• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.3
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• pp.187-191
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• 2019

Advances in laser technology have enabled ultra-high-speed ultra-precise processing, thus expanding potential applications to the semiconductor, medical, and photovoltaic industries. In particular, laser scribing technology has been applied to the production of shingled solar modules. In this work, we analyze the effect of laser scribing conditions, e.g., scribing depth, on the characteristics of the resulting divided solar cells. When the scribing depth was greater than $100{\mu}m$, the solar cells were well separated. In addition, the desired scribing depths were reached in fewer scans when the laser spot overlap was 100%. The efficiency of the divided cells decreased due to the high series resistance at scribing depths of less than $100{\mu}m$. However, at scribing depths of approximately $100{\mu}m$, the series resistance was low and efficiency reduction was minimized.

• Journal of the Korean Ceramic Society
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• v.37 no.1
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• pp.57-62
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• 2000

In this study, an attempt was made to demonstrate the possibility of using laser scribing method in manufacturing the barrier ribs of plasma display panel. The scribing with a CO2 laser was conducted on the green tape produced by the doctor blade tape casting method. Among the processing parameters, the quenching gas pressure, shape of mask, and laser power were found to affect the depth and angle of the scibed barrier ribs.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.5
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• pp.851-856
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• 2017

Research on the edge isolation process of typical polycrystalline silicon solar cells was carried out using laser scribing equipment. The voltage-current characteristics of the solar cell before and after laser scribing were analyzed using a solar simulator. Current density and efficiency increased as the fill factor of the solar cell remained constant after the laser scribing process. The efficiency of the solar cell can be increased in a short time by the edge isolation process performed via a laser scribing process. The polycrystalline silicon solar cell was made into a series electrode, and the efficiency of the solar cell increased because the width of the solar cell was narrowed and the active region was widened by the laser scribing process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.154-159
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• 1995

To achieve a high aspect ration of metal contact, buried contact solar cell scribe the silicon surface using laser. The Q-switched NdLYAG laser which has 1.064$\mu\textrm{m}$ wavelength use for silicon scribing with 25~40$\mu\textrm{m}$ width and 20~200$\mu\textrm{m}$ depth capabilities. The 2~3% shading losses are very low campared to the screen printing solar cell. In this paper, we investigate the silicon scribing theory and pratice, scribing system for BCSC processing.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2003.05a
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• pp.56-59
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• 2003

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5748-5755
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• 2015

Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.104-110
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• 2015

LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.56-62
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• 2019

The high-precision laser scriber carries out scribing alumina ceramic substrates for manufacturing ultra-small chip resistors. The ceramic substrates are loaded, aligned, scribed, transferred, and unloaded. The entire process is fully automated, thereby minimizing the scribing cycle time of the ceramic substrates and improving the throughput. The scriber consists of the laser optical system, pick-up module of ceramic substrates, pre-alignment module, TH axis drive work table, automation module for substrate loading / unloading, and high-speed scribing control S/W. The loader / unloader unit, which has the greatest influence on the scribing cycle time of the substrates, carries the substrates to the work table that carries out the cutting line work by driving the X and Y axes as well as by adsorbing the ceramic substrates. The loader / unloader unit consists of the magazine up / down part, X-axis drive part for conveying the substrates to the left and right direction, and the vision part for detecting the edge of the substrate for the primary pre-alignment of the substrates. In this paper, the laser scribing machining simulation is performed by applying the instrument mechanism of each component module. Through this study, the scribing machining process is first verified by analyzing the process operation and work area of each module in advance. In addition, the scribing machining process is optimized by comparing and analyzing the scribing cycle time of one ceramic substrate according to the alignment stage module speed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.4
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• pp.291-296
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• 2020

The high power of a shingled photovoltaic module can be attributed to its low cell-to-module loss. The production of high power modules in limited area requires high efficiency solar cells. Shingled photovoltaic modules can be made by divided solar cells, which can be produced by the laser scribing process. After dividing the 21% PERC cell using laser scribing, the efficiency decreased by approximately 0.35%. However, there was no change in the efficiency of the solar cell having relatively lower efficiency, because the laser scribing process induce higher heat damages in solar cells with high efficiency. To prove this phenomena, the J₀ (leakage current density) of each cell was analyzed. It was found that the J₀ of 21% PERC increased about 17 times between full and divided solar cell. However, the J₀ of 20.2% PERC increased only about 2.5 times between full and divided solar cell.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.12
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• pp.2218-2224
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• 2010

Dye-sensitized solar cell (DSC) is a promising alternative solar cell to the conventional silicon solar cell due to several advantages. Development of large scale module is necessary to commercialize the DSC in the near future. A scribing technology of the transparent conductive oxide (TCO) is one of the important technologies on the fabrication of DSC module. A quality of the scribed line on the TCO has a decisive effect on the efficiency of DSC module. Among several scribing technologies, the fiber laser is a suitable for scribing the TCO more precisely and accurately because of their own characteristics. In this study, we try to improve the quality of the TCO scribed line by using the fiber laser. Consequently, the operating parameter of fiber laser is optimized to get the TCO scribed line with good quality. And the fiber laser scribing technology of the TCO is applied to the fabrication of the DSC with optimal operating parameter, operating current 3900mA. As a result, the current density and fill factor are improved and the total efficiency is increased because the internal resistances of DSC such as TCO sheet resistance and the resistance concerned to the electron movement in the $TiO_2$ are reduced. This is analyzed by the electrochemistry impedance spectroscopy (EIS) and the equivalent circuit model of the DSC.