• The Journal of Korean Academy of Prosthodontics
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• v.43 no.4
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• pp.478-486
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• 2005

Statement of problem : Fracture and dimensional change of an acrylic resin denture are a rather common occurrence. Purpose : The purpose of this study was to compare differences in dimensional changes and flexural strength of separate maxillary complete dentures after immediate deflasking by injection molding and conventional compression processing. Material and method: To evaluate dimensional stability, the maxillary dentures were fabricated by using different materials and methods. Lucitone 199(Dentsply Trubyte. york, pennsylvania, USA) and Vertex(Dentimex, zeist, Netherlands) were used as materials. Compression and injection packing methods were used as processing methods. The impression surface of the dentures was measured by 3D Scann-ing System(PERCEPTRON USA) and overlapped original impression surface of the master cast. To evaluate flexural strength, resin specimens were made according to the different materials, powder/liquid ratio and processing methods. Flexural strength of the complete resin specimens (64mm$\times$10mm$\times$3.3mm) were measured by INSTRON 4467. (INSTRON, England) The data was analyzed by ANOVA, t-test and Tukey test. (p<.05 level of significance) Result: The results were as follows 1. There was no significant differences between master model and denture base for each group in overall dimensional changes. 2. Palatal area was more stable than flange or alveolar area in dimensional stability. but. there was no significant differences among each area. 3. Materials and power/liquid ratio had an effect on flexural strength. (P<.05) Especially materials was most effective. (P<.05) 4. Lucitone 199(powder/liquid ratio followed by manufacturer's direction) showed higher flexural strength than Vertex. Conclusion : Dimensional stability or flexural strength are affected by materials rather than packing techniques.

• Elastomers and Composites
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• v.43 no.2
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• pp.113-123
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• 2008

Epoxy resins are thermoset polymers that exhibit good adhesion, creep resistance, heat resistance, and chemical resistance. These polymers, however, give poor resistance to crack propagation and low impact strength. In this study, epoxy/carboxyl-terminated butadiene acrylonitrile (CTBN) and epoxy/amine-terminated butadiene acrylonitrile (ATBN) composites were prepared with different ratio of CTBN and ATBN to improve low impact strength of epoxy resin. The impact strength of epoxy/elastomeric composites shows high values with increasting nonpolar surface free energy while the tensile strength and the glass transition are decreased. The highest surface free energy, impact strength observed when 15 phr CTBN and 15 phr ATBN added, respectively. It can be concluded that as liquid rubber to improve impact strength of epoxy resin, ATBN is more preferable to CTBN.

• Analytical Science and Technology
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• v.33 no.6
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• pp.274-284
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• 2020

This study described the analytical method for simultaneous determination of 89Sr and 90Sr in liquid sample using automated separation system. Radiostrontium in 0.5 kg of liquid sample was concentrated as SrCO3 to reduce the volume of sample, and purified from the sample using Sr-resin 2 mL (BV, Bed volume). The behavior of Sr and interferences such as Ba, Ca and Y were estimated with various flow rate ranging from 1 to 4 mL min-1. The detailed procedure for the purification of Sr on Sr-resin was presented. The purified radiostronitum was measured in Cerenkov mode and then measured in Scintillation mode by mixing scintillation cocktail. The measured value in both modes were used to calculate the activity of 89Sr and 90Sr. The performance tests were carried out the lab-control-sample having various activity ratio of between 89Sr and 90Sr. The recovery of Sr was ranged from 68 to 94 %. The relative bias of 89Sr activity was ranged from -5 to 20 %, and it was ranged from -10 to 10 % for 90Sr.

• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.113-124
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• 2000

It is well known that the characteristics of liquid crystal polymer composite(LCPC) films are possessed of large-area and flexible display, polarizer free, high contrast, wide angle of visual filed and high responsiveness. In this study, we have investigated to the best optimal mixing rates chiral nematic liquid crystals and UV-curable resins having different properties acrylate moleculars. The purpose of this study has been the development of new functional application with liquid crystal polymer composite films. For example the films were applied a new thermal sensor. In results, best phase separation behaviors turned out liquid crystal/monomer/oilgomer mixture system.

