• Title/Summary/Keyword: Laser cutting machine

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Development of a Quality Analysis Program for Laser Fusion Cutting (레이저 용융 절단 해석 프로그램 개발)

  • 이성환;민헌식
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.3
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    • pp.72-79
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    • 2002
  • Though the laser cutting process is increasingly used in industry, a process automation and systematic database is still yet to be developed. In this study, as the fundamental step toward the construction of a reliable process expert system, a laser cutting quality monitoring/analysis system is developed based on simulations and experimental results. The relations between laser process parameters and laser cutting surface quality parameters such as kerf geometry, striation, surface roughness and dross formation are characterized and analyzed. A graphical user interface is used to visualize the results.

Application of $CO_2$ High Power Laser to Cutting of Thick Steel Plates

  • Nagata, Yozo
    • Proceedings of the KWS Conference
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    • 1992.10a
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    • pp.21-31
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    • 1992
  • CO2 laser had enabled accurate and effective cutting. But its application has been limited to thin and small parts. Development of a high power oscillator and oscillator built-in cutting machine have realized cutting of thick and large steel parts. This machine brings also possibility of fully automated cutting systems to practical steel parts such as for construction machinery.

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A Study on the Cutting Tool and Holder Deformation Prediction undergoing Laser-assisted Machining with Moving Heat Sources (이동열원을 고려한 레이저 보조가공에서 절삭공구와 홀더의 변형 예측에 관한 연구)

  • Jung, Jae-Won;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.9
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    • pp.127-134
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    • 2009
  • Laser-assisted machining uses primarily laser power to heat the local area before the material is removed. It not only efficiently reduces the cutting force during the manufacturing process but also improves the machining characteristics and accuracy with regard to difficult-to-machine materials. The prediction of relative deformations between the cutting tool and workpiece is important to improve the accuracy of machined components. This paper presents the deformation errors caused for a cylindrical workpiece by thermal effects in the laser-assisted machine tool using finite element method. The results can be used to increase the cutting accuracy by compensating thermal distortion prior to laser-assisted machining.

A Study on the Optimum Machining Conditions and Energy Efficiency of a Laser-Assisted Fillet Milling

  • Woo, Wan-Sik;Lee, Choon-Man
    • International Journal of Precision Engineering and Manufacturing-Green Technology
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    • v.5 no.5
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    • pp.593-604
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    • 2018
  • Laser-assisted machining (LAM) is known to be an effective and economical technique for improving the machinability of difficult-to-machine materials. In the LAM method, material is preheated using a laser heat source and then the preheated area is removed by following cutting tool. For laser-assisted turning (LAT), the configuration of the system is not complicated because laser irradiates from a fixed position. In contrast, laser-assisted milling (LAMill) system is not only complicated but also difficult to control because laser heat source must always move ahead of the cutting tool along a three dimensional (3D) tool path. LAMill is still early stage and cannot yet be used to machine finished products with 3D shapes. In this study, a laser-assisted fillet milling process was developed for machining 3D shapes. There are no prior studies combining fillet milling and LAMill. Laser-assisted fillet milling strategy was proposed, and effective depth of cut (EDOC) was obtained using thermal analysis. Experiments were designed using response surface method and cutting force prediction equations were developed using statistical analysis and regression analysis. The optimum machining conditions were also proposed, and energy efficiency of the LAMill was analyzed by comparing the specific cutting energy of conventional machining (CM) and LAMill.

A Study on Cutting Conditions and Finishing Machining of Si Material Using Laser Assisted Module (레이저 보조 모듈을 이용한 Si 소재의 절삭조건 및 보정가공에 관한 연구)

  • Young-Durk Park
    • Design & Manufacturing
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    • v.17 no.2
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    • pp.15-21
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    • 2023
  • In this study, a diamond turning machine and a laser-assisted machining module were utilized for the complex combined cutting of aspheric shapes and fine patterns on the surface of high-hardness brittle material, silicon. The analysis of material's form accuracy and corrective machining was conducted based on key factors such as laser output, rotational speed, feed rate, and cutting depth to achieve form accuracy below 1 ㎛ and surface roughness below 0.1 ㎛. The cutting condition and corrective machining methods were investigated to achieve the desired form accuracy and surface roughness. The rotational speed of the spindle and the linear feed rate of the diamond turning machine were varied in five stages for the cutting condition test. Surface roughness and form accuracy were measured using both a contact surface profilometer and a non-contact surface profilometer. The experimental results revealed a tendency of improved surface roughness with increased rotational speed of the workpiece, and the best surface roughness and form accuracy were observed at a feed rate of 5 mm/min. Furthermore, based on the cutting condition experiments, corrective machining was performed. The experimental results demonstrated an improvement in form accuracy from 0.94 ㎛ to 0.31 ㎛ and a significant reduction in the average value of the surface roughness curve from 0.234 ㎛ to 0.061 ㎛. This research serves as a foundation for future studies focusing on the machinability in relation to laser output parameters.

Development of Scribing Machine for Dicing of GaN Wafer (GaN 웨이퍼의 다이싱을 위한 스크라이빙 머신의 개발)

  • Cha, Young-Youp;Go, Gyong-Yong
    • Journal of Institute of Control, Robotics and Systems
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    • v.8 no.5
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    • pp.419-424
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    • 2002
  • After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

Monitoring of Laser Fusion Cutting Using Acoustic Emission (AE센서를 이용한 레이저 용융 절단 모니터링)

  • 이성환;민헌식;안선응
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.3
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    • pp.39-44
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    • 2002
  • As laser cutting process is widely used in industry, an automated on-line process control system has become very important. In this paper, development of a laser cutting monitoring system, which is regarded as the fundamental step toward automation of the process, is presented. Acoustic emission and an artificial neural network were used for the monitoring system. With given process Parameters including laser power and scanning speed the system can predict the suitability of laser beam for the cutting or a stainless steel (STS304) plate.

Optic Module for Laser Integrated Machine (레이저 복합가공기용 광학모듈의 제작)

  • Shin, Dong-Sig;Lee, Jae-Hoon;Suh, Jeong
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1475-1480
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    • 2007
  • In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

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Influence of Process Parameters on Characteristics of the Cut Surface for the Case of Cutting of CSP IN Sheet Using High Power CW Nd:YAG Laser (고출력 CW Nd:YAG 레이저를 이용한 CSP 1N 박판재 절단시 공정변수의 절단표면특성에 미치는 영향)

  • 안동규;김민수;이상훈;유영태;박형준
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.10a
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    • pp.286-291
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    • 2004
  • The objective of this research work is to investigate the influence of process parameters, such as power of laser, travel speed of laser and material thickness, on roughness and striation of the cut surface for the case of cutting of CSP 1N sheet using high power Nd:YAG laser with continuous wave(CW). In order to find the practical cutting region and the relationship between process parameters on the roughness and the striation, several laser cutting experiments are carried out. From the results of experiments, the allowable cutting region and an optimal cutting speed for each cutting condition have been obtained to improve the quality of the cut surface. In addition, it has been shown that the surface roughness is related to the number of striation and depth of valley of the cut surface.

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