• Korean Journal of Optics and Photonics
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• v.16 no.2
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• pp.113-120
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• 2005

Luminous efficiency and uniformity in a LCD-BLU are mainly determined by fine scattering patterns formed on the light guide panel. We propose a novel fabrication method of 3-dimensional scattered patterns based on anisotropic etching of silicon wafers. Micro-pyramid patterns with 70.5 degree apex-angle and micro-prism patterns with 109.4 degree apex-angle can be self-constructed by the wet, anisotropic etching of (100) and (110) silicon wafers, respectively, and those patterns are easily duplicated by the PDMS replica process. Experimental results on spatial and angular distributions of irradiation from the light guide panel with the micro-pyramid patterns were very consistent with the calculation results. Surface roughness of the silicon-based micro-patterns is free from any artificial defects since the micro-patterns are inherently formed with silicon crystal surfaces. Therefore, we expect that the silicon based micro-patterning process makes it possible to fabricate perfect 3-dimensional micro-structures with crystal surface and apex angles, which may guarantee mass-reproduction of the light guide panels in LCD-BLU.

• Electrical & Electronic Materials
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• v.15 no.2
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• pp.28-35
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• 2002

• Proceedings of the Korean Ceranic Society Conference
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• 2004.10a
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• pp.96.2-96.2
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• 2004

• Proceedings of the Korean Ceranic Society Conference
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• 2000.04a
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• pp.161.2-161.2
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• 2000

• Broadcasting and Media Magazine
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• v.6 no.4
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• pp.44-56
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• 2001

• Transactions on Electrical and Electronic Materials
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• v.6 no.1
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• pp.22-24
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• 2005

We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of the SiC (Silicon Carbide) thin film. The SiC thin film exhibits good chemical and thermal stability. The good thermal and chemical stability makes SiC an attractive candidate for electronic applications. A vertical alignment of nematic liquid crystal by ion beam exposure on the SiC thin film surface was achieved. The about $87{\circ}$ of stable pretilt angle was achieved at the range from $30{\circ}$ to $45{\circ}$ of incident angle. The good LC alignment is maintained by the ion beam alignment method on the SiC thin film surface at high annealing temperatures up to $300{\circ}C$.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.736-742
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• 2000

Mass removed from crystalline silicon samples during high power single-pulse laser ablation was studied by measuring the resulting crater morphology with a white light interferometric microscope. The volume and depth of the craters show a strong nonlinear change as the laser irradiance increases across a threshold value, that is, approximately $2.2{\times}10^{10}\;W/cm^2$. Time-resolved shadowgraph images of the ablation plume show the ejection of large particulates from the sample for laser irradiance above the threshold, with a time delay of about 300-400 nsec. The thickness of superheated liquid layer near the critical temperature was numerically estimated, considering the transformation of liquid metal into liquid dielectric near the critical state (i.e., induced transparency). The estimated thickness of the superheated layer at a delay time of 200 nsec agreed with the measured crater depths, suggesting that induced transparency promotes the formation of a deep superheated liquid layer which leads to an explosive boiling responsible for the sudden increase of crater volume and depth.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.336-346
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• 1994

We studied the reaction between silicon and carbon. Silicon granules and silicon with 0.2 wt% carbon powders were prepared for sample and then they were heated up to the $1450^{\circ}C, 1550^{\circ}C, 1650^{\circ}C, 1700^{\circ}C$ and were dwelled 1 hr and 4 hrs, respectively. we studied the change of morphologies of molten silicon and the formation of SiC following the reaction withcarbon using optical microscope, SEM, and XRD. Above the melting point of silicon, oxygens are precipitated during the decomposition of quartz used crucible. SiO formed from the reaction between molten silicon and precipitated oxygen evaporated and made the surface defects. SiC were formed with the reaction between the unreacted carbon and molten silicon. Polytype of the SiC formed at the solidification interface was ${\alpha}-SiC$.

• Knowledge Management Research
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• v.12 no.1
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• pp.39-52
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• 2011

Many LCD manufacturers continue to develop the technologies of LCD manufacturing processes for the reduction of production cost, power consumption and high-resolution. The LTPS (Low Temperature Polycrystalline Silicon) crystallization technology is important for rearranging the internal structure of liquid crystal grain by adding certain energy to amorphous silicon and turning it into poly-silicon in order to manufacture LCD with better performance. We consider 14 existing technologies of LTPS crystallization in the LCD manufacturing and present an intelligent analysis methodology using patent map and AHP (Analytic Hierarchy Process) analysis for determining an optimal LTPS crystallization technology. By using patent map analysis, we easily understand the development process and mega-trend of LTPS crystallization technologies and their relationship. By using AHP analysis, we evaluate 14 LTPS technologies. Through the use of proposed methodology, we determine the Continuous Wave Laser Lateral Crystallization technology as an optimal one.

• Journal of Electrical Engineering and information Science
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• v.2 no.3
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• pp.82-87
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• 1997

Ion-Sensitive Field-Effect Transistors(ISFETs) with LPCVD silicon nitride as a sensitive gate were fabricated on the basis of a CMOS process. The silicon nitride was deposited directly on a poly silicon gate-electrode. Using a specially designed measuring cell, the hydrogen ions sensing properties of the ISFET in liquid could be investigated without any bonding or encapsulation. At first, th sensitivity was estimated by simualtions according to the site-binding theory and the experimental results were analysed and compared with simulated results. The measured dta were in good agreement with the simulated results. The silicon nitride based ISFET has good linearity evaluated from correlation factor ($\geq$0.9998) and a mean pH-sensitivity of 56.8mV/pH. The maximum hysteresis width between forward(pH=3\longrightarrowpH=11)- and backward(pH=11\longrightarrowpH=3) titration was 16.7mV at pH=6.54.