• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.135-139
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• 2015

We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of $5{\mu}m$ and conductivity of $4.2{\times}10^5S/cm$ (bulk Ag has a conductivity of $6.3{\times}10^5S/cm$) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.11
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• pp.108-115
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• 2007

We have designed a high transmission C-shaped aperture using finite differential time domain (FDTD) technique. The C-shaped aperture was fabricated in the aluminum thin film on a glass substrate using a focused ion beam (FIB) milling. Nano-size patterning was demonstrated with a vacuum contact device to keep tight contact between the Al mask and the photoresist. Using 405 nm laser, we recorded a 50 nm-size dot pattern on the photoresist with the aperture and analyzed the spot size dependent on the dose illuminated on the aperture.

• Journal of the Korean Society of Visualization
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• v.17 no.1
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• pp.69-77
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• 2019

This paper introduces microfluidic manipulation of microorganism by opto-electrokinetic technique, named rapid electrokinetic patterning (REP). REP is a hybrid method that utilizes the simultaneous application of a uniform electric field and a focused laser to manipulate various kinds and types of colloidal particles. Using the technique in preliminary experiments, we have successfully aggregated, translated, and trapped not only spherical polystyrene, latex, and magnetic particles but also ellipsoidal glass particles. Extending the manipulation target to cells, we attempted to manipulate saccharomyces cerevisiae (S. cerevisiae), the most commonly used microorganism for food fermentation and biomass production. As a result, S. cerevisiae were assembled and dynamically trapped by REP at arbitrary location on an electrode surface. It firmly establishes the usefulness of REP technique for development of a high-performance on-chip bioassay system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.38-43
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• 2019

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.886-888
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• 1998

By irradiating photoresist on Si or glass with $Ar^+$ (${\lambda}$=514 nm, CW) and Nd:YAG (${\lambda}$=266 and 532nm, pulse) laser beam, the photoresist was etched masklessly in air. Using a fourth harmonic Nd:YAG laser beam, the etching threshold of energy fluence was $25\;J/cm^2$ and the damage of substrate was appeared over $40\;J/cm^2$.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.889-891
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• 1998

Copper films have been deposited on glass substrate via a thermal decomposition of copper(II) formate using a focused $Ar^+$ laser emitting at 514 nm. The growth kinetics of these Cu films was investigated as a function of laser power and scan speed which varied in the range of 70-150 mW and 0.1-20 mm/s, respectively. The resistivity of the copper films was a factor of about 20 higher than· that of bulk value, but the resistivity decreased due to changes in morphology and porosity of the deposit after annealing at $300^{\circ}C$, 5 min. and was about $10{\mu}{\Omega}cm$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.475-476
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• 2006

Self-assembled monolayers (SAMs) formed by the adsorption of alkanethiols, HS(CH2)nX, where X is an organic functional group, onto gold surfaces have attracted widespread interest as templates for the fabrication of molecular and biomolecular microstructures. Previously photopatterning has been thought of as being restricted to the micron scale, because of the well-known diffraction limit. So, we have explored a novel approach to nanofabrication by utilizing a femtosecond laser.

• Journal of the Optical Society of Korea
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• v.9 no.3
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• pp.92-94
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• 2005

We present a novel method for three-dimensional optical memory and microchannel embedded in fused silica glass. Three-dimensional dot patterning with a femtosecond laser pulse and observation with optical microscope are performed. Dot patterns are created by use of a 0.42 N.A. objective to focus 100 fs laser pulses inside the material. We demonstrate data storage with $2{\mu}m$ dot pitch and $7{\mu}m$layer spacing $(36 Gbit/cm^3)$. A three-dimensional microchannel acting as microfluidic and microoptical components is directly fabricated inside a silica glass. The optical micrographs of the microchannel are obtained by a digital camera of a microscope.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.11
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• pp.1135-1140
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• 2012

Two-step metallization processes have been proposed to achieve high-efficiency silicon solar cells, where the front-side grids are formed by silver plating after the formation of a nickel seed layer with a mask. Because the conventional mask patterning process is performed by an expensive selective printing method using either UV resist or phase change ink, however, the combination of a simple coating and laser-selective ablation processes is proposed in this study as an alternative means. As a masking material, the solar cell wafer was coated with either inexpensive wax having a low melting temperature or a fluorocarbon solution, and then, an electrode image was patterned by selectively removing the masking material using the laser. It was found that the fluorocarbon coating was not only superior to the wax coating in terms of pattern uniformity but it also increased the efficiency of the solar cell by 0.16%, as confirmed by statistical f and t tests.