• Electrical & Electronic Materials
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• v.10 no.5
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• pp.473-480
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• 1997

Surface passivation using glass powders results in good reliability for high voltage silicon power devices. In this paper Zinc borosilicate glass and Lead borosilicate glass were prepared for the purpose of passivating, and a deposition technique of glass films on the silicon surface by electrophoresis in which acetone is used as a suspension medium has been investigated. Their physical properties were compared using DTA, SEM, XRD, as a function of firing temperature, I can get the fine films of 22${\mu}{\textrm}{m}$ thickness with Lead borosilicate glass under 300 volts applied, 3 minutes and $700^{\circ}C$ firing temperature. Also I can get the fine films of 17${\mu}{\textrm}{m}$ thickness with Zinc borosilicate glass under same conditions. As a result of investigation of glass films from which glass layer was removed by placing it in HCl, it has been found that pre-firing and annealing play an important role to achieve uniform and fine glass deposition films. And also it was found that relative dielectric constant is independence of frequency.

• Journal of Powder Materials
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• v.9 no.1
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• pp.38-42
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• 2002

Effects of chemical compositions on the sintering behavior of the lead borosilicate glass developed for barrier ribs of plasma display panels were investigated in this study. Formation of pores during sintering of the glass was noted and their formation mechanism was investigated using XPS, TG/DTA, and XRD. The results indicated that pores are formed by the oxygen released from Pb-oxides during sintering.

• Journal of the Korean Ceramic Society
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• v.43 no.6 s.289
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• pp.338-343
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• 2006

The effects of lead-borosilicate glass frits on the sintering behavior and microwave dielectric properties of ceramic-glass composites were investigated as functions of glass composition of glass addition ($10{\sim}50vol%$), softening point (Ts) of the glass, and sintering temperature of the composites ($500{\sim}900^{\circ}C$ for 2 h). The addition of 50 vol% glass ensured successful sintering below $900^{\circ}C$. Sintering characteristics of the composites were well described in terms of Ts. PbO addition in to the glass enhanced the reaction with $Al_{2}O_3$ to form liquid phase and $PbAl_{2}Si_{2}O_8$, which was responsible to lower Ts. Dielectric constant(${\epsilon}_r$), $Q{\times}f_0$ and temperature coefficient of resonant frequency (${\tau}_f$) of the composite with 50 vol% glass contents ($B_{2}O_{3}:PbO:SiO_{2}:CaO:Al_{2}O_3$ = 5:40:45:5:5) demonstrated 8.5, 6,000 GHz, $-70\;ppm/^{\circ}C$, respectively, which is applicable to substrate requiring a low dielectric constant. When the same glass composition was applied sinter $MgTiO_3\;and\;TiO_2,\;at\;900^{\circ}C$ (50 vol% glass in total), the properties were 23.8, 4,000 GHz, $-65ppm/^{\circ}C$ and 31.1, 2,500 GHz, $+80ppm/^{\circ}C$ respectively, which is applicable to filter requiring an intermidiate dielectric constant.

• Journal of the Korean Ceramic Society
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• v.21 no.4
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• pp.349-354
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• 1984

The purpose of present study is to find the structure crystallization mechanism and physical properties in $TiO_2$ containing lead zinc borosilicate glass system. The experiments such as differential thermal analysis infrared spectral analysis. X-ray diffraction analysis and thermal expansion measurements have been done. Differential thermal analysis of coarse and fine glass powder showed bulk nucleating mechanism for high $TiO_2$ containing glasses and surface nucleation mechanism for low $TiO_2$ containing glasses. The prepared glasses crystallized to crystalline mixture of PbO.2ZnO. $B_2O_3$ .4PbO.2ZnO.$5B_2O_3$and 2PbO.ZnO.$B_2O_3$ when heat-treated in the range of 480 and 51$0^{\circ}C$ and crystallized to PbTiO3 when heat-treated at $600^{\circ}C$. Obtained crystalline phase of $PbTiO_3$ in glass matrix strongly affects to thermal expansion coefficient and the value of crystallized glass varied 68.0 to $107.1{\times}10-7$/$^{\circ}C$ depending on the amount of $TiO_2$added. Infrared spectral analysis showed that [$BO_3$] triangle and [$BO_3$] tetrahedral units were coexisted in the glass with high content of PbO.

• Applied Chemistry for Engineering
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• v.2 no.3
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• pp.289-299
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• 1991

In order to obtain glasses appropriate to the thick film copper conductors, nine glasses based on both lead borosilicate and leadless borosilicate systems were made and the applicabilities of them were examined in conjunction with the requirements for thick film copper conductors. As the results, it was found that all the glasses are fitted to provide suitable sheet resistance, solderability and solder leach resistance to thick film copper conductors. However, it was turned out that only the lead borosilicate based glasses worked for getting usable aged adhesion strength of copper thick film to the alumina substrate, while copper conductor films made from the other glasses had poor aged adhesion strengths. Particularly cuprous oxide added lead borosilicate glass was considered as one of the most favorable glasses for manufacturing thick film copper conductors.

