• 제목/요약/키워드: Laser scanning system

검색결과 393건 처리시간 0.027초

비접촉식 진동측정 장치를 이용한 정밀 스테이지의 진동특성 평가시험 (Vibration experiment of precision stage that use laser vibrator)

  • 이재우;이강욱;임홍재
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 추계학술대회논문집
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    • pp.1224-1230
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    • 2007
  • In this study, a new modal test method is presented to evaluate vibration characteristic of the nano imprint stage system. Since it is difficult to measure vibration level without contacting the machine component, non contacting modal test method, laser scanning system is ultrared. Finite element analysis results are compared with the modal test results.

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Powder Bed Fusion 시스템의 개발 및 소결 공정 특성에 관한 연구 (Study on the Development and Sintering Process Characteristics of Powder Bed Fusion System)

  • 안영진;배성우;김동수;김재열
    • 한국정밀공학회지
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    • 제32권9호
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    • pp.773-779
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    • 2015
  • The laser Powder Bed Fusion (PBF) system is currently recognized as a leading process. Due to the various materials employed such as thermoplastic, metal and ceramic composite powder, the application's use extends to machinery, automobiles, and medical devices. The PBF system's surface quality of prototypes and processing time are significantly affected by several parameters such as laser power, laser beam size, heat temperature and laminate thickness. In order to develop a more elaborate and rapid system, this study developed a new PBF system and sintering process. It contains a 3-axis dynamic focusing scanner system that maintains a uniform laser beam size throughout the system unlike the $f{\theta}$ lens. In this study, experiments were performed to evaluate the effects of various laser scanning parameters and fabricating parameters on the fusion process, in addition to fabricating various 3D objects using a PA-12 starting material.

다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구 (A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods)

  • 송춘삼;지현식;김주한;김종형;안효석
    • Journal of Welding and Joining
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    • 제26권3호
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    • pp.30-36
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    • 2008
  • A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

CO2 레이저 빔을 이용한 TFT-LCD 도광판의 패턴 제작에 관한 연구 (Fabrication of Grooved Pattern for the Light Guide Plate of TFT-LCD with CO2 Laser)

  • 김경동;백창일;송철기;안성훈
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.147-150
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    • 2002
  • A light guide panel is an element of the LCD backlight module that is often used for the display of compact electronic devices. In this study, a laser marking system is proposed to fabricate light guide panel, which can be replaced of other manufacturing methods such as silk printing, stamping, and v-cutting methods. The objectives of this research are the establishment of laser marking system, evaluation of laser marking parameters, understanding marking process, application to PMMA, reliability test and quality inspection. A 50W $CO_2$ laser (CW) was used to perform different experiments in which, the influence of some processing parameters (average power, scanning speed) on the geometry and quality of groove pattern was studied. The width of the etched grooves increases with increasing a laser power and decreasing a scan speed. In order to analyze surface characteristics and optical properties (luminance, uniformity), SEM photography and BM7 (luminance measuring system) were used. As a result, the optimal conditions of the process parameters were determined.

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A study on the core technologies for industrial type digital 3D SFF system

  • Kim, Dong-Soo;An, Young-Jin;Kim, Sung-Jon;Choi, Byung-Oh;Lim, Hyun-Eui
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.2170-2174
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    • 2005
  • Selective Laser Sintering (SLS) is a useful rapid prototyping technique for the manufacture of three dimensional (3D) solid objects directly from a scanning data. A new approach called a Selective Multi-Laser Sintering (SMLS) system has been developed at Korea Institute Machinery & Materials (KIMM) as an industrial type SFFS. This SMLS machine is built with a frame, heaters, nitrogen supply part, laser system. This system uses the dual laser and 3D scanner made in $Solutionix^{TM}$ to improve the precision and speed for large objects. The three-dimensional solid objects are made of polyamide powder. The investigation on each part of SMLS system is performed to determine the proper theirs design and the effect of experimental parameters on making the 3D objects. The temperature of the system has a great influence on sintering the polymer. Because the stability of the powder temperature prevents the deformation of each layer, the controls of the temperature in both the system and the powders are very important during the process. Therefore, we simulated the temperature distribution of build room using the temperature analysis with ANSYS program. Selected radiant heater is used to raise temperature of powder to melting point temperature. The laser parameters such as scan spacing, scan speed, laser power and laser delay time affect the production the 3D objects too. The combination of the slow scan speed and the high laser power shows the good results without the layer curling. The work is under way to evaluate the effect of experimental parameters on process and to produce the various objects. We are going to experiment continuously to improve the size accuracy and surface roughness.

