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Ha, Chang-Wan;Yun, Won-Soo;Park, Keum-Saeng;Kim, Kyung-Soo
- Journal of the Korean Society for Precision Engineering
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- v.27 no.7
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- pp.7-12
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- 2010
In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.
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Shin, Young-Eui;Pak, Jin-Suk;Son, Sun-Eik
- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.22 no.8
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- pp.625-631
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- 2009
In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.
https://doi.org/10.4313/JKEM.2009.22.8.625 인용 PDF KSCI