• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.47-54
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• 2020

Integration of active and passive waveguides is an essential component of the photonic integrated circuit and its elements. Butt joint is one of the important technologies to accomplish it with significant advantages. However, it suffers from high optical loss at the butt joint junction and need of accurate process control to align both waveguides. In this study, we used beam propagation method to simulate an integrated device composed of a laser diode and spot size converter (SSC). Two SSCs with different mode properties were combined with laser waveguide and optical coupling efficiency was simulated. The SSC with larger near field mode showed lower coupling efficiency, however its far field pattern was narrower and more symmetric. Tapered passive waveguide was utilized for enhancing the coupling efficiency and tolerance of waveguide offset at the butt joint without degrading the far field pattern. With this technique, high optical coupling efficiency of 89.6% with narrow far field divergence angle of 16°×16° was obtained.

• Korean Journal of Optics and Photonics
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• v.23 no.3
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• pp.103-107
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• 2012

We investigate the dependence of the output of a mode locked Yb-doped fiber laser on incident intra-cavity intensity on a semiconductor saturable absorber mirror (SESAM). To vary the incident intra-cavity intensity, we change the beam spot size on a SESAM by varying the focal length of a lens installed in the front of the SESAM.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.663-664
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• 2006

In the electronic, medical, aerospace and automobile industries, many products and parts are manufactured by joining. Recently, as these get smaller, micro joining is becoming more and more important. In this study, micro wire-to-micro wire parallel joining was performed using single mode fiber laser. Maximum power of the fiber laser is 100 W. The CCD(Charge- Coupled Device, CCD) camera to observe the specimen was made up. The objective was applied to micro joining system to make a small spot size of laser beam. In order to control the target position, micro-multi-axis-stage was set up. This paper presents results for the single mode fiber laser joining of micro wires.

• Laser Solutions
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• v.14 no.2
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• pp.13-16
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• 2011

We fabricated the Fresnel zone plate using femtosecond laser lithography-assisted micro-machining, which is a combined process of nonlinear lithography and wet etching. We investigated the focusing properties by launching a 632.8nm wavelength He-Ne laser beam into the zone plate. The spot size of the primary focal point was $27{\mu}m$ and the intensity of focal point was 0.565W/$cm^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.473-476
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• 1997

Focused Ar ion laser beam can be utilized to fabricate microstructures on silicon substrate as well as other materials(e.g. such as ceramic). The laser using in this study is an argon ion laser with maximum power of 6 W, wavelength of 514 nm. This laser beam is focused by objectives with a high numerical aperture, a long working distance. We have achieved line width about 1 ${\mu}{\textrm}{m}$ with high scan speed. The resolution for Si machining is determined by the selectivity of the chemical reaction rather than the laser spot size. In this study, we have obtained the maximum etch rate of 434.7 ${\mu}{\textrm}{m}$/sec with high aspect ratio. The characteristics of etched groove was investigated by scanning electron microscope(SEM) and auger electron spectroscopy(AES). It is assumed that the technique using arson ion laser is applicab1e to fabricate microstructures.

• Korean Journal of Computational Design and Engineering
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• v.8 no.3
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• pp.150-156
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• 2003

Direct Metal Deposition (DMD) is a new additive process producing three-dimensional metal components or tools directly from CAD data, which aims to take mold making and metalworking in an entirely new direction. It is the blending of five common technologies: lasers, CAD, CAM, sensors and materials. In the resulting process, alternatively called laser cladding, an industrial laser is used to locally heat a spot on a tool-steel work piece or platform, forming a molten pool of metal. A small stream of powdered tool-steel metal is then injected into the metal pool to increase the size of the molten pool. By moving the laser beam back and forth, under CNC control, and tracing out a pattern determined by a computerized CAD design, the solid metal part is eventually built line-by-line, one layer at a time. DMD produces improved material properties in less time and at a lower cost than is possible with traditional fabrication technologies.

• Journal of the Korean Society for Nondestructive Testing
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• v.33 no.2
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• pp.160-164
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• 2013

A laser ultrasonic inspection system is a non-contact inspection device which generates and measures ultrasonics by using laser beam. A laser ultrasonic inspection system provides a high measurement resolution because the ultrasonic signal generated by a pulse laser beam has a wide-band spectrum and the ultrasonic signal is measured from a small focused spot of a measuring laser beam. In this study, galvanic corrosion phenomenon was measured by non-destructive and non-contact method using the laser. The case of mixed foreign material on the part of corrosion was assumed and laser ultrasonic experiment was conducted. Ultrasonic was generated by pulse laser from the back side of the specimen and ultrasonic signal was acquired from the same location of the front side using continuous wave laser and Confocal Fabry-Perot Interferometer(CFPI). The characteristic of the ultrasonic signal of exist foreign material part was analyzed and the location and size of foreign material was measured.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.346-351
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• 2018

Metal three-dimensional (3D) printing technologies are mainly classified as powder bed fusion (PBF) and direct energy deposition (DED) methods according to the method of application of a laser beam to metallic powder. The DED method can be used to fabricate fine and hard 3D metallic structures by applying a strong laser beam to a thin layer of metallic powder. The PBF method involves slicing 3D graphics to be a certain height, laminating metal powders, and making a 3D structure using a laser. While the DED method has advantages such as laser cladding and metallic welding, it causes problems with low density when 3D shapes are created. The PBF method was introduced to address the structural density issues in the DED method and makes it easier to produce relatively dense 3D structures. In this paper, thin lines were produced by using PBF 3D printers with stainless-steel powder of roughly $30{\mu}m$ in diameter with a galvano scanner and fiber-transferred Nd:YAG laser beam. Experiments were carried out to find the optimal conditions for the width of a line depending on the processing times, laser power, spot size, and scan speed. The optimal conditions were two scanning processes in one line structure with a laser power of 30 W, spot size of $28.7{\mu}m$, and scan speed of 200 mm/s. With these conditions, a minimum width of about $85.3{\mu}m$ was obtained.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.592-596
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• 2001

Near field technology makes it possible to overcome the diffraction limit of laser beam and create the small spot. Because of the small spot size, the pit size and track pitch can be decreased. So the high performance actuator is needed for near field recording system. And the light mass and the small form factor are also important properties of the NFR actuator in order to be used for hand held device. The purpose of this paper is the optimal design of the NFR coarse actuator to maximize actuating force. The structure of NFR coarse actuator is the same as HDD VCM actuator. The permeance method is used for modeling of the coarse actuator. The optimal result and the FEM simulation result are presented.