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레이저빔 마킹 조건에 따른 티타늄 표면특성 분석 (Analysis of Titanium Surface Characteristics according to Laser Beam Marking Conditions)

  • 신홍식
    • 융복합기술연구소 논문집
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    • 제3권2호
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    • pp.39-43
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    • 2013
  • Titanium has been used to satisfy various applications such as bio engineering, aerospace, electronics, automobile. Recently, micro fabrication technologies of metals such as titanium have been required to satisfy many conditions in various fields. To satisfy these demands, micro electrochemical process using laser marking can be an alternative method because it is one of the precision machining and efficient process. Micro electrochemical process using laser marking needs to accomplish form of the oxidized recast layer on metal surface by laser marking. The laser beam marking conditions such as average power, pulse repetition rate and marking speed should be properly selected to form oxidized recast layer. So, the characteristics of titanium surface according to laser marking conditions was investigated through SEM(scanning electron microscope), EDS(energy dispersive spectrometer) and surface roughness analysis.

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지상 레이저 스캐닝 기법에 의한 도로선형정보 추출 시스템 개발 (Development of Alignment Information Extraction System on Highway by Terrestrial Laser Scanning Technique)

  • 김진수
    • 한국지리정보학회지
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    • 제10권4호
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    • pp.97-110
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    • 2007
  • 레이저 스캐닝 기법은 새로운 위치정보 획득 수단으로 부각되고 있으며, 높은 위치정확도, 고밀도 자료 취득의 자동화 등으로 지오매틱스 분야를 비롯한 광범위한 분야에서 응용될 전망이다. 본 연구에서는 레이저 스캐닝 기법의 장점을 이용하여 도로의 기하정보를 정확히 해석하고, 이를 실무에 활용할 수 있는 시스템을 개발하였다. 도로선형정보 추출 시스템 개발을 위해, 도로 평면선형을 직선, 완화곡선, 원곡선 구간으로 자동 분리할 수 있는 알고리즘을 개발하였으며, 자동화되지 않은 이전의 방식에 비해 효율성을 높일 수 있었다. 그리고 도로의 평면 및 종단선형의 설계요소를 자동 추출하는 알고리즘을 개발하여 대상도로에 적용한 결과, 실용성이 높게 나타났으며, 도로선형 설계요소 추출에 관련한 기존 연구와 비교해 볼 때 더욱 정확한 값으로 결정되었다. 또한 추출된 설계요소를 이용하여 대상 도로에 대한 가상 주행 시뮬레이션을 수행하였으며, 이를 통해 지형과 구조물이 3차원적으로 조화되는 시각적 판단 자료를 제공할 수 있었고, 계절에 따른 결빙구간 판단 및 입체시거를 해석할 수 있는 자료 제공이 가능하다. 향후 도로에 관련한 다양한 자료의 체계적인 데이터베이스 구축과 웹기반의 운영프로그램을 개발함으로써, 효율적인 도로 유지 관리가 가능할 뿐만 아니라, 앞으로 있을 도로안전진단에 있어서 중요한 자료를 제공할 수 있을 것으로 기대된다.

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As-built modeling of piping system from terrestrial laser-scanned point clouds using normal-based region growing

  • Kawashima, Kazuaki;Kanai, Satoshi;Date, Hiroaki
    • Journal of Computational Design and Engineering
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    • 제1권1호
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    • pp.13-26
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    • 2014
  • Recently, renovations of plant equipment have been more frequent because of the shortened lifespans of the products, and as-built models from large-scale laser-scanned data is expected to streamline rebuilding processes. However, the laser-scanned data of an existing plant has an enormous amount of points, captures intricate objects, and includes a high noise level, so the manual reconstruction of a 3D model is very time-consuming and costly. Among plant equipment, piping systems account for the greatest proportion. Therefore, the purpose of this research was to propose an algorithm which could automatically recognize a piping system from the terrestrial laser-scanned data of plant equipment. The straight portion of pipes, connecting parts, and connection relationship of the piping system can be recognized in this algorithm. Normal-based region growing and cylinder surface fitting can extract all possible locations of pipes, including straight pipes, elbows, and junctions. Tracing the axes of a piping system enables the recognition of the positions of these elements and their connection relationship. Using only point clouds, the recognition algorithm can be performed in a fully automatic way. The algorithm was applied to large-scale scanned data of an oil rig and a chemical plant. Recognition rates of about 86%, 88%, and 71% were achieved straight pipes, elbows, and junctions, respectively.