• 한국주조공학회지
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• 제18권6호
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• pp.511-517
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• 1998

• 소성∙가공
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• 제23권2호
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• pp.88-94
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• 2014

The under-drive brake piston is an essential part in the automatic transmissions of automobiles. This component is manufactured by forging after blanking from S55C plate with a thickness of 6mm. It is difficult to design the plate forging process using a thick plate approach since there will be limited material flow as well as large press loads. Furthermore, the under-drive brake piston has a complex shape with a right angle step, which often results in die unfill and abrupt increase in press load. To overcome these obstacles, a separate die for filling material sufficiently to the corner of the right angle step is proposed. However, this approach induces an uncontrolled workpiece surface between the dies, resulting in flash. This excess flash degrades the tool life in the final machining after cold forging as well as increases the cycle time to obtain the net-shape of the part. In the current study, we propose an optimum process design using a conventional die shaped with the benefit of finite element analysis. This approach enhanced the process efficiency without sacrificing the dimensional accuracy in the forged part. As the result, the optimum plate forging process was done with a two stage die, which reduces weight of by 6% compared with previous process for the under-drive brake piston.

• Design & Manufacturing
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• 제11권1호
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• pp.7-13
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• 2017

The aim of this study is to develop the dies oven for energy-saving during the pre-heated process of extrusion dies. Applying high-efficiency near-infrared heater, single cell type dies oven was developed as a substitute for traditional chest type oven. Therefore the dies is individually heated uniformly to operation temperature so rapidly. By using the developed dies oven, electric-energy consumption of preheating extrusion dies reduced up to 30% and the waiting time in the oven also minimized up to 90min. In addition, the results have shown that it is possible to accurately control the dies temperature for improving the quality of extruded profile and to minimize die bearing oxidation and nitride layer degradation responsible for surface defects on the profile and shorter die life.

• 한국품질경영학회:학술대회논문집
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• 한국품질경영학회 2009년도 추계학술대회
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• pp.234-240
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• 2009

The growing mobile products market is expected energy efficiency. So product design is more important focusing on reducing power consumption than improving technology of color sense. A Organic light emission diode is in limelight of the best display to satisfy market expectation. A Organic light emission diode is achieved low power consumption, pixel response which was fast for its time, high contrast of brightness and wide color reproduction raio. Therefore there is a fierce competition for the organic light emission diode development between a country and another country over business. The technical value's life is short because of a fierce development competition, and there is little probability that technical success become business success. In this study, the purpose is reduce the time for life test by accelerated current and it can do production possible design by accelerated life model in design phase.

• Design & Manufacturing
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• 제2권6호
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• pp.43-48
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• 2008

Magnesium alloys have given high attention to the industry of light-weigh as automobile and electronics with aluminium, titanium and composite alloys due to their high strength, low specific density and good damping characteristics. But the magnesium contained structures under high temperature have the problems related to creep deformation and rupture life, which is a reason of developing the new material against creep deformation to use them safely. The purpose of this study is to predict the creep deformation mechanism and rupture time of AZ31 magnesium alloy. For this, creep tests of AZ31 magnesium alloy were done under constant creep load and temperature with the equipment including automatic temperature controller with acquisition computer. The apparent activation energy Qc, the applied stress exponent n and rupture life have been determined over the temperature range below 0.5Tm and stress range of 109~187MPa, respectively, in order to investigate the creep behavior. AZ31 Magnesium alloy identify the activation energy for creep deformation and the stress dependence to creep rate at below 0.5Tm, and then investigate the mechanism for creep deformation and creep rupture life of AZ31 Magnesium alloy.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.163-168
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• 2002

Hot forging is widely used in the manufacturing of industry machine component. The mechanical, thermal load and thermal softening which are happened by the high temperature in hot forging process. Tool life decreases considerably due to the softening of the surface layer of a tool caused by a high thermal load and long contact time between the tool and billet. Also, tool life is to a large extent limited by wear, heat crack and plastic deformation in hot forging process. These are one of the main factors affecting die accuracy and tool life. That is because hot forging process has many factors influencing tool life, and there was not accurate in-process data. In this research, life prediction of hot forging tool by wear and plastic deformation analysis considering tempering parameter has been carried out for automobile component. The new developed technique in this study for predicting tool life can give more feasible means to improve the tool life in hot forging process.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.942-945
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• 2005

Micron-sized metal wires are widely used in industries such as filtration, catalyst and composite materials, etc. In the wire drawing process, the die that is used conventionally is an effective and, at the same time, sensitive component. However, a typical array of the dies has caused many problems in the wire drawing process, e.g., large frictional force on the interface between wire and the resulting high heat generation, precise adjustment of the dies, extended cooling system, die abrasion, etc.. Because of these problems, there have been many works that are aiming at improving the efficiency of wire drawing process by analyzing the die geometry and by applying advanced die material to prolong the die life or even at developing a dieless wire drawing system. This paper is dealing with developing a new wire drawing system that is applicable to reduce the wire drawing steps with high draw ratio. The new wire drawing system does not use the dies, but use the self-induced heater that works on the basis of the resonant phenomenon of wire material. The electromagnetic wave is the heating source. The results of the study on the diameter reduction and microwave flow analysis show that the heating effectiveness of the wire is influenced by the energy distribution in the microwave propagation chamber. We can obtain diameter-reduced wires by using microwave in the dieless drawing process. Microwave as a heating source is capable of producing wires without applying dies in wire drawing process.

• 소성∙가공
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• 제12권1호
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• pp.18-25
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• 2003

This paper explains the process design for improving tool life in the conventional hot forging process. The thermal load and the thermal softening are happened by contact between the hotter billet and the cooler tools in hot forging process. Tool life decreases considerably due to the softening of the surface layer of a tool was caused by a high thermal load and long contact time between the tools and the billet. Also, tool life is to a large extent limited by wear, heat crack and plastic deformation in hot forging process. Above all, the main factors which affect die accuracy and tool life we wear and the plastic deformation of a tool. The newly developed techniques for predicting tool life are applied to estimate the production quantity for a spindle component and these techniques can be applied to improve the tool life in hot forging process.

• 한국해양공학회지
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• 제15권2호
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• pp.53-60
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• 2001

It was confirmed that the life predictive equation by LMP and LMP-ISM are effective only up to 10$^2$hours and can not be used for long times of $10^3~10^5$ hours, but that by ISM can be used for long times creep life prediction with more reliability. The predictive creep life equation of ISM has better reliability than those by LMP and LMP-ISM, and its realizably is getting better for long time creep prediction($10^3~10^5$ h).