• Design & Manufacturing
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• v.7 no.1
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• pp.55-59
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• 2013

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.337-341
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• 2001

A new method to extract gold from pyrite roster cinder, which combines ultra-fine-grinding with resin-in-pulp, has been studied in this paper. Compared with traditional leaching technology, it can short leaching time, avoid complex filter process, lower sodium cyanide consumption and increase gold recovery by 35%. During leaching, aluminium oxide ball was used as stirred medium, hydrogen peroxide as leaching aid and sodium hexametaphosphate as grinding aid. With the high efficiency and chemistry effect of ultra-fine-grinding, the leaching process was developed and the gold leaching rate may reach 88%. With AM-2 Б resin as abosorber and sulfocarbamide (TU) as eluent, gold was recovered from cyanide pulp by resin-in-pulp. AM-2 Б resin has good adsorbability in cyanide solution(pH=10). It was easy to elude gold from the loaded resin with 0.1㏖/L cholhydric acid and 1㏖/L sulfocabamide. The effect of contact time, temperature and acidity etc. on the gold absorption had been examined with static methods. The results showed that the adsorption and desorption of gold could both reach over 98%. The effects of flow rate of solution on dynamic adsorption and elution of gold had been examined with dynamic methods. Breakthrough curve and elution curve had been drawn in this paper. A mild condition was determined through a number of experiments: leaching time 2 hours, liquid solid ratio 4:1, sodium cyanide 3kg/t, hydrogen peroxide 0.05%, sodium hexametaphosphate 0.05%; adsorption time 30 minutes, temperature 10-3$0^{\circ}C$, resin($m\ell$) solid(g) ratio 1:10, eluent resin ratio 10-20:1, velocity of eluent $1.5m\ell$/min. Under the mild condition, the gold recovery may reach 85%.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.119-127
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• 2007

Recently, microstructures fabricated using microstereolithography technology have been used in the biological, medical and mechanical fields. Microstereolithography can fabricate real 3D microstructures with fine features, although there is presently a limited number of materials available for use in the process. Deformation of the fine features on a fabricated microstructure remains a critical issue for successful part fabrication, and part deformation can occur during rinsing or during fabrication as a result of fluid flow forces that occur during movement of mechanical parts of the system. Deformation can result in failure to fabricate a particular feature by breaking the feature completely, spatial deflection of the feature, or attaching the feature to neighboring microstructures. To improve mechanical strength of fabricated microstructures, a clay nanocomposite can be used. In particular, a high-aspect ratio microstructure can be fabricated without distortion using photocurable liquid resin containing a clay nanocomposite. In this paper, a clay nanocomposite was blended with a photocurable liquid resin to solve the deformation problem that occurs during fabrication and rinsing. An optimal mixture ratio of a clay nanocomposite was found through tensile testing and the minimal allowable distance between microstructures was found through fabrication experimentation. Finally, using these results, high-aspect ratio microstructures were fabricated using a clay nanocomposite resin without distortion.

• Journal of the Korean Wood Science and Technology
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• v.16 no.3
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• pp.17-21
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• 1988

In order to investigate the extending effects on urea-formaldehyde resin- or phenol- formal- dehyde resin- glued keruing plywood, hot pressing temperatures were controlled to 110, 140, 170 and $200^{\circ}C$. As the extender, wheat flour, persimmon bark powder, chestnut bark powder, the equivalently- extended with the above three powders, and diatomite powder were respectively mixed with 5, 10, 15 and 20% ratios to the resin liquid, and also with these the no- extended was allowed. Based on the measured bonding strength, the conclusions were drawn: 1. In the urea- formaldehyde resin, extending effects on the bonding strength were in the order of wheat flour, the equivalently- extended with the wheat flour, persimmon- and chestnut bark powder, persimmon bark powder, chestnut bark powder. In the phenol- formaldehyde resin, the effects in the order of wheat flour, persimmon bark powder, diatomite powder, chestnut bark powder were resulted in. Specifically, superior bonding strength to the no-extended were given with the wheat flour and persimmon bark powder. 2. On the whole, the bonding strength decreased gradually, as the hot pressing temperature increased except for the diatomite powder extending.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.174-179
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• 2006

The curing characteristics of a photocurable resin are critical factors that often decide the ultimate resolution and structural sharpness of a final product fabricated by microstereolithography$(\mu-STL)$. In this study, we investigated the curing characteristics of the FA1260T photopolymer under a visible laser light of 42nm wavelength. Modification of the curing property of the FA1260T is attempted to reduce the cure depth $(D_c)$ by adding a radical quencher to the resin. Also, an organic solvent was used to reduce the resin viscosity for an improvement of the flatness of the liquid surface during layer-by-layer curing. As a result, the minimum $D_c$ has been reduced over a factor of 3 with no abrupt increase. Samples of three dimensional microstructures fabricated using the modified FA1260T are presented.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.4
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.