• 제목/요약/키워드: Laser material Processing

검색결과 241건 처리시간 0.027초

능동적 다중 펄스 중첩법(AMPS)을 적용한 펄스형 $CO_2$ 레이저의 펄스 성형에 대한 연구 (A study on the pulse forming of pulsed $CO_2$ laser using active multi-pulse superposition)

  • 정현주;박성준;정용호;송건주;김희제;김휘영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1631-1633
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    • 2001
  • In manufacturing processes, various and suitable pulse shapes are required for the purpose of material processing and the pulseshape is regarded as a dominant factor due to the specific property of processing materials. Therefore, in this study, a variable pulse width, high duty cycle Pulse Forming Network(PFN) is constructed by time sequently. The power supply for this experiment consists of three switching circuits. The PFN elements operate at low voltage and drive the primary of HV leakage transformer. The secondary of the transformer has a full-wave rectifier, which passes the pulse energy to the load in a continuous sequence of properly phased and nested increments. We investigated laser pulse width as various delay time among three switching circuit. As a result, we tan obtain various laser pulse width from about 4ms to 10ms. The maximum laser pulse width obtained at this experiment was about 10ms at delay time of 4ms among each switching circuit.

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이차전지 소재용 구리의 파이버 레이저 용접 특성에 관한 연구 (Study on Fiber Laser Welding Characteristics of Copper for Secondary Battery Material)

  • 박은경;이가람;이현중;유영태
    • 한국레이저가공학회지
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    • 제17권3호
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    • pp.1-9
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    • 2014
  • In this study, we analyzed fiber laser welding for the pure copper thin plates in a series of secondary lithium-ion batteries; and performed the experiment for the purpose of the preceding study to replace bolt joints method the with the laser welding method. We have changed the peak power of the laser from 5 to 6kW, the pulse duration by 4, 6, 8, and 10ms, the frequency by 10, 12, 16, and 25Hz, and the focal position by -3, 0, and +3. As a result, when the focal position is at +3, the peak power is 5kW, and the pulse duration and the Frequency are 4ms and 25Hz, respectively, we obtain 2.1 and 2.5 times better tensional strengths, respectively, than the highest values of tensional strengths obtained with the focal positions at 0 and -3.

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펄스 Nd:YAG 레이저를 이용한 모터용 스테이터 적층코어의 용접특성 [II] - 용접결함의 형성 메커니즘 규명 - (The Weldability of Laminated Stator Core for Motor by Pulsed Nd:YAG Laser [II] - Investigation of Mechanism on Formation of Weld Defect -)

  • 김종도;길병래;이창제
    • Journal of Advanced Marine Engineering and Technology
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    • 제30권5호
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    • pp.636-644
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    • 2006
  • Recently, there were some successful examples that the laser welding was introduced into production line. However, the spread of laser welding is not sufficient in many industries. There are several reasons why it is difficult to penetrate the laser welding into production lines. Because it is different from reflection, absorption and permeation of laser beam according to material and surface condition. Moreover, there are significant problems in processing such as absorption and scattering of beam by the induced plasma or plume. Therefore, understanding of mechanism on formation of weld defect in laser welding of the laminated core for motor is very important. In this paper, it was analyzed in terms of materials which was source of defect in laser welding and conventional arc welding. As a results of analysis, insulation coating film of the laminated core was judged to main factor of weld defect. it could be well aware as tracing carbon volume, and it was deduced that weld defect by insulation coating film was caused by difference of mechanism between the two heat sources.

집속 아르곤 이온 레이저 빔을 이용한 실리콘 기판의 식각 (Etching of Silicon Wafer Using Focused Argon lon Laser Beam)

  • 정재훈;이천;박정호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권4호
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    • pp.261-268
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    • 1999
  • Laser-induced thermochemical etching has been recognized as a new powerful method for processing a variety of materials, including metals, semiconductors, ceramics, insulators and polymers. This study presents characteristics of direct etching for Si substrate using focused argon ion laser beam in aqueous KOH and $CCl_2F_2$ gas. In order to determine process conditions, we first theoretically investigated the temperature characteristics induced by a CW laser beam with a gaussian intensity distribution on a silicon surface. Major process parameters are laser beam power, beam scan speed and reaction material. We have achieved a very high etch rate up to $434.7\mum/sec$ and a high aspect ratio of about 6. Potential applications of this laser beam etching include prototyping of micro-structures of MEMS(micro electro mechanical systems), repair of devices, and isolation of opto-electric devices.

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레이저 미세 가공 공정에서 광센서를 이용한 선폭 예측을 위한 통계적 모델의 개발 (Development of Statistical Model for Line Width Estimation in Laser Micro Material Processing Using Optical Sensor)

  • 박영환;이세헌
    • 한국정밀공학회지
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    • 제22권7호
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    • pp.27-37
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    • 2005
  • Direct writing technology on the silicon wafer surface is used to reduce the size of the chip as the miniature trend in electronic circuit. In order to improve the productivity and efficiency, the real time quality estimation is very important in each semiconductor process. In laser marking, marking quality is determined by readability which is dependant on the contrast of surface, the line width, and the melting depth. Many researchers have tried to find theoretical and numerical estimation models fur groove geometry. However, these models are limited to be applied to the real system. In this study, the estimation system for the line width during the laser marking was proposed by process monitoring method. The light intensity emitted by plasma which is produced when irradiating the laser to the silicon wafer was measured using the optical sensor. Because the laser marking is too fast to measure with external sensor, we build up the coaxial monitoring system. Analysis for the correlation between the acquired signals and the line width according to the change of laser power was carried out. Also, we developed the models enabling the estimation of line width of the laser marking through the statistical regression models and may see that their estimating performances were excellent.

