• Title/Summary/Keyword: Laser process

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Effect of Process Parameters on Laser Weldability of AZ31 Magnesium Alloy (AZ31 마그네슘합금의 레이저 용접성에 미치는 공정변수의 영향)

  • Kim, Jong-Do;Kil, Byung-Lea;Lee, Jung-han
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.4
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    • pp.570-577
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    • 2008
  • Magnesium alloys are potentially useful as structural materials due to higher strength/weight ratio, heat conductivity and recyclability compared to other alloys. These alloys have attracted the interest of modern manufacturing such as the automobile, computer, communication and consumer electronic appliances industries. Hence welding techniques are required to be developed for these applications. Laser are known to be an excellent tool for them. This paper presents the laser weldability of AZ31 magnesium alloy with CW Nd:YAG laser. The low viscosity and surface tension of the melt pool make magnesium more difficult to weld than steel. As a result of this study, optimal process parameters could be obtained without weld defects. Also it was certain that cutting methods had influence on butt weldability.

LASER TEXTURING PROCESS FOR THE STRIP CASTING ROLL (스트립 캐스팅 공정 및 레이저를 이용한 롤 표면처리 방법)

  • Kim, Y.H.;Joo, M.G.;Park, C.M.;Choi, J.T.;Lim, Choong-Soo;Uh, Ji-Ho
    • Proceedings of the KIEE Conference
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    • 2001.07d
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    • pp.2383-2385
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    • 2001
  • Laser texturing process for the strip casting-roll is investigated and is realized using PC system and Argon Ion Laser. This laser system can imprint any dimple of patterns on the roll-surface with the resolution of ${\mu}m$ unit.

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Analysis of Laser Control Effects for Direct Metal Deposition Process

  • Choi Joo-Hyun;Chang Yoon-Sang
    • Journal of Mechanical Science and Technology
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    • v.20 no.10
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    • pp.1680-1690
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    • 2006
  • As a promising and novel manufacturing technology, laser aided direct metal deposition (DMD) process produces near-net-shape functional metal parts directly from 3-D CAD models by repeating laser cladding layer by layer. The key of the build-up mechanism is the effective control of powder delivery and laser power to be irradiated into the melt-pool. A feedback control system using two sets of optical height sensors is designed for monitoring the melt-pool and real-time control of deposition dimension. With the feedback height control system, the dimensions of part can be controlled within designed tolerance maintaining real time control of each layer thickness. Clad nugget shapes reveal that the feedback control can affect the nugget size and morphology of microstructure. The pore/void level can be controlled by utilizing pulsed-mode laser and proper design of deposition tool-path. With the present configuration of the control system, it is believed that more innovation of the DMD process is possible to the deposition of layers in 3-D slice.

Study on a New ACF Bonding Methods in LCD Module Using a High Power Diode Laser (다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구)

  • Ryu K. H.;Seon M. H.;Nam G. J.;Kwak N. H.
    • Laser Solutions
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    • v.8 no.3
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    • pp.21-26
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    • 2005
  • A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

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Improvement of Reproducibility in Selective Electrodeposition Using Laser Masking and DC Voltage (레이저 마스킹과 직류전원을 이용한 선택적 전해도금의 재현성 개선)

  • Shin, Hong Shik
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.1
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    • pp.36-41
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    • 2016
  • A method is proposed for the improvement of deposition reproducibility in the selective electrodeposition process using laser masking and DC voltage. Selective electrodeposition using laser masking and DC voltage can achieve a deposited layer with micro patterns. However, selective electrodeposition using laser masking and DC voltage have a critical problem: the lack of reproducibility in selective deposition. The reproducibility of selective electrodeposition can be improved by a new process that consists of laser masking, two-step electro-deposition, laser scribing, and ultrasonic cleaning. The experiments in this study show that the reproducibility of selective deposition can be successfully improved by the combination of two-step electrodeposition and laser scribing.

Monitoring of plasma and spatter with photodiode in $CO_2$ laser welding (고출력 $CO_2$ 레이저 용접시 포토 다이오드를 이용한 플라즈마와 스패터 모니터링)

  • 박현성;이세헌;정경훈;박인수
    • Laser Solutions
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    • v.2 no.1
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    • pp.30-37
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    • 1999
  • Laser-welded Tailored Blank is the hottest thing in many automobile companies. But they demand on weld quality, reproducibility, and formability. So it is the great problem of automation of laser welding process. Therefore, it is requested to construct on-line process monitoring system on high accuracy. The light which is emitted from plasma and spatter in laser welding was detected by photo-diodes. It was found that the light intensity depends on welding speed. laser power, and flow rate of assist gas. The relationship between the plasma and spatter and the weld quality can be used for on-line laser weld monitoring systems.

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Excimer laser micromachining of silicon in liquid phase (액상에서의 엑시머 레이저 실리콘 미세가공)

  • Jang, Deok-Suk;Kim, Dong-Sik
    • Laser Solutions
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    • v.11 no.1
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    • pp.12-18
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    • 2008
  • Laser micromachining is a promising technique to fabricate the micro-scale devices. However, there remains important challenges to reducethe redeposition of ablated materials around the laser irradiated zone and to get a smooth surface, especially for metal and semiconductor materials. To achieve the high-quality micromachined devices, various methods have been developed. Liquid-assisted micromachining can be a good solution to overcome the previously mentioned problems. During the laser ablation process, the liquid around the solid sample dramatically changes the ablation characteristics, such as ablation rate, surface profile, formation of debris, and so on. In this investigation, we conducted the laser micromachining of Si in various liquid environmental conditions, such as liquid types, liquid thickness. In addition, using nanoscale time-resolved shadowgraphy technique, we observed the ablation process in liquid environments to understand the mechanism of liquid-assisted laser micromachining.

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Micro patterning of conductor line by laser induced forward transfer(LIFT) (LIFT 방법에 의한 전도성 미세 패터닝 공정 연구)

  • 이제훈;한유희
    • Laser Solutions
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    • v.2 no.3
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    • pp.52-61
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    • 1999
  • The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

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Analysis of die strength for laser dicing (레이저 다이싱에 의한 die strength 분석)

  • Lee, Young-Hyun;Choi, Kyung-Jin;Bae, Sung-Chang
    • Proceedings of the KIEE Conference
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    • 2006.04a
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    • pp.327-329
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    • 2006
  • In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

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Experimental analysis of flow field for laser shock wave cleaning (레이저 충격파 클리닝에서 발생되는 유동장의 실험적 해석)

  • 임현규;장덕석;김동식
    • Laser Solutions
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    • v.7 no.1
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    • pp.29-36
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    • 2004
  • The dynamics of laser-induced plasma/shock wave and the interaction with a surface in the laser shock cleaning process are analyzed by optical diagnostics. Shock wave is generated by a Q-switched Nd:YAG laser in air or with N$_2$, Ar, and He injection into the focal spot. The shock speed is measured by monitoring the photoacoustic probe-beam deflection signal under different conditions. In addition, nanosecond time-resolved images of shock wave propagation and interaction with the substrate are obtained by the laser-flash shadowgraphy. The results reveal the effect of various operation parameters of the laser shock cleaning process on shock wave intensity, energy-conversion efficiency, and flow characteristics. Discussions are made on the cleaning mechanisms based on the experimental observations.

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