• Laser Solutions
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• v.17 no.4
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• pp.1-6
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• 2014

Femtosecond laser induced shock generation in water and vitreous humor of enucleated porcine eyeball was investigated. When focusing the femtosecond laser into the liquid mediums, the acoustic waves with a frequency of about 15.6kHz could be observed by using wide-band microphone. The amplitude of the acoustic signals from water has attained a maximum under a laser power of about 5mW. Further increment of the power results in a decrement of the acoustic signals due to nonlinear optical process including filamentation of laser beam. We have further investigated the effect of femtosecond laser induced acoustic waves by applying the laser pulse into enucleated porcine eyeball. The comparative studies on both healthy and diseased eyeballs led us propose that the femtosecond laser pulses could be utilized as a novel tools for treatment of partially detached retina layers from their choroid structures.

• Laser Solutions
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• v.5 no.2
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• pp.9-15
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• 2002

Basic principles and unique characteristics of laser-induced shock cleaning have been described compared to a conventional laser cleaning method and the removal of small tungsten particles from silicon wafer surfaces was attempted using both methods. It was found that the conventional laser cleaning was not feasible to remove the tungsten particles whereas a successful removal of the particles was carried out by the laser-induced shock waves. From the quantitative analysis using a surface scanner, the average removal efficiency of the particles was more than 98% where smaller particles were slightly more difficult to remove probably due to the increased adhesion force with a decrease of the particle size. It was also seen that the gap distance between the laser focus and the wafer surface is an important processing parameter since the removal efficiency is strongly dependent on the gap distance.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.05a
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• pp.21-24
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• 2002

• Laser Solutions
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• v.6 no.3
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.