• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.397-401
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• 2003

In this work, diamond turning process is used to produce mirror surface on a Al cone. The Al cone as used as a mirror which can reflect a laser beam without scattering and, hence, it is critical to minimize the surface roughness of a Al cone. During diamond turning, feedrate and tool nose radius are changed to investigate characteristics of the ultra precision machined surface of a Al cone. A laser beam of 633 nm is applied to examine the effect of surface roughness on the characteristics of reflectivity. It is found that surface roughness is not significantly affected by feedrate. The main factor influencing surface roughness is tool nose radius. The line patterns of reflected laser beams show that the minimum surface roughness of 0.08 $\mu\textrm{m}$ (Ra) is required to avoid scattering phenomena of reflectivity.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.4
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• pp.1-7
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• 2008

Fine grained superplastic Zn-22%Al alloy was extruded using a laser machined micro-die to produce a micro-gear shaft. Extrusion process was conducted under a constant pressure at constant temperatures ranging from 503 to 563K. Laser machining was capable to machine a micro-die with close tolerances and adequate surface quality. The extrusion rate increased with extrusion load under constant extrusion temperature. The rate reached a steady state and became constant after a certain period. There was a small instantaneous stroke on application of the load and then a very brief primary stage which preceded steady-state flow. The micro-extrusion process was proven to produce a micro-gear shaft successfully using a fine grained superplastic Zn-22%Al alloy.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.145-152
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• 2004

This paper proposed efficient manufacturing system using the OMM (on-machine measurement) system. The OMM system is software based 3D modeler for inspection on machine and it is interfaced tool machine with RS232C. The software is composed of two inspection modules that one is touch probe operating module and the other is laser displacement sensor operating module. The module for touch probe has need of inspection feature that extracted it from CAD data. Touch probe moves to workpiece by three operating modes as follows: manual, general and automatic mode. The operating module of laser displacement sensor is used inspection for profile and very small hole. An Advantage of this inspection method is to be able to execute on-line inspection during machining or after it. The efficiency of proposed system which can predict and definite the machining errors of each process is verified, so the developed system is applied to inspect the mold-base(cavity, core).

• Korean Journal of Optics and Photonics
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• v.27 no.4
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• pp.127-132
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• 2016

In this paper, a trench structure was fabricated by femtosecond-laser machining to eliminate thermal crosstalk in a multichannel variable optical attenuator (VOA), to prevent decreasing attenuation efficiency of the VOA. Trenches of a variety of widths and depths were fabricated on the VOA chips by femtosecond-laser processing. After the machining, attenuation according to current change was observed in each VOA chip module with trenches. As a result, we could observe high responsivity of attenuation and low power consumption, and that the heat of each channel barely influenced other channels.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.56-62
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• 2019

The high-precision laser scriber carries out scribing alumina ceramic substrates for manufacturing ultra-small chip resistors. The ceramic substrates are loaded, aligned, scribed, transferred, and unloaded. The entire process is fully automated, thereby minimizing the scribing cycle time of the ceramic substrates and improving the throughput. The scriber consists of the laser optical system, pick-up module of ceramic substrates, pre-alignment module, TH axis drive work table, automation module for substrate loading / unloading, and high-speed scribing control S/W. The loader / unloader unit, which has the greatest influence on the scribing cycle time of the substrates, carries the substrates to the work table that carries out the cutting line work by driving the X and Y axes as well as by adsorbing the ceramic substrates. The loader / unloader unit consists of the magazine up / down part, X-axis drive part for conveying the substrates to the left and right direction, and the vision part for detecting the edge of the substrate for the primary pre-alignment of the substrates. In this paper, the laser scribing machining simulation is performed by applying the instrument mechanism of each component module. Through this study, the scribing machining process is first verified by analyzing the process operation and work area of each module in advance. In addition, the scribing machining process is optimized by comparing and analyzing the scribing cycle time of one ceramic substrate according to the alignment stage module speed.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• International Journal of CAD/CAM
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• v.6 no.1
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• pp.183-192
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• 2006

A CAD/CAM system has been developed for rapid prototyping (RP) of microfluidic devices based on excimer laser micromachining. The system comprises of two complementary softwares. One, the CAM tool, creates part programs from CAD models. The other, the Simulator Tool, uses a part program to generate the laser tool path and the 2D and 3D graphical representation of the machined microstructure. The CAM tool's algorithms use the 3D geometry of a microstructure, defined as an STL file exported from a CAD system, and process parameters (laser fluence, pulse repetition frequency, number of shots per area, wall angle), to automatically generate Numerical Control (NC) part programs for the machine controller. The performance of the system has been verified and demonstrated by machining a particle transportation device. The CAM tool simplifies part programming and replaces the tedious trial-and-error approach to creating programs. The simulator tool accepts manual or computer generated part programs, and displays the tool path and the machined structure. This enables error checking and editing of the program before machining, and development of programs for complex microstructures. Combined, the tools provide a user-friendly CAD/CAM system environment for rapid prototyping of microfluidic devices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.239-240
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• 2006

For longer than picosecond pulses, bulk damage inside defect-free dielectrics involves the heating and multiplication of spurious electrons by the incident laser beam and transfer of this energy to the lattice. The situation is quite different for femtosecond pulses which are shorter than the time scale for electron energy transfer to the lattice. Damage caused by these pulses is produced with smaller statistical uncertainty and is controllable on a microscopic scale. These properties can be exploited to produce laser devices such as arrays of damage dots for all optical memories with high data storage density or arrays of parallel grooves to form transmission gratings. In this work, we observed characteristic of the femtosecond laser machining in BK7 and fused silica.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.13-19
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• 2012

Ultra Precision Machining Techniques, such as manufacturing Micro Lens Array(MLA), off-axis mirror, $F-{\theta}$ lens for laser printer, are achieved, based on technologies in consequence of development of modern high-precision machining mechanism. Above all, FTS(Fast Tool Servo) and STS(Slow Tool Servo) are more innovative technologies for reducing time and development costs. In this paper, it is described that MLA machining technique by FTS, off-axis mirror machining technique by STS, optics for observing space, and development of infrared aspheric lens for a thermal imaging microscope.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.