• 비파괴검사학회지
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• 제21권2호
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• pp.163-168
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• 2001

접착제와 리벳으로 접합된 항공기 판재의 접합부는 접합 불량, 크랙, 피로 결함이나 부식등에 의해 손상되고 열화될 수 있으며 이런 결함을 전 영역에 걸쳐서 신속하고도 신뢰성 있게 검사하는 것은 항공기 안전을 위해 매우 중요하다. 본 연구에서는 이를 위해 항공기용 알루미늄 판재의 랩 스플라이스 접합 연결부의 접합 품질을 비접촉 방식으로 수행할 수 있는 초음파 비파괴 평가법을 제안한다. 여기서는 레이저를 이용해 램파를 발생시키고 비접촉식 트랜스듀서 (공기정합 용량형 트랜스듀서)를 이용해 피치-캐치 방식으로 검사한다. 레이저 소스로는 Q-스위치된 Nd:YAG 레이저가 이용되며 배열 형태의 직선 슬릿을 갖는 마스크를 이용해 특정 모드의 램파를 발생시켜 이용하였다. 접합부의 한 쪽에서 발생된 레이저 여기 초음파는 판을 따라 전파하여 접합부를 지나 반대편에서 수신되고 수신된 신호의 특성과 접합부의 품질과의 관련성을 조사하였다.

• 비파괴검사학회지
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• 제32권4호
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• pp.388-392
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• 2012

본 연구에서는 표면파의 음향비선형 특성 측정을 위해 선 배열 레이저 빔을 이용하여 협대역의 표면파를 발생시키고 레이저 TWM(Two-Wave Mixing) 방식으로 수신하는 완전 비접촉 측정 방법이 도입되었다. 이 기술은 알루미늄 합금의 소성변형과 음향비선형 특성과의 상관성을 조사하는데 적용되었다. 그 결과, 재료의 소성변형에 따라 음향 비선형성이 비례적으로 증가하는 것으로 나타났으며, 이는 접촉식 PZT 탐촉자 수신 방법으로 측정한 결과와 동일한 경향이다.

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.70-71
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• 2005

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.224-225
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• 2005

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.2195-2197
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• 2000

In order to detect the ultrasonic that is generated by the partial discharge of the heavy electric machinery a Laser Doppler Vibrometer (LDV) is developed. A Michelson type interferometer which employed heterodyne signal process technique is built to measure the frequency and amplitude of vibration. The output signal of the fast photodetector is a frequency modulated signal centered at 40 MHz. The signal from the detector is amplified and converted to intermediate frequency centered at 1 MHz after mixing process. The voltage output that is proportional to the velocity of the moving surface(PZT) is obtained using PLL. The spectrum of the FM signal is analyzed and integration method was introduced to obtain amplitude information. This LDV can be used to measure the vibration of MEMS devices, automobiles, HDD and CDP.

• 비파괴검사학회지
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• 제35권6호
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• pp.389-397
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• 2015

Recently, wave propagation imaging based on laser scanning-generated elastic waves has been intensively used for nondestructive inspection. However, the proficiency of the conventional software based system reduces when the scan area is large since the processing time increases significantly due to unavoidable processor multitasking, where computing resources are shared with multiple processes. Hence, the field programmable gate array (FPGA) was introduced for a wave propagation imaging method in order to obtain extreme processing time reduction. An FPGA board was used for the design, implementing post-processing ultrasonic wave propagation imaging (UWPI). The results were compared with the conventional system and considerable improvement was observed, with at least 78% (scanning of $100{\times}100mm^2$ with 0.5 mm interval) to 87.5% (scanning of $200{\times}200mm^2$ with 0.5 mm interval) less processing time, strengthening the claim for the research. This new concept to implement FPGA technology into the UPI system will act as a break-through technology for full-scale automatic inspection.

• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• 비파괴검사학회지
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• 제31권2호
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• pp.111-117
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• 2011

Vibration monitoring is required for reliable thermosonic testing to decide whether sufficient vibration is achieved in each test for the detection of cracks. From a practical point of view, a cheaper and convenient monitoring method is better for the application to real tests. Therefore, the performance of different sensors for vibration monitoring was investigated and compared in this study to find a convenient and acceptable measurement method for thermosonics. Velocity measured by a laser vibrometer and strain provide an equivalent HI when measured at the same position. The microphone can provide a cheaper vibration monitoring device than the laser and the heating index calculated by a microphone signal shows similar characteristics to that calculated from velocity measured by the laser vibrometer. The microphone frequency response shows that it underestimates high frequency components but it is applicable to practical tests because it gives a conservative value of HI.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.851-856
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• 2003

This paper proposes a single-mode Lamb-wave generation and detection system using a pulsed laser as a generator and an air-coupled transducer combined with the wavelet transform analysis, as the detector. The laser source with arrayed linear slits was used to generate Lamb-wave which is able to control the wavelength of Lamb-wave to be generated by changing the slits separation. An ari-coupled transducer was used to receive Lamb-wave, which can selectably receive a single mode of leaky Lamb wave by changing the oblique angle of transducer, since the leaky Lamb-wave has unique leaky-angle according to the mode. Also, the received signal was processed by wavelet transform for the analysis in domain of time-frequency. The theoretical dipersion curve and the experimetal result was compared to show good agreement.

• 한국음향학회지
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• 제38권4호
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• pp.459-466
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• 2019

투명한 PMMA (Poly methyl methacrylate) 기판 위에 탄소나노튜브(Carbon Nanotube, CNT)와 PDMS (Poly dimethylsiloxane)를 코팅한 복합체에 레이저 펄스를 조사하면 열탄성효과에 의해 수중에 강한 초음파가 발생한다. 본 논문에서는 그 초음파 발생과 관련한 열음향 이론을 정립하고, 가우시안 파형을 갖는 레이저 펄스를 두께가 $20{\mu}m$인 CNT/PDMS 복합체에 조사했을 때 어떤 파형의 초음파가 발생하는지를 시뮬레이션을 통해 파악하였다. 그 결과로부터 CNT/PDMS 복합체에서는 충격 초음파가 발생하며, 그 파의 형상은 복합체의 각종 물성 값이 ${\pm}20%$ 변하여도 크게 변하지 않는 것을 확인하였다. 그러나 정(+), 부(-)의 피크 값은 열팽창계수가 증가하거나 밀도, 열용량, 음속이 감소하면 증가하며, 열전도도에 대해서는 민감하게 변하지 않음을 알았다. 나아가, 직접 제작한 CNT/PDMS 복합체에서 방사되는 초음파의 측정 결과와 시뮬레이션 결과의 비교로부터 그 물성 값을 추정할 수 있었다.