레이저를 이용한 유리절단의 유한요소해석 (Finite Element Analysis for Breaking of Glass Using Laser)

  • 조해용;김관우;남기정;이제훈;서정
    • 한국레이저가공학회지
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    • 제9권1호
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    • pp.9-16
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    • 2006
  • Glass is one of brittle materials. Generally, brittle material is weak for tensile stress but strong for compression stress. Laser breaking of glass used this brittle characteristics. Laser breaking of glass was simulated to optimize breaking condition by using commercial FEM code MARC which is applicable to thermo-mechanical coupling analysis. Various shapes of heat sources were applied to the analysis and the distance between heating and cooling source were varied for each simulation. The shapes of heat sources were circle, single and double ellipse and the distance was varied from 0mm to 30mm. Moving heat sources were designed on the basis of experimental condition. As a result, double elliptic shape of heat source was the most suitable among them in laser breaking of glass. And it should be useful to determine optimal condition of laser breaking for glass.

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펄스형 Nd:YAG 레이저를 이용한 FTO 식각에 대한 연구 (A Study on the Scribing of FTO using Pulsed Nd:YAG Laser)

  • 김희제;박성준;손민규;이동길;이경준
    • 전기학회논문지
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    • 제57권8호
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    • pp.1407-1411
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    • 2008
  • In material processing, a laser system with optimal laser parameters has been considered to be significant. Especially, the laser scribing technology is thought to be very important for fabricating DSSC(Dye sensitized solar eel!) modules with good quality. Moreover, the $TEM_{00}$ mode laser beam is the most dominant factor to decide the IPCE(Incident photon to current conversion efficiency) characteristics. In order to get the $TEM_{00}$ mode, a pin-hole is inserted within a simple pulsed Nd:YAG laser resonator. And the spatial field distribution is measured by using three size pin-hole diameters of 2.0, 6.0mm respectively. At that moment, each case has the same laser beam energy by adjusting the discharge voltage and pps(pulse per second). From those results, it is known that the pin-hole size of 2.0mm has the perfect $TEM_{00}$ mode. In addition, at the charging voltage of 1000V, 10pps and the feeding speed of 1.11mm/sec, the SEM photo of FTO(Fluorine-doped tin oxide) thin film layers shows the best scribing trace.

질화규소 세라믹의 레이저 예열선삭에 관한 연구 (II) - 예열선삭된 SSN 및 HIPSN 질화규소 세라믹의 표면특성 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (II) - Surface Characteristics of LAM Machined SSN and HIPSN -)

  • 김종도;이수진;강태영;서정;이제훈
    • Journal of Welding and Joining
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    • 제28권5호
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    • pp.80-85
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    • 2010
  • This study focused on laser assisted machining (LAM) of silicon nitride ceramic that efficiently removes the material through machining of the softened zone by local heating. The effects of laser-assisted machining parameters were studied for cost reduction, and active application in processing of silicon nitride ceramics in this study. Laser assisted machining of silicon nitride allows effective cutting using CBN tool by local heating of the cutting part to the softening temperature of YSiAlON using by the laser beam. When silicon nitride is sufficiently preheated, the surface is oxidized and decomposed and then forms bloating, micro crack and silicate layer, thereby making the cutting process more advantageous. HIPSN and SSN specimens were used to study the machining characteristics. Higher laser power makes severer oxidation and decomposition of both materials. Therefore, HIPSN and SSN specimens were machined more effectively at higher power.

레이저 용접 테일러드 블랭크의 기본 성형특성 I : 인장변형 특성 (Forming Characteristics of Laser Welded Tailored Blanks I : Tensile Deformation Characteristics.)

  • 박기철;한수식;김광선;권오준
    • 소성∙가공
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    • 제7권1호
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    • pp.23-35
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    • 1998
  • In order to analyze the tensile deformation characteristics of laser welded tailored blanks. laser welded blanks of different thikness and strength combinations were prepared and tensile tests were done. The tensile elongation along the direction perpendicular to weld line of laser welded blanks was reduced as increasing the deformation restraining force (strength X thicknes) ratio between two welded sheets and fracture occurred at weaker side of base sheets if void ration of welded sheets and fracture occurred at weaker side of base sheets if void ratio of weld section was less than 45% The tensile elongation along weld line reached above 90% of the elongation of base material if welding was done perfectly. Total elongation along the direction perpendicular to weld line was able to be predicted by force equilibrium and power law behavior of base sheets and it was related with the deformation of stronger sheet and formability of weaker side.

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레이저 표면 경화 공정에서 다점 온도 모니터링을 통한 경화층 크기 예측 (Estimation of Hardened Layer Dimensions Using Multi-Point Temperature Monitoring in Laser Surface Hardening Processes)

  • 우현구
    • 제어로봇시스템학회논문지
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    • 제9권12호
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    • pp.1048-1054
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    • 2003
  • In laser surface hardening processes, the geometrical parameters such as the depth and the width of a hardened layer can be utilized to assess the hardened layer quality. However, accurate monitoring of the geometrical parameters for on-line process control as well as for on-line quality evaluation is very difficult because the hardened layer is formed beneath a material surface and is not visible. Therefore, temperature monitoring of a point of specimen surface has most frequently been used as a process monitoring method. But, a hardened layer depends on the temperature distribution and the thermal history of a specimen during laser surface hardening processing. So, this paper describes the estimation results of the geometric parameters using multi-point surface temperature monitoring. A series of hardening experiments were performed to find the relationships between the geometric parameters and the measured temperature. Estimation results using a neural network show the enhanced effectiveness of multi-point surface temperature monitoring compared to one-point monitoring.