• Journal of the Korean Ceramic Society
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• v.23 no.6
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• pp.33-36
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• 1986

The $PbTiO_3$is well known materials having remarkable ferroelectric piezoelectric and pyro-electric properties. Thin films of the lead titanite has been successfully fabricated by Chemical Vapor Deposition on the borosilicate glass and titanium substrate. The $PbTiO_3$ thin film deposited on the borosilicate glass using the $PbCl_2$, $TiCl_4$ dry oxygen and wet oxygen at different temperatures (50$0^{\circ}C$-$700^{\circ}C$) grows along the (001) preferred orientation. On the other hand the $PbTiO_3$ thin film deposited on the titanium substrate using the PbO grows along the (101) preferred orientation. Growth orientation of deposited $PbTiO_3$ depends on the reaction species irrespective of substrate materials. Maximum dielectic constant and loss tangent of the $PbTiO_3$ thin film deposited on the titanium substrate are about 90 and 0.02 respectively, . Deposition rates of $PbTiO_3$ deposited on the borosilicate glass and titanium substrate are 10-15 ${\mu}{\textrm}{m}$/hr. Titanium dioxide interlayer formed be-tween $PbTiO_3$ film and titanium substrate material, It improved the adhesion of the film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.363-364
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• 2005

LTCC(low temperature co-fired ceramics)용 glass/ceramic 복합체를 제조하기 위해 3종류 의 glass를 선정하고 filler로 $Al_2O_3$ 와 $TiO_2$를 사용하여 glass frit에 따른 소결 및 유전 특성에 대하여 조사하였다. Glass frit은 lead-borosilicate(PBS), zinc-borosilicate(ZBS), bismuth-borosilicate(BBS) glass 조성을 사용하였고 1100~$1400^{\circ}C$에서 melting시킨 후 quenching하여 frit화하였다. $Al_2O_3$와 $TiO_2$ filler에 10~50 vol%로 glass frit을 각각 혼합한 후 600~$950^{\circ}C$에서 2시간 동안 소결한 결과 50 vol% glass frit 일 때 $900^{\circ}C$ 이하에서 소성이 가능하였다. 유전특성은 $900^{\circ}C$에서 $Al_2O_3$-50vol%PBS($\varepsilon_{r}$=8.8, $Q{\times}f_o$=4,900, $\tau_f$=-24), $Al_2O_3$-50vol% ZBS($\varepsilon_{r}$=5.7, $Q{\times}f_o$=17,800, $\tau_f$=-21), $Al_2O_3$-50vol%BBS($\varepsilon_{r}$=11.1, $Q{\times}f_o$= 2,080, $\tau_f$=-48), $TiO_2$-50vol%PBS($\varepsilon_{r}$=18.6, $Q{\times}f_o$=3,800, $\tau_f$=+135), $TiO_2$-50vol%ZBS($\varepsilon_{r}$=36.4, $Q{\times}f_o$= 7,500, $\tau_f$=+159), $TiO_2$-50vol%BBS($\varepsilon_{r}$=56.4, $Q{\times}f_o$=520, $\tau_f$=+119)을 나타내었다. 따라서 LTCC용 기판재료 및 마이크로파 유전체로 응용이 가능한 것으로 확인되었다.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1252-1254
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• 2005

Recently, PDP barrier ribs require the formation of complex structure so that they are usually formed by etching method. For producing the fine ribs structure, during the etching process the metal ions of matrix (glass) of barrier materials should be understood on the etching mechanism with etching condition. We analyzed the quantity of Pb, Si, and B ions from the etch solution as a function of etching time.

• Journal of the Korean Ceramic Society
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• v.30 no.11
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• pp.974-978
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• 1993

Glass viscosity effects on the electrical properties and microstructure of RuO2 based thick film resistors (TFR) using alumina modified lead borosilicate glasses were studied. AT 85$0^{\circ}C$, the glass viscosities were increased from 4.24Pa.s to 51.5Pa.s when the alumina was added from none to 14 weight percent to the standard glass of 63% PbO, 25% B2O3 and 12% SiO2. The resistivities of resistors were generally decreased and the microstructure development was retarded as the viscosity of the glass increased. This is contrary to the generally accepted thought that the low resistivity is due to fast microstructure development kinetics in TFR. Even though the glass viscosity retards the microstructure development kinetics, the overall network formations are favored for higher viscosity of glass, such that the sheet resistivities were decreased as the glass viscosity increased.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.50-54
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• 1999

Plasma display panel is a potential candidate for HDTV, due to the fact that the screen size can easily be increased by a thick film technology. In this study, transparent dielectric materials which satisfied the requirements of dielectrics for PDP was developed using lead alumina borosilicate glasses. The Paste which had thixotropic behavior suitable for screen printing was made of this glass composition. the paste became more thixotropic as the particle size decreased. After firing, the cross sectional area of the thick film was analyzed by SEM. The voids in the thick film were removed using bimodal particle system. The dielectric thick film showed good adhesion characteristics.