of finite element analysis for the fretting contact problems of a flat rounded punch are nearly consistent with the theoretical solutions and to research that the results about effects of the contact zone according to geometries and mechanical properties of pad.

Contact Stress of Slewing Ring Bearing with External Pinwheel Gear Set (핀 휠을 구비한 외륜형 선회베어링의 면압강도)

  • Kwon, Soon-man
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.2
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    • pp.231-237
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    • 2015
  • The pin-gear drive is a special form of fixed-axle gear mechanism. A large wheel with cylindrical pin teeth is called a pinwheel. As pinwheels are rounded, they have a simple structure, easy processing, low cost, and easy overhaul compared with general gears. They are also suitable for low-speed, heavy-duty mechanical transmission and for occasions with more dust, poor lubrication, etc. This paper introduces a novel slewing ring bearing with an external pinwheel gear set (e-PGS). First, we consider the exact cam pinion profile of the e-PGS with the introduction of a profile shift. Then, the contact stresses are investigated to determine the characteristics of the surface fatigue by varying the shape design parameters. The results show that the contact stresses of the e-PGS can be lowered significantly by increasing the profile shift coefficient.

A STUDY OF THE PRESSURE SOLUTION AND DEFORMATION OF QUARTZ CRYSTALS AT HIGH pH AND UNDER HIGH STRESS

  • Choi, Jung-Hae;Seo, Yong-Seok;Chae, Byung-Gon
    • Nuclear Engineering and Technology
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    • v.45 no.1
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    • pp.53-60
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    • 2013
  • Bentonite is generally used as a buffer material in high-level radioactive waste disposal facilities and consists of 50% quartz by weight. Quartz strongly affects the behavior of bentonite over very long periods. For this reason, quartz dissolution experiment was performed under high-pressure and high-alkalinity conditions based on the conditions found in a high-level radioactive waste disposal facility located deep underground. In this study, two quartz dissolution experiments were conducted on 1) quartz beads under low-pressure and high-alkalinity conditions and 2) a single quartz crystal under high-pressure and high-alkalinity conditions. Following the experiments, a confocal laser scanning microscope (CLSM) was used to observe the surfaces of experimental samples. Numerical analyses using the finite element method (FEM) were also performed to quantify the deformation of contact area. Quartz dissolution was observed in both experiments. This deformation was due to a concentrated compressive stress field, as indicated by the quartz deformation of the contact area through the FEM analysis. According to the numerical results, a high compressive stress field acted upon the neighboring contact area, which showed a rapid dissolution rate compared to other areas of the sample.

The Effect of Etching on Low-stress Mechanical Properties of Polypropylene Fabrics under Helium/Oxygen Atmospheric Pressure Plasma

  • Hwang, Yoon J.;An, Jae Sang;McCord, Marian G.;Park, Shin Woong;Kang, Bok Choon
    • Fibers and Polymers
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    • v.4 no.4
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    • pp.145-150
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    • 2003
  • Polypropylene nonwoven fabrics were exposed to He/$O_2$ atmospheric pressure glow discharge plasma. Surface chemical analysis and contact angle measurement revealed the surface oxidation by formation of new functional groups after plasma treatment. Weight loss (%) measurement and scanning electron microscopy analysis showed a significant plasma etching effect. It was investigated in low-stress mechanical properties of the fabrics using Kawabata Evaluation System (KES-FB). The surface morphology change by plasma treatment increased surface friction due to an enhancement of fiber-to-fiber friction, resulting in change of other low-stress mechanical properties of fabric.

Strain-induced enhancement of thermal stability of Ag metallization with Ni/Ag multi-layer structure

  • Son, Jun-Ho;Song, Yang-Hui;Kim, Beom-Jun;Lee, Jong-Ram
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.157-157
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    • 2010
  • Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.

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Investigation of Plated Contact for Crystalline Silicon Solar Cells (결정질 실리콘 태양전지에 적용될 도금전극 특성 연구)

  • Kim, Bum-Ho;Choi, Jun-Young;Lee, Eun-Joo;Lee, Soo-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.192-193
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    • 2007
  • An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

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Contact Pressure Effect on Fretting Fatigue of Aluminum Alloy A7075-T6 (알루미늄 합금 A7075-T6의 프레팅 피로에서 접촉압력의 영향)

  • Cho, Sung-San;Hwang, Dong-Hyeon
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.5
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    • pp.531-537
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    • 2012
  • Fretting fatigue tests were conducted to investigate the effect of contact pressure on fretting fatigue behavior in aluminum alloy A7075-T6. Test results showed that when the contact pressure is so low that gross or partial slip occurs at the pad/specimen interface, fretting fatigue damage increases with the contact pressure. However, when the contact pressure is high enough to prevent slip at the interface, fretting fatigue damage decreases with the contact pressure. In order to understand how the contact pressure influence the fretting fatigue damage, finite element analyses were conducted and the analysis results were used to evaluate critical plane fretting fatigue damage parameters and their components. It is revealed that fretting fatigue damage estimated with the parameters exhibits the same variation as that in the tests. Moreover, the variation of fretting fatigue damage is closely related with that of the maximum normal stress on the critical plane rather than the strain amplitude on the critical plane.

Effect of Composition and Microstructure of Si$_3$N$_4$ Ball OH Rolling fatigue Life under Boundary Lubrication (경제윤활하에서 질화규소몰의 미세구조 및 조성이 구름피로수명에 미치는 영향)

  • 최인혁;송복한;신동우
    • Tribology and Lubricants
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    • v.16 no.6
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    • pp.477-483
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    • 2000
  • Rolling contact fatigue (RCF) tests were performed for two kinds of commercial silicon nitride balls using 4-Ball rolling contact fatigue life tester under EHL condition (Λ=8.9) and boundary lubrication condition (Λ=0.2). All the test balls were finished up to the dimensional accuracy of Grade 5 defined in KS B 2001 (Steel Balls for Ball Bearings) with a size of 8.731 mm. RCF tests were then conducted under the initial theoretical maximum contact stress 6.63 GPa and the spindle speed 10,000 rpm. All the test balls were not failed until 3.75 $\times$ 107 contact cycles and wear tracks of test balls were not conspicuous under EHL condition (Λ= 8.9). In the operations of low lambda regime (Λ= 0.2), all the test balls were surface damaged and high rolling wear resistance was achievable in fully densified using MgO 1 wt% and HIPed balls. Rolling wear of silicon nitride balls under boundary lubrication condition depend mainly on grain size and intergranular phase content of silicon nitride balls.